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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC311
PRECISION VOLTAGE COMPARATOR
DESCRIPTION
The µPC311 is a voltage comparator that has input currents more than a hundred times lower than devices like
conventional standard type of 710. It is also designed to operate over a wide range of supply voltages; from ±15 V op
amp supplies down to the single 5 V supply used for IC logic. Its output is compatible with HNIL, DTL and TTL as well
as MOS circuits.
FEATURES
• Operate from single 5 V supply
• Maximum input current: 250 nA
• Maximum offset current: 50 nA
• Fast transient response: 200 ns TYP.
ORDERING INFORMATION
Part Number
Package
µPC311C
8-pin plastic DIP (7.62 mm (300))
µPC311G2
8-pin plastic SOP (5.72 mm (225))
PIN CONFIGURATION (Top View)
EQUIVALENT CIRCUIT (1/2 Circuit)
8
R1 R3
R4
5 300 1.3 k 1.3 k
BALANCE
BALANCE/
STROBE 6 300
R2 Q3
Q5
R9 R10
800 800
R5
100
Q12
Q13
R12
3.0 k
Q23
R6
3.7 k
R7
3.7 k
Q9 Q10
Q21
D3
D1
Q17
Q16
Q6 Q7
IN
II
2 +
3 −
R13
R16
250
900
Q18
Q1 Q2
R15 R17
Q15 1.3 k 800
Q11
Q8
R8
780
R11
340
5.4 k
D2
R21
200
7
R19 R22
300 600
Q24
IN
2
II
3
V−
4
8
V+
+
7
OUTPUT
−
6
BALANCE/
STROBE
5
BALANCE
OUT
R23
1
Q20
1
Q22
Q19
R14 R18
1.3 k
GND
R20
5.0 k
Q4
Q14
µ PC311C, 311G2
V+
4
GND
V−
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. G15945EJ4V0DS00 (4th edition)
Date Published March 2004 N CP(K)
Printed in Japan
The mark
shows major revised points.
1987
µPC311
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Parameter
+
Voltage between V and V
Symbol
– Note 1
V −V
+
Differential Input Voltage
Input Voltage
Note 2
Output to Negative Supply Voltage
Note 3
–
V
±30
V –0.3 to V +0.3
V
–0.3 to +40
V
VO − V
–
VGND − V
Note 4
PT
–
Note 5
Note 6
V
+
–
Power Dissipation
Output Short Circuit Duration
–0.3 to +36
VID
Ground to Negative Supply Voltage
G2 Package
Unit
VI
Note 3
C Package
Ratings
–0.3 to +30
V
350
mW
440
mW
10
sec
Operating Ambient Temperature
TA
–20 to +80
°C
Storage Temperature
Tstg
–55 to +125
°C
Notes 1. Reverse connection of supply voltage can cause destruction.
2. The input voltage should be allowed to input without damage or destruction. Even during the transition
period of supply voltage, power on/off etc., this specification should be kept. The normal operation will
establish when the both inputs are within the Common Mode Input Voltage Range of electrical
characteristics.
3. This specification is the voltage which should be allowed to supply to the output and GND terminal from
external without damage or destruction. Even during the transition period of supply voltage, power on/off
etc., this specification should be kept.
4. Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55°C.
5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25°C.
6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and
Note 5.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Supply Voltage (Split)
V
–
Supply Voltage (V = GND)
MIN.
TYP.
MAX.
