Download UM10395 UBA2014 evaluation board Rev. 2 — 16 September 2010 User manual

UM10395
UBA2014 evaluation board
Rev. 2 — 16 September 2010
User manual
Document information
Info
Content
Keywords
UBA2014, evaluation board, TL, CFL
Abstract
This user manual describes the UBA2014 evaluation board, which is
designed to be a flexible tool for demonstrating the many UBA2014
fluorescent tube driver applications.
UM10395
NXP Semiconductors
UBA2014 evaluation board
Revision history
Rev
Date
v.2
20100916
01
20091014
Description
•
•
Illustrations amended to new standard
Section 11 “Legal information” amended to include new items
First issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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User manual
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1. Introduction
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
This document describes the UBA2014 evaluation board. The board is designed to be a
flexible tool that demonstrates the many different applications that are possible with the
UBA2014 fluorescent tube driver. Please note that this board is not a complete ballast
design for fluorescent tubes. The default setup is made such that a T5 HE 35W
fluorescent lamp can be demonstrated.
2. Safety warnings
The board is intended as an evaluation board to build different TL and or CFL
applications. To optimize flexibility, almost no protection is built in (except for IC internal
protection). The board does not conform with any safety norm.
WARNINGS:
• Do not supply voltages to the board without a daughter board correctly inserted.
Failing to do so may damage the board.
• Always operate with burner (lamp) connected to the board and connected to the
resonant circuit. Failing to do so may damage the board.
• Many parts contain dangerous high voltages. It is necessary to take relevant safety
precautions before using this board.
• Do not touch any part of the board during or shortly after operation of the board.
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3. Board description
The board consists of two separate Printed-Circuit Boards (PCBs). The main board with
the resonant circuit and a small daughter board with the UBA2014 IC.
3.1 Daughter board
The daughter board contains the UBA2014 IC with the preheat, sweep and oscillator
capacitor, the VDD generation and some other low voltage components.
The daughter PCB can be easily replaced in case of damage. Care should be taken that
the board is inserted properly. Pin 11 has been removed from the daughter board to
prevent the board being inserted incorrectly.
019aaa720
Fig 1.
UM10395
User manual
Daughter board
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3.2 Main board
The main board has all the other necessary circuit to make a Tubular Lamp (TL) or
Compact Fluorescent Lamp (CFL) application. The board consists of the following:
•
•
•
•
•
•
DC and AC input connector
Dimming input
2 sockets for FETs
2 different transformers
Area for experiments
Connections for up to 4 burners.
019aaa721
Fig 2.
UBA2014/21 main board with UBA2014 daughter board inserted
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4. Schematics
The schematics of the daughter board with the UBA2014 IC can be found in Figure 3. The
settings for the oscillator and sweep are R1 = 33 kΩ (to pin IREF), C3 = 100 pF (to pin
CF) and C1 = 330 nF (to pin CT). This will provide a minimum oscillator frequency of
40.5 kHz and a preheat time of 1.8 s.
1
C1
2
A1
330 nF/16 V
2
CSW
220 nF/16 V
CF
1
1
C9
10 nF
2
1
R6
1 kΩ
2
C2
CT
1
C3
IREF
2
15
2
16
3
10
4
11
UBA2014
100 pF
1
R1
X1
1
Vref
2
33 kΩ
VREF
VDD
GND
14
CSP
CSN
GH
GL
8
C4
1
GL
2
100 nF
LVS
13
12
GH
FVDD
6
7
CSN
SH
9
5
CSN
CSP
Vref
LVS
SH
GH
PCS
Vbrg
GL
CSP
PCS
PCS
1
2
3
4
5
6
7
8
9
10
11
12
VDD
ACM
header 12
1
R2
240 kΩ
1
2
1
1
R3
240 kΩ
2
Vbrg
1
C8
1 μF/
25 V
2
V1
BAS29
V2
6.8 V
2
2
1
DNP
C5
2
1
1
V3
12 V
2
C7
5.6 nF/
50 V
2
1
C6
2
1
1 nF/500 V
V4
6.8 V
2
1
2
V5
2
PCS
33 kΩ
13.6 V
1
R7
BAS29
1
R4
2.2 Ω
2
2
R5
10 kΩ
1
1
C10
56 nF/
50 V
2
1
C11
100 nF
2
019aaa273
Fig 3.
