Download BDTIC SIPMOS Small-Signal-Transistor BSS139

BSS139
SIPMOS® Small-Signal-Transistor
Product Summary
Features
• N-channel
• Depletion mode
V DS
250
V
R DS(on),max
30
Ω
I DSS,min
0.03
A
• dv /dt rated
• Available with V GS(th) indicator on reel
• Pb-free lead-plating; RoHS compliant
BDTIC
PG-SOT-23
° Halogen free according to IEC61249-2-21
° Qualified according to AEC Q101
Type
Package
Tape and Reel Information
Marking
Pb-free
BSS139
PG-SOT-23
H6327: 3000 pcs/ree
STs
Yes
BSS139
PG-SOT-23
H6906: 3000 pcs/reel sorted in VS(th) bands 1) STs
Yes
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
T A=25 °C
0.10
T A=70 °C
0.08
0.4
Pulsed drain current
I D,pulse
T A=25 °C
Reverse diode dv /dt
dv /dt
I D=0.1 A,V DS=200 V,
di /dt =200 A/µs,
T j,max=150 °C
Gate source voltage
V GS
Unit
A
kV/µs
V
0 (<250V)
Power dissipation
P tot
Operating and storage temperature
T j, T stg
T A=25 °C
IEC climatic category; DIN IEC 68-1
Rev. 1.8
6
±20
ESD class
(JESD22-A114-HBM)
1)
Value
0.36
W
-55 ... 150
°C
55/150/56
see table on next page and diagram 11
www.BDTIC.com/infineon
page 1
2009-08-18
BSS139
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
350
Thermal characteristics
Thermal resistance,
junction - ambient
R thJA
minimal footprint
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
BDTIC
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=-3 V, I D=250 µA
Gate threshold voltage
V GS(th)
Drain-source cutoff current
I D(off)
250
-
-
V DS=3 V, I D=56 µA
-2.1
-1.4
-1
V DS=250 V,
V GS=-3 V, T j=25 °C
-
-
0.1
V DS=250 V,
V GS=-3 V, T j=125 °C
-
-
10
V
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
-
10
nA
On-state drain current
I DSS
V GS=0 V, V DS=10 V
30
-
-
mA
Drain-source on-state resistance
R DS(on)
V GS=0 V, I D=15 mA
-
12.5
30
V GS=10 V,I D=0.1 mA
-
7.8
14
|V DS|>2|I D|R DS(on)max,
I D=0.08 A
0.060
0.13
-
S
-1.2
-
-1
V
K
-1.35
-
-1.15
L
-1.5
-
-1.3
M
-1.65
-
-1.45
N
-1.8
-
-1.6
Transconductance
g fs
Ω
Threshold voltage V GS(th) sorted in bands2)
V GS(th)
J
2)
Rev. 1.8
V DS=3 V, I D=56 µA
Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific
band cannot be ordered separately.
www.BDTIC.com/infineon
page 2
2009-08-18
BSS139
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
60
76
-
6.7
8.4
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
Crss
-
2.6
3.3
Turn-on delay time
t d(on)
-
5.8
8.7
V GS=-3 V, V DS=25 V,
f =1 MHz
pF
ns
BDTIC
Rise time
tr
Turn-off delay time
t d(off)
Fall time
V DD=125 V,
V GS=-3...5 V,
I D=0.04 A, R G=6 Ω
-
5.4
8.1
-
29
43
tf
-
182
273
Gate to source charge
Q gs
-
0.14
0.21
Gate to drain charge
Q gd
-
1.3
2.0
Gate charge total
Qg
-
2.3
3.5
Gate plateau voltage
V plateau
-
-0.28
-
V
-
-
0.10
A
-
-
0.4
-
0.81
1.2
V
-
8.6
12.9
ns
-
2.1
3.1
nC
Gate Charge Characteristics
V DD=200 V,
I D=0.04 A,
V GS=-3 to 5 V
nC
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
Rev. 1.8
T A=25 °C
