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Transcript
DDTA144ELP
PNP PRE-BIASED (R1=R2) SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
Mechanical Data
•
•
•
•
•
•
•
•
Epitaxial Planar Die Construction
Ultra-Small Leadless Surface Mount Package
Ideally Suited for Automated Assembly Processes
“Lead Free”, RoHS Compliant (Note 1)
Halogen and Antimony Free "Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Part Number
DDTA144ELP
R1 (NOM)
47K
R2 (NOM)
47K
Case: DFN1006-3
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish — NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.0009 grams (approximate)
•
•
•
Marking
P2
DFN1006-3
C
IN
B
1
E
R1
R2
C 3
Top View
Pin-Out
IN
B
1
3
C OUT
(or -supply)
E
E
2
Bottom View
OUT
(or -supply)
2
B
+ Supply
or GND
Device Symbol
GND (or +supply)
Equivalent Inverter
Circuit
Ordering Information (Note 3)
Product
DDTA144ELP-7
DDTA144ELP-7B
Notes:
Marking
P2
P2
Reel size (inches)
7
7
Tape width (mm)
8
8
Quantity per reel
3,000
10,000
1. No purposefully added lead.
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DDTA144ELP-7
DDTA144ELP-7B
P2
P2
Top View
Dot Denotes
Collector Side
Top View
Bar Denotes Base
and Emitter Side
P2 = Product Type Marking Code
www.BDTIC.com/DIODES
DDTA144ELP
Document number: DS30844 Rev. 6 - 2
1 of 5
www.diodes.com
June 2011
© Diodes Incorporated
DDTA144ELP
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
VCC
VIN
IC(MAX)
Supply Voltage
Input Voltage
Output Current (Io)
Value
-50
+10 to -40
-200
Unit
V
V
mA
Value
250
2
Unit
mW
mW/°C
RθJA
500
°C/W
TJ, TSTG
-55 to +150
°C
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Power Dissipation (Note 4)
Power Deration above 25°C
Thermal Resistance, Junction to Ambient Air (Note 4)
(Equivalent to one heated junction of PNP)
Operating and Storage Temperature Range
Electrical Characteristics
Characteristic
Off Characteristics (Notes 5 & 6)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Base Cutoff Current (IBEX)
Collector-Base Cut Off Current
Collector-Emitter Cut Off Current, IO(off)
Emitter-Base Cut Off Current
Input Off Voltage
On Characteristics (Notes 5 & 6)
Input-On Voltage
Input Current
DC Current Gain
Output On Voltage
(Collector-Emitter Saturation Voltage)
Input Resistance
Resistance Ratio
Small Signal Characteristics
Current Gain-Bandwidth Product
Notes:
Symbol
PD
Pder
@TA = 25°C unless otherwise specified
Symbol
Min
Typ
Max
Unit
BVCBO
BVCEO
BVEBO
ICEX
IBL
ICBO
ICEO
IEBO
VI(off)
-50
-50
-4.5
⎯
⎯
⎯
⎯
⎯
-300
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
-100
-60
-100
-100
-100
⎯
V
V
V
nA
μA
nA
nA
μA
mV
IC = -10μA, IE = 0
IC = -1.0mA, IB = 0
IE = -100μA, IC = 0
VCE = -50V, VEB(OFF) = 3.0V
VCE = -50V, VEB(OFF) = 3.0V
VCB = -50V, IE = 0
VCE = -50V, IB = 0
VEB = -4V, IC = 0
VCC = -5V, IO = -100uA
VI(on)
II
R1
(R2/R1)
⎯
⎯
90
120
150
100
180
250
⎯
⎯
33
0.8
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
47
1.0
-3.0
-7.2
⎯
⎯
⎯
⎯
⎯
⎯
-150
-800750
61
1.2
V
mA
⎯
⎯
⎯
⎯
⎯
⎯
mV
mV
KΩ
⎯
VO = -0.3V, IO = -5mA
VI = -5V
VCE =-5V, IC = -2.5mA
VCE = -5V, IC = -5mA
VCE = -5V, IC = -10mA
VCE = -5V, IC = -100mA
VCE = -5V, IC = -200mA
VCE = -5V, IC = -300mA
II = -1mA, IO = -10mA
II = -1mA, IO = -450mA
⎯
⎯
fT
⎯
250
⎯
MHz
VCE = -10V, IE = -5mA, f = 100 MHz
hFE
VO(on)
