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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC311 PRECISION VOLTAGE COMPARATOR DESCRIPTION The µPC311 is a voltage comparator that has input currents more than a hundred times lower than devices like conventional standard type of 710. It is also designed to operate over a wide range of supply voltages; from ±15 V op amp supplies down to the single 5 V supply used for IC logic. Its output is compatible with HNIL, DTL and TTL as well as MOS circuits. FEATURES • Operate from single 5 V supply • Maximum input current: 250 nA • Maximum offset current: 50 nA • Fast transient response: 200 ns TYP. ORDERING INFORMATION Part Number Package µPC311C 8-pin plastic DIP (7.62 mm (300)) µPC311G2 8-pin plastic SOP (5.72 mm (225)) PIN CONFIGURATION (Top View) EQUIVALENT CIRCUIT (1/2 Circuit) 8 R1 R3 R4 5 300 1.3 k 1.3 k BALANCE BALANCE/ STROBE 6 300 R2 Q3 Q5 R9 R10 800 800 R5 100 Q12 Q13 R12 3.0 k Q23 R6 3.7 k R7 3.7 k Q9 Q10 Q21 D3 D1 Q17 Q16 Q6 Q7 IN II 2 + 3 − R13 R16 250 900 Q18 Q1 Q2 R15 R17 Q15 1.3 k 800 Q11 Q8 R8 780 R11 340 5.4 k D2 R21 200 7 R19 R22 300 600 Q24 IN 2 II 3 V− 4 8 V+ + 7 OUTPUT − 6 BALANCE/ STROBE 5 BALANCE OUT R23 1 Q20 1 Q22 Q19 R14 R18 1.3 k GND R20 5.0 k Q4 Q14 µ PC311C, 311G2 V+ 4 GND V− The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G15945EJ4V0DS00 (4th edition) Date Published March 2004 N CP(K) Printed in Japan The mark shows major revised points. 1987 µPC311 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter + Voltage between V and V Symbol – Note 1 V −V + Differential Input Voltage Input Voltage Note 2 Output to Negative Supply Voltage Note 3 – V ±30 V –0.3 to V +0.3 V –0.3 to +40 V VO − V – VGND − V Note 4 PT – Note 5 Note 6 V + – Power Dissipation Output Short Circuit Duration –0.3 to +36 VID Ground to Negative Supply Voltage G2 Package Unit VI Note 3 C Package Ratings –0.3 to +30 V 350 mW 440 mW 10 sec Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output and GND terminal from external without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. 4. Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55°C. 5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25°C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Supply Voltage (Split) V – Supply Voltage (V = GND) MIN. TYP. MAX. Unit ± ±4 ±16 V + +5 +32 V V TYPICAL CONNECTIONS OFFSET VOLTAGE NULL CIRCUIT STROBING CIRCUIT FAST RESPONSE CIRCUIT (INCREASING INPUT STAGE CURRENT) V+ V 3 kΩ 2 3 kΩ + 7 2 + 5 3 6 8 3 2 − 6 TTL, CMOS 1 kΩ 2 6 5 4 7 − 8 + Data Sheet G15945EJ4V0DS 3 7 − + µPC311 ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit ±7.5 mV VIO V − V = 5 to 30 V, RS ≤ 50 kΩ ±2.0 Input Offset Current IIO V − V = 5 to 30 V ±6.0 ±50 nA Input Bias Current IB V − V = 5 to 30 V 100 250 nA Voltage Gain AV RL = 1.0 kΩ Input Offset Voltage + + + Response Time Output