Kinetis KL26: 48MHz Cortex-M0+ 32-128KB Flash 32-64pin
... 1. All I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode connection to VDD. If VIN greater than VIO_MIN (= VSS-0.3 V) is observed, then there is no need to provide current limiting resistors at the pads. If this limit cannot be observed then a current limiting ...
... 1. All I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode connection to VDD. If VIN greater than VIO_MIN (= VSS-0.3 V) is observed, then there is no need to provide current limiting resistors at the pads. If this limit cannot be observed then a current limiting ...
Design of Ultra-Low-Power Analog-to-Digital Converters Dai Zhang
... prevalent ADC architectures due to its good tradeoffs among power consumption, conversion accuracy, and design complexity. To design an energy-efficient SAR ADC, an understanding of its error sources as well as its power consumption bounds is essential. This thesis analyzes the power consumption bou ...
... prevalent ADC architectures due to its good tradeoffs among power consumption, conversion accuracy, and design complexity. To design an energy-efficient SAR ADC, an understanding of its error sources as well as its power consumption bounds is essential. This thesis analyzes the power consumption bou ...
... with N the resolution of its phase accumulator. This characteristic is useful for the systems that need multiple clock frequencies with no integer relationship between them and they need to be changed rapidly and frequently [5]. In modern communication systems, DDFS seems to be an alternative to pha ...
General Aptitude
... Exp: When load is constant, we should see for what value of resistance current will be maximum and PR L max . ...
... Exp: When load is constant, we should see for what value of resistance current will be maximum and PR L max . ...
Institutionen för systemteknik Department of Electrical Engineering Precision Amplifier for Applications in
... The main sources for this work have been scientific articles. Most of them have been PDF-files downloaded from databases e.g. IEEE Xplore. Documentation of existing amplifiers and components used in the design have been downloaded from web pages of hardware manufacturers. PSPICE models for component ...
... The main sources for this work have been scientific articles. Most of them have been PDF-files downloaded from databases e.g. IEEE Xplore. Documentation of existing amplifiers and components used in the design have been downloaded from web pages of hardware manufacturers. PSPICE models for component ...
AN-589: Ways to Optimize the Performance of a Difference Amplifier
... Select resistors that have much tighter tolerance and accuracy. The more closely they are matched, the better the CMRR. As an example, if a CMRR of 90 dB from the above circuit is needed, then match resistors approximately to 0.02. Then the CMRR of the circuit is as good as some high precision in-am ...
... Select resistors that have much tighter tolerance and accuracy. The more closely they are matched, the better the CMRR. As an example, if a CMRR of 90 dB from the above circuit is needed, then match resistors approximately to 0.02. Then the CMRR of the circuit is as good as some high precision in-am ...
MAX220–MAX249
... Note 1: All devices are 100% production tested at TA = +25°C. All temperature limits are guaranteed by design. Note 2: VREF is defined as the average voltage of VREF1A and VREF1B. REF1B is usually connected to REF1A or GND. VSENSE is defined as VRS+ - VRS-. Note 3: The common-mode range at the low e ...
... Note 1: All devices are 100% production tested at TA = +25°C. All temperature limits are guaranteed by design. Note 2: VREF is defined as the average voltage of VREF1A and VREF1B. REF1B is usually connected to REF1A or GND. VSENSE is defined as VRS+ - VRS-. Note 3: The common-mode range at the low e ...
Design of a High Dynamic Range CMOS Variable Gain Amplifier for
... In the RF receiver of Figure 1.1, it is required to place a VGA between the filter and the analog to digital converter (ADC) to adjust the output signals from the low pass filter to the input signal level which is required by the ADC to operate properly [2]. The VGA is required to provide a wide ba ...
... In the RF receiver of Figure 1.1, it is required to place a VGA between the filter and the analog to digital converter (ADC) to adjust the output signals from the low pass filter to the input signal level which is required by the ADC to operate properly [2]. The VGA is required to provide a wide ba ...
MAX9918/MAX9919/MAX9920 -20V to +75V Input Range, Precision Uni-/Bidirectional, Current-Sense Amplifiers
... Junction-to-Ambient Thermal Resistance (θJA) ...........41°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal- ...
... Junction-to-Ambient Thermal Resistance (θJA) ...........41°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal- ...
Servay 7th Edition_Chapter33
... At point c, the current has reached its maximum value in the negative direction. The current and voltage are in step with each other because they vary identically with time. Because iR and DvR both vary as sin vt and reach their maximum values at the same time as shown in Active Figure 33.3a, they a ...
... At point c, the current has reached its maximum value in the negative direction. The current and voltage are in step with each other because they vary identically with time. Because iR and DvR both vary as sin vt and reach their maximum values at the same time as shown in Active Figure 33.3a, they a ...
BD00IA5MEFJ-LB
... ･Input capacitor CIN of VCC (VIN) should be placed very close to VCC(VIN) pin as possible, and used broad wiring pattern. Output capacitor COUT also should be placed close to IC pin as possible. In case connected to inner layer GND plane, please use several through hole. ・FB pin has comparatively hi ...