Unit
±
±4
±16
V
+
+5
+32
V
V
TYPICAL CONNECTIONS
OFFSET VOLTAGE NULL CIRCUIT
STROBING CIRCUIT
FAST RESPONSE CIRCUIT
(INCREASING INPUT STAGE CURRENT)
V+
V
3 kΩ
2
3 kΩ
+
7
2
+
5
3
6
8
3
2
−
6
TTL, CMOS
1 kΩ
2
6
5
4
7
−
8
+
Data Sheet G15945EJ4V0DS
3
7
−
+
µPC311
ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
±7.5
mV
VIO
V − V = 5 to 30 V, RS ≤ 50 kΩ
±2.0
Input Offset Current
IIO
V − V = 5 to 30 V
±6.0
±50
nA
Input Bias Current
IB
V − V = 5 to 30 V
100
250
nA
Voltage Gain
AV
RL = 1.0 kΩ
Input Offset Voltage
+
+
+
Response Time
Output Saturation Voltage
VOL
–
–
–
200,000
Input step 100 mV, Overdrive 5 mV
200
VI ≤ 10 mV, IO = 50 mA
0.75
Strobe ON Current
ns
1.5
V
3.0
Output Leakage Current
IOLEAK
Positive Supply Current
I
+
Negative Supply Current
I
–
Input Offset Voltage
mA
VI ≥ 10 mV, VO = 35 V
0.2
50
nA
IO = 0 A
5.1
7.5
mA
IO = 0 A
4.1
5.0
mA
±10
mV
V − V = 5 to 30 V, RS ≤ 50 kΩ,
+
VIO
–
TA = 0 to 70°C
Input Offset Current
IIO
V − V = 5 to 30 V, TA = 0 to 70°C
±70
nA
Input Bias Current
IB
V − V = 5 to 30 V, TA = 0 to 70°C
300
nA
Common Mode Input Voltage
VICM
+
+
–
–
Range
Output Saturation Voltage
±13.0
±13.8
−14.5
−14.7
V ≥ 4.5 V, V = 0 V, VI ≤ −10 mV,
+
VOL
–
V
0.23
0.4
V
IO = 8 mA
TYPICAL APPLICATION CIRCUIT
OPEN COLLECTOR OUTPUT
EMITTER FOLLOWER OUTPUT
COMPARATOR with HYSTERESIS CIRCUIT
V+
VRL
V+
V+
RL
2
+
8
VI(+)
7
3
−
1
4
2
+
8
RL
7
VO
−
INPUT
VI(−)
3
−
1
4
OUTPUT
VO
GND
+
RL
R2
R1
V−
VREF
Input polarity is reversed when 1pin
(GND) is used as an output
Threshold Voltage
.
VTH (High) =. VREF +
VN > VI → VO : Low
.
VTH (Low) =. VREF –
R1
(VRL – VREF)
RL + R2 + R1
R1
(VREF – VOL)
R 1 + R2
(VRL > VREF > VOL)
Data Sheet G15945EJ4V0DS
3
µPC311
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.)
INPUT BIAS CURRENT
POWER DISIPATION
500
400
500
µ PC311G2
µ PC311C
200 C/W
300
227 C/W
200
100
20
0
±
V = ±15 V
400
IB - Input Bias Current - nA
PT - Total Power Dissipation - mW
600
40
60
80
100
5, 6-8
200
NORMAL
100
0
20
hort
NORMAL
20
40
60
100
VOS - Equivalent Input Offset Voltage - mV
IIO - Input Offset Current - nA
in S
10
0
MAX.
10
TYP.
VOS = V IO +R S . IIO
1
10 k
80
100 k
INPUT CURRENT
COMMON MODE INPUT VOLTAGE
IB - Input Bias Current - nA
175
150
125
100
75
50
25
−12
−8
−4
0
4
8
12
16
V+
VICM - Common Mode Input Voltage Range - V
VICM−
VICM+
V ± = ±15 V
200
0
−16
REFERERED TO SUPPLY
VOLTAGES
−0.5
−1.0
−1.5
+0.4
+0.2
V−
0
VID - Differential Input Voltage - V
4
10 M
1M
RS - Input Resistance - Ω
TA - Operating Ambient Temperature - C
225
80
60
OFFSET ERROR
V ± = ±15 V
-8 P
40
TA - Operating Ambient Temperature - C
INPUT OFFSET CURRENT
5, 6
ort
300
TA - Operating Ambient Temperature - C
20
Pin Sh
Data Sheet G15945EJ4V0DS
10
20
30
40
50
60
70
TA - Operating Ambient Temperature - C
80
µPC311
RESPONSE TIME FOR VARIOUS INPUT
OVEERDRIVES
NORMAL OUTPUT
RL = 1 kΩ
+
V = 40 V
40
EMITTER
FOLLOWER
OUTPUT
20
10
5
20 mV
4
V ± = ±15 V
5 mV
3
2 mV
2
VI
1
RL = 600 Ω
VCC = 30 V
0
−1.0
−0.5
0
0.5
1.0
10
Overdrive = 2 mV
0
−10
5 mV
−20
VI
20 mV
+5 V
500 Ω
−
+
VO
5 mV
2
2 mV
VI - Input Voltage - mV
VI - Input Voltage - mV
0
20
Overdrive = 20 mV
10
5 mV
0
2 mV
−10
Vo - Output Voltage - V
Vo - Output Voltage - V
RESPONSE TIME FOR VARIOUS INPUT
OVEERDRIVES
1
15
10
5
V ± = ±15 V
20 mV
5 mV
V+
0 2 mV
VI
0.2
0
VO
2 kΩ
−10
V−
−15
20
Overdrive = 20 mV
10
5 mV
0
2 mV
−10
0.4
0
0.6