Test Condition
4. Device mounted on FR-4 PCB, 1” x 0.85” x 0.062”.
5. Short duration pulse test used to minimize self-heating effect. Pulse Test: Pulse width tp<300 uS, Duty Cycle, d<=2%.
6. Guaranteed by design.
www.BDTIC.com/DIODES
DDTA144ELP
Document number: DS30844 Rev. 6 - 2
2 of 5
www.diodes.com
June 2011
© Diodes Incorporated
DDTA144ELP
300
TA = 150 °C
Note 4
250
hFE, DC CURRENT GAIN
PD, POWER DISSIPATION (mW)
VCE = -5V
200
150
100
0
25
50
75
100
125
150 175
TA, AMBIENT TEMPERATURE (° C)
Fig. 1 Power Dissipation vs. Ambient Temperature
10
100
1,000
1
IC, COLLECTOR CURRENT (mA)
Fig. 2 Typical DC Current Gain vs. Collector Current
0.1
IC, COLLECTOR CURRENT (A)
0.09
1
TA = 85 °C
0.1
TA = 150 °C
TA = -55 °C
T A = 25 °C
0.07
IB = 0.3mA
IB = 0.25mA
0.06
0.05
IB = 0.2mA
0.04
IB = 0.15mA
0.03
0.02
IB = 0.1mA
IB = 0.05mA
0
15
4
13.5
3.7
TA = -55 °C
2
4
6
8
VCE, COLLECTOR EMITTER VOLTAGE (V)
Fig. 4 Typical Collector Emitter Voltage
vs. Collector Current
10
VO = 0.3V
IO = 5mA
VI(ON), INPUT VOLTAGE (V)
3.4
10.5
TA = 25 °C
7.5
6
4.5
3
IB = 0.35mA
0
1
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 3 Typical Collector Emitter Saturation Voltage
vs. Collector Current
9
IB = 0.4mA
0.08
0.01
0.01
0.1
12
IB = 0.5mA
IB = 0.45mA
IC/IB = 10
VCE(SAT), COLLECTOR EMITTER
SATURATION VOLTAGE (V)
T A = -55 °C
0.1
10
VBE, BASE EMITTER VOLTAGE (V)
TA = 25 °C
RθJA = 500 °C/W
50
0
TA = 85 °C
TA = 85 °C
3.1
2.8
2.5
2.2
1.9
1.6
1.3
1.5
0
0.1
TA = 150 °C
1
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 5 Typical Base Emitter Voltage vs. Collector Current
1
-60
-30
0
30
60
90
120
150
TA, AMBIENT TEMPERATURE (°C)
Fig. 6 Typical Input Voltage vs. Ambient Temperature
www.BDTIC.com/DIODES
DDTA144ELP
Document number: DS30844 Rev. 6 - 2
3 of 5
www.diodes.com
June 2011
© Diodes Incorporated
DDTA144ELP
30
IC/IB = 10
27
TA = -55 °C
VBE(SAT), BASE EMITTER
SATURATION VOLTAGE (V)
24
T A = 25 °C
21
18
TA = 85 °C
15
12
TA = 150 °C
9
6
3
0
0.1
1
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 7 Typical Base Emitter Saturation Voltage
vs. Collector Current
Package Outline Dimensions
A
DFN1006-3
Dim Min
Max Typ
A
0.47
0.53 0.50
A1
0
0.05 0.03
b1
0.10
0.20 0.15
b2
0.45
0.55 0.50
D
0.95 1.075 1.00
E
0.55 0.675 0.60
e
0.35
⎯
⎯
L1
0.20
0.30 0.25
L2
0.20
0.30 0.25
L3
0.40
⎯
⎯
All Dimensions in mm
A1
D
b1
E
e
b2
L2
L3
L1
Suggested Pad Layout
C
X1
X
G2
G1
Y
Z
Dimensions
Z
G1
G2
X
X1
Y
C
Value (in mm)
1.1
0.3
0.2
0.7
0.25
0.4
0.7
www.BDTIC.com/DIODES
DDTA144ELP
Document number: DS30844 Rev. 6 - 2
4 of 5
www.diodes.com
June 2011
© Diodes Incorporated
DDTA144ELP
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
www.BDTIC.com/DIODES
DDTA144ELP
Document number: DS30844 Rev. 6 - 2
5 of 5
www.diodes.com
June 2011
© Diodes Incorporated