Saturation Voltage VOL – – – 200,000 Input step 100 mV, Overdrive 5 mV 200 VI ≤ 10 mV, IO = 50 mA 0.75 Strobe ON Current ns 1.5 V 3.0 Output Leakage Current IOLEAK Positive Supply Current I + Negative Supply Current I – Input Offset Voltage mA VI ≥ 10 mV, VO = 35 V 0.2 50 nA IO = 0 A 5.1 7.5 mA IO = 0 A 4.1 5.0 mA ±10 mV V − V = 5 to 30 V, RS ≤ 50 kΩ, + VIO – TA = 0 to 70°C Input Offset Current IIO V − V = 5 to 30 V, TA = 0 to 70°C ±70 nA Input Bias Current IB V − V = 5 to 30 V, TA = 0 to 70°C 300 nA Common Mode Input Voltage VICM + + – – Range Output Saturation Voltage ±13.0 ±13.8 −14.5 −14.7 V ≥ 4.5 V, V = 0 V, VI ≤ −10 mV, + VOL – V 0.23 0.4 V IO = 8 mA TYPICAL APPLICATION CIRCUIT OPEN COLLECTOR OUTPUT EMITTER FOLLOWER OUTPUT COMPARATOR with HYSTERESIS CIRCUIT V+ VRL V+ V+ RL 2 + 8 VI(+) 7 3 − 1 4 2 + 8 RL 7 VO − INPUT VI(−) 3 − 1 4 OUTPUT VO GND + RL R2 R1 V− VREF Input polarity is reversed when 1pin (GND) is used as an output Threshold Voltage . VTH (High) =. VREF + VN > VI → VO : Low . VTH (Low) =. VREF – R1 (VRL – VREF) RL + R2 + R1 R1 (VREF – VOL) R 1 + R2 (VRL > VREF > VOL) Data Sheet G15945EJ4V0DS 3 µPC311 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) INPUT BIAS CURRENT POWER DISIPATION 500 400 500 µ PC311G2 µ PC311C 200 C/W 300 227 C/W 200 100 20 0 ± V = ±15 V 400 IB - Input Bias Current - nA PT - Total Power Dissipation - mW 600 40 60 80 100 5, 6-8 200 NORMAL 100 0 20 hort NORMAL 20 40 60 100 VOS - Equivalent Input Offset Voltage - mV IIO - Input Offset Current - nA in S 10 0 MAX. 10 TYP. VOS = V IO +R S . IIO 1 10 k 80 100 k INPUT CURRENT COMMON MODE INPUT VOLTAGE IB - Input Bias Current - nA 175 150 125 100 75 50 25 −12 −8 −4 0 4 8 12 16 V+ VICM - Common Mode Input Voltage Range - V VICM− VICM+ V ± = ±15 V 200 0 −16 REFERERED TO SUPPLY VOLTAGES −0.5 −1.0 −1.5 +0.4 +0.2 V− 0 VID - Differential Input Voltage - V 4 10 M 1M RS - Input Resistance - Ω TA - Operating Ambient Temperature - C 225 80 60 OFFSET ERROR V ± = ±15 V -8 P 40 TA - Operating Ambient Temperature - C INPUT OFFSET CURRENT 5, 6 ort 300 TA - Operating Ambient Temperature - C 20 Pin Sh Data Sheet G15945EJ4V0DS 10 20 30 40 50 60 70 TA - Operating Ambient Temperature - C 80 µPC311 RESPONSE TIME FOR VARIOUS INPUT OVEERDRIVES NORMAL OUTPUT RL = 1 kΩ + V = 40 V 40 EMITTER FOLLOWER OUTPUT 20 10 5 20 mV 4 V ± = ±15 V 5 mV 3 2 mV 2 VI 1 RL = 600 Ω VCC = 30 V 0 −1.0 −0.5 0 0.5 1.0 10 Overdrive = 2 mV 0 −10 5 mV −20 VI 20 mV +5 V 500 Ω − + VO 5 mV 2 2 mV VI - Input Voltage - mV VI - Input Voltage - mV 0 20 Overdrive = 20 mV 10 5 mV 0 2 mV −10 Vo - Output Voltage - V Vo - Output Voltage - V RESPONSE TIME FOR VARIOUS INPUT OVEERDRIVES 1 15 10 5 V ± = ±15 V 20 mV 5 mV V+ 0 2 mV VI 0.2 0 VO 2 kΩ −10 V− −15 20 Overdrive = 20 mV 10 5 mV 0 2 mV −10 0.4 0 0.6 1 t - Time - µ s RESPONSE TIME FOR VARIOUS INPUT OVEERDRIVES 15 2 3 t - Time - µ s 4 OUTPUT