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ISPSD is the premier forum for technical discussion in all areas of power semiconductor devices and power integrated circuits. ISPSD’16 will be held in the historical city of Prague, also known as the “Mother of Towns”, “The Golden City”, or “The City of a Hundred Spires”. The beautiful Czech metropolis nestling above the river of Vltava, full of historical treasures, music and arts will give this conference a unique atmosphere. Topics of interest include but are not limited to: ● Devices: Device Physics, Device Design, High Frequency Devices, High Power Devices, Smart Power Devices, Safe-Operating Area, Reliability, ESD ● Materials: Si, SiC, GaN, Diamond, GaAs ● Power ICs: Isolation Techniques, SOI, Circuit Design, Device Technology, Energy Capability and SOA, Reliability, ESD, Power SoC, Monolithic vs Hybrid ● Processes: Process Integration, Lifetime Control, Passivation, Crystal Growth, III-V (hetero)-epitaxial growth ● Modeling/Simulation: Device and Circuit Simulation, Layout, Verification Tools ● Packaging: Novel Packaging Concepts, Power SiP, Stress and Thermal Analysis, Thermal Management ● Applications: Hybrid Vehicles, Power Supplies, Computer and Telecom Power, Motor Drives, Utility Abstract Submission ● Prospective authors should visit the ISPSD’16 website: www.ispsd2016.com ● A PDF abstract should be submitted through this website including: ○ A single-page text summary in English (500 words maximum) ○ Up to two additional pages of supporting graphs and tables ○ The abstract heading must include: Title, Authors, Affiliations, Address, Phone, Fax, Email ○ The abstract must CLEARLY state: Purpose of work, How the work advances prior art, Specific results and their significance, up-to-date references ○ Mark the paper’s eligibility for the Charitat award (paper for which the first author is not more than 30 years of age at the time of the conference). To be eligible, the first author must also present the paper. ● Abstract submission deadline is OCTOBER 20, 2015 ● Author notification will be sent out by December 15, 2015 ● Final manuscripts must be submitted before April 1, 2016 General Chair: Dr. Jan Šonský, NXP Semiconductors, Email: [email protected] Technical Program Chair: Dr. Oliver Häberlen, Infineon Technologies, Email: [email protected] Technically co-sponsored by the IEEE Electron Devices Society, European Center for Power Electronics and The Institute of Electrical Engineers of Japan.