Daughter board with UBA2014 circuit (version R1B)
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User manual
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NXP Semiconductors
UM10395
User manual
VDC
1 R20 2
X78 TP
X79 TP
X80 TP
X81 TP
X82 TP
X83 TP
X84 TP
X85 TP
X86 TP
1
CSN
1
1
CSP
2
1
Vref
3
1
LVS
4
1
SH
5
1
GH
6
1
PCS
7
1
Vbrg
8
1
GL
9
Rev. 2 — 16 September 2010
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1
X87 TP
GH
1
X88 TP
X120 TP
1
PCS_2021 13
R1
1
R35
56 kΩ
2
GL
1
R3
33 Ω
12
1
2
1
R36
56 kΩ
placed in header
D
X14
2
LVS
PCS_2021
1 R37 2
1 R38 2
0Ω
5.6 kΩ
1
2
2
ground connections for
oscilloscope probes
1
R6
1Ω
2W
1
1
1
2
1
R8
1Ω
2W
2
2
Y7
jumper
2
1 header 2
R9
1Ω
2W
2
1
T1 12
10
C4
1
2
1
33 nF/100 V
9
1
1
7
C5
1
2
1
33 nF/100 V
760 870 401
Y6
jumper
2
R4
X90 TP
X92 TP
X94 TP
X96 TP
1
0Ω
C6
4.7 nF
2000 V
C19
470 nF
63 V
X33
header 3
Y8
jumper
X34
2
R32
100 kΩ
1
V16
1N4937
header 2
1
1
1
2
X32
2
2
PCS
X104 X105 X106 X107 X102 X108 X103 X109
TP
TP
TP
TP
TP
TP
TP
TP
1
1
2
R39
1.2 kΩ
8.2 kΩ
R31
1 kΩ
1
R5
1
1
S
socket 3
2
1
1
V6
2SK3569
G
3
1
2
R2
0Ω
1
X115
header 2
47 kΩ
2
68 nF/400 V
6
connector position 11
glue sealed to prevent
erroneous insertion of
daughter board
1
2
1
47 kΩ
C1
2
Y5
jumper
SH
socket 13
1
Cdc
X114
header 2
S
socket 3
43 kΩ
1
V3
2SK3569
G
3
2
43 kΩ
placed in header
D
X2
1
2
33 Ω
11
VDD
1 R22 2 1 R23 2 1 R24 2 1 R25 2
X89
10
1
Vbrg
220 kΩ
connection for daughter board
Y9
jumper
1
1
2
C18
2.2 nF
100 V
1
2
2
CSN
C11
10 nF
100 V
3
1
1
2
R7
1 kΩ
C12
1 nF
100 V
lamp current sense circuit
2
1
1
2
V11
1 1N4937
C17
680 nF
50 V
R10
33 Ω
2W
2
LCS
2
X39
2
1
V12
1N4937
2
1
3
019aaa254
Fig 4.
Main board half-bridge and resonant circuit - (version R1C)
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UBA2014 evaluation board
header 3
Y10
jumper
UM10395
NXP Semiconductors
UBA2014 evaluation board
VDC In = 400 V
X1
V1
1
2
1
2
1N4937
VDC
2
MKDS 2.5/2-5.08
2
VAC In = 230 V 50 Hz
X3
C16
47 μF/
350 V
V2
GBU8K
2
F1
4
2
1
1.5 mH
1
2
2
C3
47 nF/
305 Vac
2
MKDS 2.5/2-5.08
1
1
1
C2
47 nF/
305 Vac
R29
75 kΩ
1
3
2
2
F2
C15
47 μF/
350 V
Y12
Cover
2A
1
2
R33
75 kΩ
L1
Fuseholder 5x20
1
R27
75 kΩ
1
1
2
R34
75 kΩ
1
019aaa253
Fig 5.