... ･Input capacitor CIN of VCC (VIN) should be placed very close to VCC(VIN) pin as possible, and used broad wiring pattern. Output capacitor COUT also should be placed close to IC pin as possible. In case connected to inner layer GND plane, please use several through hole. ・FB pin has comparatively hi ...
NVT2001; NVT2002 1. General description Bidirectional voltage level translator for open-drain and
... The pull-up resistor value needs to limit the current through the pass transistor when it is in the ON state to about 15 mA. This ensures a pass voltage of 260 mV to 350 mV. If the current through the pass transistor is higher than 15 mA, the pass voltage also is higher in the ON state. To set the c ...
... The pull-up resistor value needs to limit the current through the pass transistor when it is in the ON state to about 15 mA. This ensures a pass voltage of 260 mV to 350 mV. If the current through the pass transistor is higher than 15 mA, the pass voltage also is higher in the ON state. To set the c ...
AD5346 英文数据手册DataSheet 下载
... Buffer Control Pin. Controls whether the reference input to the DAC is buffered or unbuffered. Active Low Control Input. Updates the DAC registers with the contents of the input registers, which allows all DAC outputs to be simultaneously updated. LSB Address Pin. Selects which DAC is to be written ...
... Buffer Control Pin. Controls whether the reference input to the DAC is buffered or unbuffered. Active Low Control Input. Updates the DAC registers with the contents of the input registers, which allows all DAC outputs to be simultaneously updated. LSB Address Pin. Selects which DAC is to be written ...
Derivation of new double-input DC-DC converters using the building
... 2.5. Double-input buck-buck converter using H-bridge cells ......................................... 22 2.6. Different modes of operation of a double-input buck-buck converter using Hbridge cells ........................................................................................................ ...
... 2.5. Double-input buck-buck converter using H-bridge cells ......................................... 22 2.6. Different modes of operation of a double-input buck-buck converter using Hbridge cells ........................................................................................................ ...
SP310A 数据资料DataSheet下载
... the specifications of RS-232 and V.28 serial protocols. The devices are pin-to-pin compatible with popular industry standard pinouts. The SP233A / SP310A / SP312A offer 120kbps data rate under load, small ceramic type 0.1μF charge pump capacitors and overall ruggedness for comercial applications. Fe ...
... the specifications of RS-232 and V.28 serial protocols. The devices are pin-to-pin compatible with popular industry standard pinouts. The SP233A / SP310A / SP312A offer 120kbps data rate under load, small ceramic type 0.1μF charge pump capacitors and overall ruggedness for comercial applications. Fe ...
Tools - Infineon Technologies
... are selected using a set of equations. Different ballast operating frequencies and their respective voltages and currents are calculated. The inductor and capacitor values are obtained using equations (2) through (7). The results of these equations reveal the location of each operating frequency and ...
... are selected using a set of equations. Different ballast operating frequencies and their respective voltages and currents are calculated. The inductor and capacitor values are obtained using equations (2) through (7). The results of these equations reveal the location of each operating frequency and ...
ST8024L
... SO-28 small outline, package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 TSSOP-20 package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 TSSOP-28 package mechanical drawing . . . . . . . . . . . . . . . . . . . ...
... SO-28 small outline, package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 TSSOP-20 package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 TSSOP-28 package mechanical drawing . . . . . . . . . . . . . . . . . . . ...
QUESTION BANK FOR SYB Sc. ELECTRONICS
... 1. Determine power dissipation capability of 2N1701 transistor which has been heated with heat sink having θHS-A=θS-A=100c/w. Given TA=500C, TJ=2000C and θJ-c=70c/w θC-A=930c/w. 2. Determine power dissipation capability of 2N1701 transistor which has been heated with heat sink having θHS-A=θS-A=120c ...
... 1. Determine power dissipation capability of 2N1701 transistor which has been heated with heat sink having θHS-A=θS-A=100c/w. Given TA=500C, TJ=2000C and θJ-c=70c/w θC-A=930c/w. 2. Determine power dissipation capability of 2N1701 transistor which has been heated with heat sink having θHS-A=θS-A=120c ...
Integrating ADC
An integrating ADC is a type of analog-to-digital converter that converts an unknown input voltage into a digital representation through the use of an integrator. In its most basic implementation, the unknown input voltage is applied to the input of the integrator and allowed to ramp for a fixed time period (the run-up period). Then a known reference voltage of opposite polarity is applied to the integrator and is allowed to ramp until the integrator output returns to zero (the run-down period). The input voltage is computed as a function of the reference voltage, the constant run-up time period, and the measured run-down time period. The run-down time measurement is usually made in units of the converter's clock, so longer integration times allow for higher resolutions. Likewise, the speed of the converter can be improved by sacrificing resolution.Converters of this type can achieve high resolution, but often do so at the expense of speed. For this reason, these converters are not found in audio or signal processing applications. Their use is typically limited to digital voltmeters and other instruments requiring highly accurate measurements.