V GS=-3 V, I F=0.1 A,
T j=25 °C
V R=50 V, I F=0.04 A,
di F/dt =100 A/µs
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2009-08-18
BSS139
1 Power dissipation
2 Drain current
P tot=f(T A)
I D=f(T A); V GS≥10 V
0.4
0.12
0.3
0.08
I D [A]
P tot [W]
BDTIC
0.2
0.04
0.1
0
0
0
40
80
120
160
0
40
80
T A [°C]
120
3 Safe operating area
4 Max. transient thermal impedance
I D=f(V DS); T A=25 °C; D =0
Z thJA=f(t p)
parameter: t p
parameter: D =t p/T
100
160
T A [°C]
103
limited by on-state
resistance
10 µs
100 µs
1 ms
10-1
0.5
10
0.2
Z thJA [K/W]
I D [A]
10 ms
2
10-2
0.1
0.05
101
DC
0.02
0.01
10
10-4
100
10
0
10
1
10
2
10
3
V DS [V]
Rev. 1.8
single pulse
-3
10-4
10-3
10-2
10-1
100
101
102
t p [s]
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page 4
2009-08-18
BSS139
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
0.2
30
V 10
-0.2 V
0V
-0.1 V
V1
0.2 V
0.5 V
0.1 V
0.16
V 0.5
20
BDTIC
R DS(on) [Ω]
I D [A]
0.12
V 0.2
0.08
V 0.1
1V
10
V0
V 0.1-
10 V
V 0.2-
0.04
0
0
0
2
4
6
8
10
0
0.04
V DS [V]
0.08
0.12
0.16
0.15
0.20
I D [A]
7 Typ. transfer characteristics
8 Typ. forward transconductance
I D=f(V GS); |V DS|>2|I D|R DS(on)max
g fs=f(I D); T j=25 °C
0.3
0.25
0.25
0.2
0.2
25 °C
0.15
g fs [S]
I D [A]
-55 °C
0.15
150 °C
0.1
0.1
0.05
0.05
0
0
-2
-1
0
1
Rev. 1.8
0.00
0.05
0.10
I D [A]
V GS [V]
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page 5
2009-08-18
BSS139
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R DS(on)=f(T j); I D=0.015 A; V GS=0 V
V GS(th)=f(T j); V DS=3 V; I D=56 µA
parameter: I D
60
0
50
-0.5
40
-1
%98
V GS(th) [V]
R DS(on) [Ω]
BDTIC
%98
30
20
typ
-1.5
-2
%2
typ
10
-2.5
0
-3
-60
-20
20
60
100
140
180
-60
-20
20
60
100
140
180
T j [°C]
T j [°C]
11 Threshold voltage bands
12 Typ. capacitances
I D=f(V GS); V DS=3 V; T j=25 °C
C =f(V DS); V GS=-3 V; f =1 MHz
10
1000
1
100
M
N
0.1
C [pF]
I D [mA]
Ciss
K
L
J
10
Coss
56 µA
Crss
0.01
1
-2
-1.5
-1
-0.5
Rev. 1.8
0
5
10
15
20
25
30
V DS [V]
V GS [V]
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page 6
2009-08-18
BSS139
13 Forward characteristics of reverse diode
15 Typ. gate charge
I F=f(V SD)
V GS=f(Q gate); I D=0.1 A pulsed
parameter: T j
parameter: V DD
8
1
6
0.2 VDS(max)
0.5 VDS(max)
150 °C, 98%
0.1
0.8 VDS(max)
4
25 °C
150 °C
V GS [V]
BDTIC
I F [A]
25 °C, 98%
2
0
0.01
-2
-4
0.001
0
0.4
0.8
1.2
1.6
V SD [V]
0
1
2
3
Q gate [nC]
16 Drain-source breakdown voltage
V BR(DSS)=f(T j); I D=250 µA
300
V BR(DSS) [V]
280
260
240
220
-60
-20
20
60
100
140
180
T j [°C]
Rev. 1.8
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2009-08-18
BSS139
Package Outline:
BDTIC
Footprint:
Packaging:
Dimensions in mm
Rev. 1.8
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page 8
2009-08-18
BSS139
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
BDTIC
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev. 1.8
www.BDTIC.com/infineon
page 9
2009-08-18