Main board input section
External
dimming voltage
0 V to 10 V
1 R40 2
X68
1
1 R18 2
2
33 kΩ
VDD
75 kΩ
CSP
1
1
R19
11 kΩ
MKDS 2.5/2-5.08
2
1
V15
DNP
2
C14
10 nF/
100 V
2
019aaa252
Fig 6.
Main board dimming input
X117
header 2
Y11
jumper
1
2
SH
X67 TP
X69 TP
X73 TP
X75 TP
X77 TP
X91 TP
Fig 7.
1
1
X69
1
X73
1
X75
1
1
1 T2
X67
X77
X91
2 mH
2.5 mH
3 mH
3.5 mH
4 mH
2
10
9
15 μH
X70
1
X72
1
X74
1
X76
1
X70 TP
X72 TP
3
8
4
7
5
15 μH
X74 TP
X76 TP
6
DNP
019aaa274
Main board transformer T2/T3
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UBA2014 evaluation board
X110
header 2
1
X111
header 2
2
1
X112
header 2
2
1
2
X113
header 2
1
2
Y1
jumper
Y2
jumper
Y3
jumper
Y4
jumper
LAMP 4
1
1
1
X90 TP
X6 TP
X92 TP
X9 TP
X94 TP
X96 TP
1
X15 TP
SH
1
1
X18 TP
1
X22 TP
1
X25 TP
1
X28 TP
1
X17 TP
X19 TP
X23 TP
EXPERIMENTING AREA
1
X11 TP
X13 TP
X29 TP
1
1
2
1
3
1
X8
4
MKDS 2.2/4-5.08
LAMP 3
X20 TP
X24 TP
X27 TP
X26 TP
1
X30 TP
1
1
1
2
1
3
1
X21
4
MKDS 2.2/4-5.08
X31 TP
SH
1
X36 TP
1
X43 TP
1
X44 TP
1
X47 TP
1
X37 TP
X38 TP
X40 TP
X41 TP
X45 TP
X48 TP
X50 TP
SH
1
X53 TP
X57 TP
X60 TP
X63 TP
1
1
1
1
1
Fig 8.
LAMP 2
X35 TP
X52 TP
X54 TP
X58 TP
EXPERIMENTING AREA
1
X61 TP
X64 TP
X46 TP
X49 TP
1
1
1
2
1
3
1
X42
4
MKDS 2.2/4-5.08
LAMP 1
X55 TP
X59 TP
X62 TP
X65 TP
1
1
1
2
1
3
1
X66 TP
X56
4
MKDS 2.2/4-5.08
019aaa255
Main board lamp connectors and experimenting area
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5. Connectors
5.1 Power supply connectors
The board can be supplied by either a high voltage DC or a mains AC input. For most
applications the high voltage DC input should be used. In the final product, a Power
Factor Correction (PFC) of choice may be used to replace the high voltage DC supply.
For some applications (such as CFL applications) the rectified mains is sufficient. In these
cases a mains input of 230 V AC may be used.
Table 1.
DC high voltage input connector X1
Connector
Signal
Comment
X1-1
+
+ 400 V (DC) in
X1-2
GND
ground
Table 2.
AC input connector X3
Connector
Signal
Comment
X3-1
~
mains 230 V (AC)
X3-2
~
mains 230 V (AC)
5.2 Dimming input
The UBA2014 has dimming functionality. An input with a voltage divider has been
provided so that a 0 V to 10 V signal can be used. If no voltage is supplied to the dimming
input, the lamp operates at approximately 50 % of its nominal power.
Please note that there is no galvanic isolation between the dimming input and the rest of
the circuit, it is therefore advisable to use a mains isolation transformer to separate the
board ground from the mains. If required, a Zener diode (V15) can be used as protection
against input voltages that are too high.
Table 3.