SATURATION VOLTAGE V ± = ±15 V 0.8 V+ 10 0.7 VI − + 5 20 mV VO 2 kΩ 5 mV V− 2 mV −15 100 10 Overdrive = 2 mV 0 −10 0.6 VOL - Saturation Voltage - V Vo - Output Voltage - V − + −5 −100 −100 VI - Input Voltage - mV 0.6 RESPONSE TIME FOR VARIOUS INPUT OVEERDRIVES 3 −10 20 mV 0.4 0.2 t - Time - µ s V± = ±15 V −5 VO VID - Differential Input Voltage - mV 5 0 500 Ω − + 100 0 4 +5 V 0 30 VI - Input Voltage - mV VO - Output Volgate - V 50 Vo - Output Voltage - V TRANSFERFUNCTION 60 0.5 0.4 0.3 0.2 0.1 5 mV −20 0 20 mV 0 1 2 3 4 10 20 30 40 50 IO - Output Current - mA t - Time - µ s Data Sheet G15945EJ4V0DS 5 µPC311 OUTPUT LIMITING CHARACTERISTICS SUPPLY CURRENT 140 0.5 WE PO 0.4 80 60 0.3 40 0.2 SHORT CIRCUIT CURRENT 20 ± O RC 100 5 I - Supply Current - mA U NS 0.6 Power Consumption - W IOshort - Short Circuit Current - mA T MP 6 PLY SUP ITIVE POS UT LOW P OUT N IO 120 0.7 4 AND LY PP ITIVE POS TIVE SU A NEG UT HIGH P OUT 3 2 1 0.1 0 0 5 10 15 0 5 VO - Output Voltage - V SUPPLY CURRENT ± 4 POSITIVE AND NEGATIVE SUPPLY OUTPUT HIGH 20 30 40 50 60 70 80 IOLEAK - Leakage Current - A I ±- Suply Current - mA POSITIVE SUPPLY OUTPUT LOW 10 30 OUTPUT VO = 40 V −9 10 INPUT VI = 15 V 10−10 10−11 25 TA - Operating Ambient Temperature - C 6 25 ± V = ±15 V = ±15 V 6 0 20 LEAKAGE CURRENTS 10−8 8 2 15 V - Supply Voltage- V 10 V 10 + Data Sheet G15945EJ4V0DS 35 45 55 65 TA - Operating Ambient Temperature - C 75 µPC311 PACKAGE DRAWINGS (Unit : mm) 8-PIN PLASTIC DIP (7.62mm(300)) 8 5 1 4 A K J L P I C H G B M R F D N M NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS A B 10.16 MAX. 1.27 MAX. C 2.54 (T.P.) D 0.50±0.10 F 1.4 MIN. G H 3.2±0.3 0.51 MIN. I J 4.31 MAX. 5.08 MAX. K 7.62 (T.P.) L 6.4 M 0.25 +0.10 −0.05 N 0.25 P 0.9 MIN. R 0∼15° P8C-100-300B,C-2 Data Sheet G15945EJ4V0DS 7 µPC311 8-PIN PLASTIC SOP (5.72 mm (225)) 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.59±0.21 G 1.49 H 6.5±0.3 I 4.4±0.15 J 1.1±0.2 K 0.17 +0.08 −0.07 L 0.6±0.2 M 0.12 N 0.10 P 3° +7° −3° S8GM-50-225B-6 8 Data Sheet G15945EJ4V0DS µPC311 RECOMMENDED SOLDERING CONDITIONS The µPC311 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC311G2: 8-pin plastic SOP (5.72 mm (225)) Process Infrared Ray Reflow Conditions Symbol Peak temperature: 230°C or below (Package surface temperature), IR30-00-1 Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 1 time. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), VP15-00-1 Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 1 time. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, – Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC311C: 8-pin plastic DIP (7.62 mm (300)) Process Wave Soldering Conditions Solder temperature: 260°C or below, (only to leads) Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. Data Sheet G15945EJ4V0DS 9 µPC311 • The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1