Download BAV170...

BAV170...
Silicon Low Leakage Diode Array
• Low-leakage applications
• Medium speed switching times
• Pb-free (RoHS compliant) package 1)
• Qualified according AEC Q101
BDTIC
BAV170
!
,
, Type
Package
Configuration
Marking
BAV170
SOT23
common cathode
JXs
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Diode reverse voltage
VR
80
Peak reverse voltage
VRM
85
Forward current
IF
200
Non-repetitive peak surge forward current
IFSM
Value
Unit
V
mA
A
t = 1 µs
4.5
t=1s
0.5
Ptot
250
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
Thermal Resistance
Parameter
Symbol
Value
Unit
Junction - soldering point 2)
RthJS
≤ 460
K/W
Total power dissipation
TS ≤ 35°C
-65 ... 150
BAV170
1Pb-containing
2For
package may be available upon special request
calculation of RthJA please refer to Application Note Thermal Resistance
1
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2007-04-19
BAV170...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Unit
Parameter
min.
typ. max.
DC Characteristics
85
V
Breakdown voltage
V(BR)
I(BR) = 100 µA
Reverse current
IR
nA
VR = 75 V
-
-
5
VR = 75 V, TA = 150 °C
-
-
80
Forward voltage
mV
VF
BDTIC
IF = 1 mA
-
-
900
IF = 10 mA
-
-
1000
IF = 50 mA
-
-
1100
IF = 150 mA
-
-
1250
CT
-
2
-
pF
trr
-
0.6
1.5
µs
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz
Reverse recovery time
IF = 10 mA, IR = 10 mA, measured at IR = 1mA,
RL = 100 Ω
Test circuit for reverse recovery time
D.U.T.
ΙF
Pulse generator: tp = 10µs, D = 0.05, tr = 0.6ns,
Ri = 50Ω
Oscillograph
Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF
EHN00019
2
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2007-04-19
BAV170...
Reverse current IR = ƒ (TA)
Forward Voltage VF = ƒ (TA)
IF = Parameter
VR = 70V
10 2
ΙR
BAV 170
EHB00080
BAV 170
1.5
nA
EHB00083
V
max
VF
10 1
Ι F = 150 mA
1.0
10 0
50 mA
BDTIC
10 mA
typ
1 mA
10 -1
0.1 mA
0.5
10-2
10-3
0
50
100
˚C
0
150
0
50
100
TA
Forward current IF = ƒ (T S)
TA = 25°C
BAV170
EHB00081
250
mA
mA
200
175
100
IF
ΙF
BAV 170
150
TA
Forward current IF = ƒ (VF)
150
˚C
typ
max
150
125
100
50
75
50
25
0
0
0.5
1.0
V
0
0
1.5
15
30
45
60
75
90 105 120 °C
150
TS
VF
3
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2007-04-19
BAV170...
Permissible Puls Load RthJS = ƒ (tp)
Permissible Pulse Load
IFmax / I FDC = ƒ (t p)
10 2
I Fmax/IFDC
10 3
RthJS
10 2
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-
BDTIC
10 1
10 1
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0
10 0
10 -1 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
10 0 -7
10
0
10
-6
10
-5
10
-4
TP
10
-3
10
-2
s
10
0
TP
4
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2007-04-19
Package SOT23
BAV170...
0.4 +0.1
-0.05
1)
2
0.08...0.1
C
0.95
1.3 ±0.1
1
2.4 ±0.15
3
0.1 MAX.
10˚ MAX.
B
1 ±0.1
10˚ MAX.
2.9 ±0.1
0.15 MIN.
Package Outline
A
5
0...8˚
1.9
0.2
0.25 M B C
M
A
BDTIC
1) Lead width can be 0.6 max. in dambar area
Foot Print
0.8
0.9
1.3
0.9
0.8
1.2
Marking Layout (Example)
Manufacturer
EH s
2005, June
Date code (YM)
Pin 1
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
8
2.13
2.65
0.9
Pin 1
1.15
3.15
5
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2007-04-19
BAV170...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
BDTIC
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
6
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2007-04-19