Dimming input connector X68
Connector
Signal
Comment
X68-1
+
0 V to 10 V dimming input (max 10 V)
X68-2
GND
ground
5.3 Lamp connectors
There are connections for four lamps on the board. In the following tables, the connectors
are listed together with the names of the test points connected to them.
Table 4.
UM10395
User manual
Lamp 1 (X56)
TP
Comment
X55
connection for filament 1
X59
connection for filament 1
X62
connection for filament 2
X65
connection for filament 2
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Table 5.
Lamp 2 (X42)
TP
Comment
X38
connection for filament 1
X41
connection for filament 1
X46
connection for filament 2
X49
connection for filament 2
Table 6.
Lamp 3 (X21)
TP
Comment
X20
connection for filament 1
X24
connection for filament 1
X27
connection for filament 2
X30
connection for filament 2
Table 7.
Lamp 4 (X8)
TP
Comment
X6
connection for filament 1
X9
connection for filament 1
X11
connection for filament 2
X13
connection for filament 2
5.4 Test points
Eight ground pins are distributed over the board so that (oscilloscope) probes can be
grounded without the need for long grounding wires.
Table 8.
Ground test points
TP
Color
Signal
X102
black
GND
X103
black
GND
X104
black
GND
X105
black
GND
X106
black
GND
X107
black
GND
X108
black
GND
X109
black
GND
Remark: A test pin is available for each pin of the daughter board.
Table 9.
UM10395
User manual
Daughter board connections
TP
Name
Comment
X78
CSN
negative input for the average current sensor [1]
X79
CSP
positive input for the average current sensor [1]
X80
Vref
reference voltage output [2]
X81
LVS
lamp voltage sensor input [1]
X82
SH
source for the high-side switch
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Table 9.
Daughter board connections …continued
TP
Name
Comment
X83
GH
gate output for the high-side switch
X84
PCS
preheat current sensor input [1]
(also connected to LVS via V5, R7/C11, R5/C10)
X85
Vbrg
connection to VDC via R20 (220 kΩ)
X86
GL
gate output for the low-side switch
X87
GND
ground
X88
VDD
low voltage supply
X120
PCS_2021
preheat current sense for the UBA2021 daughter board
[1]
For UBA2014 daughter board.
[2]
From UBA2014 daughter board.
5.5 Transformer T1
Transformer T1 is used In the default setup, and it is connected with jumpers to lamp
connector 4 (X8). The transformer specifications are listed in Section 6.1.
Table 10.
Default connection transformer T1
Header
Comment
X110
insert to connect T1 to filament 1, lamp 4
X111
insert to connect T1 to filament 1, lamp 4
X112
insert to connect T1 to filament 2, lamp 4
X113
insert to connect T1 to filament 2, lamp 4
X114
insert to connect SH to transformer T1
X115
insert to connect T1 to resonant capacitor C6 (4.7 nF; 2000 V)
5.6 FET
Two NMOST FETs should be placed in X2 and X14. The supplied NMOSTs are Toshiba
2SK3569 (VDS = 600 V; ID = 10 A; RDSon = 0.54 Ω). When using different NMOS types, the
values of gate resistors R1 and R3 (default 33 Ω) can be changed.
5.7 Current sense selection
There are two ways to use current sensing. Sensing of the half-bridge current or sensing
of the lamp current.
Table 11.
UM10395
User manual
Current sensing selection
X33
Pins 1 to 2
Pins 2 to 3
half-bridge
shorted
open
lamp current
open
shorted
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5.7.1 Half-bridge current sensing
Pins 1 and 2 of jumper X33 should be shorted in order to connect the sense resistor
network in the half-bridge to the CSN pin of the UBA2014. With jumpers X32 and X34,
different values of the sense resistor can be selected. In this case, X39 should be shorted
between pins 2 and 3 in order to connect the lamp to ground.
Table 12.
Current sensing selection
X32
X34
Resistance (Ω)
short
short
0.5
short
open
1.0
open
short
1.5
open
open
2.0
5.7.2 Lamp current sensing
Pins 2 and 3 of jumper X33 should be shorted to connect the lamp current sense network
to the CSN pin. X39 should be shorted between pins 1 and 2 to connect the lamp to the
sensing circuit.