1
t - Time - µ s
RESPONSE TIME FOR VARIOUS INPUT
OVEERDRIVES
15
2
3
t - Time - µ s
4
OUTPUT SATURATION VOLTAGE
V ± = ±15 V
0.8
V+
10
0.7
VI
−
+
5
20 mV
VO
2 kΩ
5 mV
V−
2 mV
−15
100
10
Overdrive = 2 mV
0
−10
0.6
VOL - Saturation Voltage - V
Vo - Output Voltage - V
−
+
−5
−100
−100
VI - Input Voltage - mV
0.6
RESPONSE TIME FOR VARIOUS INPUT
OVEERDRIVES
3
−10
20 mV
0.4
0.2
t - Time - µ s
V± = ±15 V
−5
VO
VID - Differential Input Voltage - mV
5
0
500 Ω
−
+
100
0
4
+5 V
0
30
VI - Input Voltage - mV
VO - Output Volgate - V
50
Vo - Output Voltage - V
TRANSFERFUNCTION
60
0.5
0.4
0.3
0.2
0.1
5 mV
−20
0
20 mV
0
1
2
3
4
10
20
30
40
50
IO - Output Current - mA
t - Time - µ s
Data Sheet G15945EJ4V0DS
5
µPC311
OUTPUT LIMITING CHARACTERISTICS
SUPPLY CURRENT
140
0.5
WE
PO
0.4
80
60
0.3
40
0.2
SHORT CIRCUIT
CURRENT
20
±
O
RC
100
5
I - Supply Current - mA
U
NS
0.6
Power Consumption - W
IOshort - Short Circuit Current - mA
T
MP
6
PLY
SUP
ITIVE
POS UT LOW
P
OUT
N
IO
120
0.7
4
AND LY
PP
ITIVE
POS TIVE SU
A
NEG UT HIGH
P
OUT
3
2
1
0.1
0
0
5
10
15
0
5
VO - Output Voltage - V
SUPPLY CURRENT
±
4
POSITIVE AND
NEGATIVE SUPPLY
OUTPUT HIGH
20
30
40
50
60
70
80
IOLEAK - Leakage Current - A
I ±- Suply Current - mA
POSITIVE SUPPLY
OUTPUT LOW
10
30
OUTPUT
VO = 40 V
−9
10
INPUT
VI = 15 V
10−10
10−11
25
TA - Operating Ambient Temperature - C
6
25
±
V = ±15 V
= ±15 V
6
0
20
LEAKAGE CURRENTS
10−8
8
2
15
V - Supply Voltage- V
10
V
10
+
Data Sheet G15945EJ4V0DS
35
45
55
65
TA - Operating Ambient Temperature - C
75
µPC311
PACKAGE DRAWINGS (Unit : mm)
8-PIN PLASTIC DIP (7.62mm(300))
8
5
1
4
A
K
J
L
P
I
C
H
G
B
M
R
F
D
N
M
NOTES
1. Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
2. ltem "K" to center of leads when formed parallel.
ITEM
MILLIMETERS
A
B
10.16 MAX.
1.27 MAX.
C
2.54 (T.P.)
D
0.50±0.10
F
1.4 MIN.
G
H
3.2±0.3
0.51 MIN.
I
J
4.31 MAX.
5.08 MAX.
K
7.62 (T.P.)
L
6.4
M
0.25 +0.10
−0.05
N
0.25
P
0.9 MIN.
R
0∼15°
P8C-100-300B,C-2
Data Sheet G15945EJ4V0DS
7
µPC311
8-PIN PLASTIC SOP (5.72 mm (225))
8
5
detail of lead end
P
4
1
A
H
F
I
G
J
S
B
C
D
M
L
N
K
S
M
E
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
A
5.2 +0.17
−0.20
B
0.78 MAX.
C
1.27 (T.P.)
D
0.42 +0.08
−0.07
E
0.1±0.1
F
1.59±0.21
G
1.49
H
6.5±0.3
I
4.4±0.15
J
1.1±0.2
K
0.17 +0.08
−0.07
L
0.6±0.2
M
0.12
N
0.10
P
3° +7°
−3°
S8GM-50-225B-6
8
Data Sheet G15945EJ4V0DS
µPC311
RECOMMENDED SOLDERING CONDITIONS
The µPC311 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
µPC311G2: 8-pin plastic SOP (5.72 mm (225))
Process
Infrared Ray Reflow
Conditions
Symbol
Peak temperature: 230°C or below (Package surface temperature),
IR30-00-1
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 1 time.
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
VP15-00-1
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 1 time.
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Partial Heating Method
Pin temperature: 300°C or below,
–
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µPC311C: 8-pin plastic DIP (7.62 mm (300))
Process
Wave Soldering
Conditions
Solder temperature: 260°C or below,
(only to leads)
Flow time: 10 seconds or less.
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
Data Sheet G15945EJ4V0DS
9
µPC311
• The information in this document is current as of March, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1