5.8 Using transformer T3
To use the flexible transformer T3, jumper X117 should be inserted. This connects SH to
pin 1 of the transformer. Table 13 shows the different inductance values that can be made
with this transformer. The specifications of the transformer are listed in Section 6.2.
Table 13.
Transformer T3 primary connections
Connection
Inductance
X69
2.0 mH
X73
2.5 mH
X75
3.0 mH
X77
3.5 mH
X91
4.0 mH
Two secondary connections are available for filament (pre-)heating, as shown in Table 14
Table 14.
Transformer T3 secondary connections
Connection
Inductance
X70 to X72
15 μH
X74 to X76
15 μH
Transformer T3 has a double footprint that enables the use of different types of
transformers. The transformers are named “T2” and “T3” on the schematic drawings.
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6. Transformer specifications
6.1 Transformer T1
6.1.1 Schematic diagram
• Manufacturer: Würth Elektronik
• Part number: 760870401
12
N3
1
10
N1
9
6
N2
7
019aaa277
Fig 9.
Transformer T1 schematic diagram
6.1.2 Electrical properties
Table 15.
Electrical characteristics of transformer T1
Properties
Test conditions
Value
Unit
Tolerance
mH
±5 %
Inductance N1
50 kHz/0.1 V
L0
2.9
Turns ratio N1 to N3
N1: N2: N3
TR
26.1 : 1 : 1
DC-resistance N1
at 20 °C
RDC1
2.7
?
maximum
DC-resistance N2
at 20 °C
RDC2
180
m?
maximum
±3 %
DC-resistance N3
at 20 °C
RDC3
180
m?
maximum
Saturation current N1
dL / L = 20 %
ISAT
1.6
A
typical
Leakage inductance N1
200 kHz/0.1 V other
windings shorted
LS
350
μH
maximum
Coupling capacitance
20 kHz/1 V all windings
CWW
11.0
pF
typical
Hipot test
3 mA, 1s all windings
HV
1.2
kV
6.1.3 Core and bobbin T1
• Core: RM-8 (Ferroxcube RM/I or equivalent)
• Core material: 3F3, N87 or equivalent
• Bobbin: RM-8 (12 pin, vertical type)
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11
10
12
1
3
2
21.59 mm
(max)
8
9
7
6
4
5
21.59 mm
(max)
17.27 mm
(max)
019aaa251
Fig 10. Pin out and dimensions of Transformer T1
6.2 Transformer T3
6.2.1 Schematic diagram
• Manufacturer: Würth Elektronik
• Part number: 760870402
10
1
2
3
4
5
N1
N7
N2
9
N3
8
N4
N6
N5
6
7
019aaa278
Fig 11. Transformer T3 schematic diagram
Table 16.
Electrical characteristics for transformer T3
Properties
Test conditions
Value
Unit Tolerance
Inductance N1 to N5
50 kHz/0.1 V
Turns ratio N1 to N5
N1: N2: N3: N4: N5: N6: N7
L0
4.0
mH
TR
12 : 1.33 : 1.25 : 1.17 : 1.17 : 1 : 1
DC-resistance N1 to N5
at 20 °C
RDC1-5
1.85
?
±20 %
DC-resistance N6
at 20 °C
RDC6
135
m?
±20 %
DC-resistance N7
at 20°C
±5 %
±3 %
RDC7
140
m?
±20 %
Saturation current N1 to N5 dL / L = 20 %
ISAT
1.0
A
typical
Leakage inductance N1 to
N5
200 kHz/0.1 V other
windings shorted
LS
275
μH
typical
Coupling capacitance
20 kHz/1 V all windings
CWW
30.0
pF
typical
Hipot test
3 mA, 1 s all windings
HV
3.0
kV
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6.2.2 Core and bobbin T3
10
1
31.5 mm
(max)
6
5
31.5 mm
(max)
21 mm
(max)
019aaa279
Fig 12. Transformer T3
•
•
•
•
Core: E30/15/7
Core material: ferrite
Air gap in center leg: 1100 μm
Bobbin: CSH-E30/7-1S-10P
7. Application example
7.1 Default application T5 HE 35 W
The default settings of the board are for a T5 HE 35 W burner.
Table 17.
Default settings
Jumper
Position
Comment
X32
shorted
half-bridge sense resistor 1 Ω (used for PCS)
X34
open
-
X33
1 to 2 open, 2 to 3
shorted
use lamp current sensing
X114
shorted
connect transformer T1
X115
shorted
-
X39
1 to 2 shorted, 2 to 3
open
connect lamp to lamp current sense circuit
X110, X111, X112, X113
shorted
connect to lamp 4
X117
open
do not connect transformer T3
Table 18.
External connections for T5 HE 35 W
Jumper
Position
Comment
X1
VDC
400 V (DC)
X68
external dimming
10 V for full power
X8
burner
T5 HE 35 W burner
When no external dimming voltage is supplied, the lamp power is 20 W.
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8. Bill of Materials (BOM)
Table 19.
BOM daughter board
Reference
Value
Component
A1
UBA2014T
NXP
C1
330 n /16 V
capacitor ceramic X7R, 16 V, 10 %
C2
220 nF/16 V
capacitor ceramic X7R, 16 V, 10 %
C3
100 pF
capacitor ceramic C0G, 50 V, 5 %
C4, C11
100 nF
capacitor ceramic X7R, 50 V, 10 %
C5
not mounted
C6
1 nF/500 V
capacitor ceramic 500 V NP0 5 %
C7
5.6 nF/50 V
capacitor ceramic 50 V X7R 10 %
C8
1 μF/25 V
capacitor ceramic X7R 25 V 10 %
C9
10 nF
capacitor ceramic X7R, 50 V, 10 %
C10
56 nF/50 V
capacitor ceramic 50 V X7R 10 %
R1, R7
33 kΩ
resistor 1 % 0.125 W 100 ppm RC12H
R2, R3
240 kΩ
resistor 1 % 0.125 W 100 ppm RC12H
R4
2.2 Ω
resistor 1 % 0.125 W 0 to + 500 ppm RC12H
R5
10 kΩ
resistor 1 % 0.125 W 100 ppm RC12H
R6
1 kΩ
resistor 1 % 0.125 W 100 ppm RC12H
V1, V5
BAS29
NXP, diode, 50 ns 90 V 250 mA
V3
BZX84C12V
NXP, Zener, 250 mW, 5 % [Y2t/Y2p/Y2W]
V2, V4
BZX84-B6V8
NXP, Zener, 250 mW, 2 % [Z61 or R6]
Table 20.
BOM Main board
Reference
Value
Component
C1
68 nF/400 V
capacitor, MKP Class X2, 20 %
C2, C3, C4, C5
47 nF/305 V (AC)
capacitor, MKP Class X2, 20 %
C4, C5
33 nF/100 V
capacitor, MKT 100 V (DC), 5 %
C6
4.7 nF/2000 V
capacitor MKP radial potted, 5 %
C11, C14
10 nF/100 V
capacitor ceramic disc X7R, 10 %
C12
1 nF/100 V
capacitor ceramic disc X7R, 10 %
C15, C16
4.7 μF/450 V
cap. elco rad 450 V 105C 20 %
C17
680 nF/50 V
capacitor ceramic disc X7R, 10 %
C18
2.2 nF/100 V
capacitor ceramic disc X7R, 10 %
C19
470 nF/63 V
capacitor, MKT 63 V (DC), 5 %
F1
fuse holder 5 mm x 20 mm
fuse holder for 5 mm x 20 mm
F2
2A
fuse 5 mm x 20 mm time lag
L1
1.5 mH
inductor choke current rating = 850 mA, R = 580 mΩ
R1, R3
33 Ω
resistor 1 % 0.6 W 50 ppm MRS25
R2, R4
0Ω
zero ohm link, current rating = 25 A at 25 °C
R5
8.2 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R6, R8, R9
1.2 Ω
resistor power 5 % 2 W 100 ppm/°C MFP
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Table 20.
BOM Main board …continued
Reference
Value
Component
R7
1 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R10
33.2 Ω
resistor Power 5 % 2 W 450 ppm/°C Carbon Film
R18
33 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R19
11 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R20
220 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R22, R23
43 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R24, R25
47 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R27, R29, R33, R34
75 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R31
1 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R32
100 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R35, R36
56 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R37
0Ω
Zero ohm link Im = 25 A at 25 °C
R38
5.6 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R39
1.2 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
R40
75 kΩ
resistor 1 % 0.6 W 50 ppm MRS25
T1
760870401
Würth Elektronik: part number 760870401
T3
760870402
Würth Elektronik: part number 760870402
V1, V11, V12, V16
1N4937
diode, fast-recovery, 600 V, 1 A
V2
GBU8K
bridge 800 V 8 A TH
V3, V6
2SK3569
FET MOS N-ch 600 V, 10 A 0,54E
V15
not mounted
X1, X3, X68
MKDS 2,5/2-5,08
terminal block (screw) 2-p, p = 2e, 2.5 mm2
X2, X14
Socket 3
socket straight p = 2.54 mm, h = 7 mm
X8, X21, X42, X56
MKDS 2,5/4-5,08
terminal block (screw) 4-p, p = 2e, 2.5 mm2
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9. Layout
7022.000.00022
019aaa275
019aaa276
Top view
Bottom view
Fig 13. UBA2014 daughter board layout
V1
C2
C1
C3
V3
C7 C6
3
R1
C5
1
R6 C10 R5
R7
V2
C8
V5
2
V4
R3
1
C9
3
C11
1 X1
3
3
3
R2
1
2
019aaa292
Top view
C4
A1
R4
019aaa296
Bottom view
Fig 14. UBA2014 daughter board silk screen
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TOP SIDE
3322 029 91481
UBA2014EB R1C
019aaa295
Fig 15. UBA2014/21 main board PCB layout top
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User manual
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Rev. 2 — 16 September 2010
© NXP B.V. 2010. All rights reserved.
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BOTTOM SIDE
B
019aaa293
Fig 16. UBA2014/21 main board PCB layout bottom
UM10395
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Rev. 2 — 16 September 2010
© NXP B.V. 2010. All rights reserved.
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
X66
T2
1
GND
SH
X117
10
10
1
1
9
9
2
2
15 μH
X73
X62
X53
X54
X59
X52
X55
8
8
3
3
7
7
4
4
HALF
BRIDGE
SH
X91
3.5 mH
4 mH
X77
X42
6
6
5
5
1
1
X109
d
X48
X49
X44
X45
X46
X40
X43
X41
X36
X37
X38
LAMP 2
GND
s
X2
UBA20 (14/21) Daughter Board
1
1
R5
R32
CSP
X89
X78
X80
X79
X35
SH
X31
X104
X21
GND
C12
1
R6
X28
X29
X30
X25
X26
X27
X22
X23
X24
X18
X19
X20
LAMP 3
V12
R10
R7
X32
C17
1
X1
WWW.NXP.COM
UBA20 (14/21)
DEMO BOARD
V1.2
GND
X33
C18
R31
VREF
X82
C11
X81
LVS
SH
X83
GH
GL
GND
R36
VCC
C15
PCS
X86
X85
s
PCS
2021
X14
R33
X87
VBRG
R3 R20 X120
X88
d
X84
g
Low
Side
FET
CSN
230 VAC 50 Hz
1
R35
V11
LAMP CURRENT SENSE
8
R40
ANALOG DIM IN
0 - 10 V
C14
GND
7
TRAFO 1
X114
6
R4
X39
X107
1
5
X108
X17
SH
SH
X8
V16
R8
X115
R9
GND
C5
11
X96
12
2
X94
C4
C1
R18
R37
22 of 25
© NXP B.V. 2010. All rights reserved.
GND
GND
X112
X9
R22
R2 X92
R24
X111
1
C6
X110
X90
High Voltages
On This Board !
X6
1
R23
R25
019aaa294
Fig 17. UBA2014/21 main board silk screen top
UM10395
R38
X103
X11
1
R39
X102
X113
1
1
X103
LAMP 4
X13
X15
UBA2014 evaluation board
1
V15
R19
X106
1
VDC_IN = 400 V
X105
1
V1
PREHEAT CURRENT SENSE
T1
X34
1
1
Rev. 2 — 16 September 2010
All information provided in this document is subject to legal disclaimers.
X47
R1
g
High
Side
FET
F1
X50
GND
X3
WW/YY
X58
X75
2 A/T
C2
X68
X57
LAMP 1
X76
3 mH
C16
X65
X74
2.5 mH
R29
X61
X72
2 mH
R27
X60
X56
15 μH
X69
R34
X64
X70
T3
X67
C3
EXPERIMENTING AREA
X63
1
V2
NXP Semiconductors
UM10395
User manual
L1
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NXP Semiconductors
UBA2014 evaluation board
10. Glossary
CFL — Compact Fluorescent Lamp
FET — Field-Effect Transistor
NMOST — Negative channel Metal–Oxide–Semiconductor Transistor
TL — Tubular Lamp
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11. Legal information
11.1
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
11.2
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
UM10395
User manual
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
Safety of high-voltage evaluation products — The non-insulated high
voltages that are present when operating this product, constitute a risk of
electric shock, personal injury, death and/or ignition of fire. This product is
intended for evaluation purposes only. It shall be operated in a designated
test area by personnel that is qualified according to local requirements and
labor laws to work with non-insulated mains voltages and high-voltage
circuits.
The product does not comply with IEC 60950 based national or regional
safety standards. NXP Semiconductors does not accept any liability for
damages incurred due to inappropriate use of this product or related to
non-insulated high voltages. Any use of this product is at customer’s own risk
and liability. The customer shall fully indemnify and hold harmless NXP
Semiconductors from any liability, damages and claims resulting from the use
of the product.
11.3
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 September 2010
© NXP B.V. 2010. All rights reserved.
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12. Contents
1
2
3
3.1
3.2
4
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.7.1
5.7.2
5.8
6
6.1
6.1.1
6.1.2
6.1.3
6.2
6.2.1
6.2.2
7
7.1
8
9
10
11
11.1
11.2
11.3
12
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Safety warnings . . . . . . . . . . . . . . . . . . . . . . . . . 3
Board description . . . . . . . . . . . . . . . . . . . . . . . 4
Daughter board. . . . . . . . . . . . . . . . . . . . . . . . . 4
Main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power supply connectors . . . . . . . . . . . . . . . . 10
Dimming input. . . . . . . . . . . . . . . . . . . . . . . . . 10
Lamp connectors . . . . . . . . . . . . . . . . . . . . . . 10
Test points. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 12
FET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Current sense selection . . . . . . . . . . . . . . . . . 12
Half-bridge current sensing . . . . . . . . . . . . . . 13
Lamp current sensing . . . . . . . . . . . . . . . . . . . 13
Using transformer T3 . . . . . . . . . . . . . . . . . . . 13
Transformer specifications . . . . . . . . . . . . . . . 14
Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 14
Schematic diagram . . . . . . . . . . . . . . . . . . . . . 14
Electrical properties . . . . . . . . . . . . . . . . . . . . 14
Core and bobbin T1 . . . . . . . . . . . . . . . . . . . . 14
Transformer T3 . . . . . . . . . . . . . . . . . . . . . . . . 15
Schematic diagram . . . . . . . . . . . . . . . . . . . . . 15
Core and bobbin T3 . . . . . . . . . . . . . . . . . . . . 16
Application example . . . . . . . . . . . . . . . . . . . . 16
Default application T5 HE 35 W . . . . . . . . . . . 16
Bill of Materials (BOM). . . . . . . . . . . . . . . . . . . 17
Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 September 2010
Document identifier: UM10395