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Single-chip Type with built-in FET Switching Regulator Series Simple Step-down Switching Regulators with Built-in Power MOSFET No.10027EAT43 BD9859EFJ ●Summary Output 3.0A and below High Efficiency Rate Step-down Switching Regulator Power MOSFET Internal Type BD9859EFJ mainly used as secondary side Power supply, for example from fixed Power supply of 9V, 12V etc, Step-down Output of 1.2V/1.8V/3.3V/5V, etc, can be produced. This IC has external Coil/Capacitor down-sizing through 750kHz High Frequency operation, inside Nch-FET SW for 15V “withstand-pressure” commutation and also, High Speed Load Response through Current Mode Control is a simple external setting Phase compensation System, through a wide range external constant, a compact Power supply can be produced easily. ●Features 1) 2) 3) 4) 5) 6) 7) 8) Internal 100 mΩ Nch MOSFET Output Current 3A Oscillation Frequency 750kHz Feedback Voltage 1.0V±1.0% Internal Soft Start Function Internal Over Current Protect Circuit, Low Input Error Prevention Circuit, Heat Protect Circuit ON/OFF Control through EN Pin (Standby Current 0μA Typ.) Package :HTSOP-J8 Package ●Uses For Household machines in general that have 9V/12V Lines, etc. ●Operating Conditions (Ta=25℃) Item Symbol Voltage Range Unit Power supply Voltage VCC 5.0~14 V Output Voltage VOUT 1.0 V ●Absolute Maximum Rating Item Symbol Rating Unit Maximum Application Power supply Voltage VCC 15 V Between BST – GND VBST 22 V Between BST – Lx ⊿VBST 7 V Between EN – GND VEN 15 V Between Lx – GND VLx 15 V Between FB – GND VFB 7 V Between VC – GND VC 7 V Highside NchFET Drain Current IDH 3 A Power Dissipation Pd 3.76 W Operating Temperature Range Topr -40~+85 ℃ Storage Temperature Range Tstg -55~+150 ℃ Junction Temperature Tjmax 150 ℃ (*1)During mounting of 70×70×1.6t mm 4layer board (Copper area:70mm×70mm).Reduce by 30.08mW for every 1℃ increase. (Above 25℃) www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 1/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Electrical Characteristics (Unless otherwise specified, Ta=25℃,VCC=12V, Vo=5V,EN=3V) Item Symbol Min Rating Value Typ Max Unit Conditions 【Circuit Current】 Circuit Current during Standby Ist - 0 10 uA VEN=0V Circuit Current during Operation Icc - 2.8 5.6 mA FB=1.2V 【Low Voltage Input Error Prevention Circuit】 Detect Threshold Voltage Vuv 4.2 4.4 4.6 V Vuvhy - 200 400 mV fosc 675 750 825 kHz Dmax 75 85 95 % FB Pin Threshold Voltage VFB 0.990 1.000 1.010 V FB Pin Input Current IFB -1.0 0 1.0 uA Hysteresis Width 【Oscillator】 Oscillation Frequency Max Duty Cycle 【Error Amp】 Mutual Conductance Gm 70 140 280 uA/V Soft Start Time Tsoft 2.0 4.0 6.0 ms High Side Nch FET ON Resistance RonH - 100 200 mΩ Nch FET ON Resistance for Pre-Charge RonL - 5 10 Ω Over Current Detect Current Iocp 3.5 5.5 - A ON VENON 2.0 - 14 V OFF VENOF F -0.3 - 0.3 V REN 2.5 7.5 15 uA VFB=0V IVC=±10uA,VC=1.5V 【Output-part】 【CTL】 EN Pin Threshold Voltage EN Pin Input Current VEN=3V ◎Not designed to withstand radiation. ●Pin Description Pin No. Pin Name Function 1 Lx 2 GND 3 VC Error Amp Output Pin 4 FB Output Voltage Return Pin 5 EN ON/OFF Control Pin 6 BST Capacitor Connection Pin for Bootstrap 7 VCC Power supply Voltage Pin 8 VCC Power supply Voltage Pin NMOSFET Source Pin Ground Pin Fig.1 Pin Layout Diagram www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 2/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Block Diagram ON/OFF EN VCC TSD UVLO Reference REG VREF ICOMP shutdown FB 1.0V BST Σ ERROR - AMP + + R Q S 100mΩ Lx Soft Start VOUT 5Ω GND OSC 750kHz VC Fig.2 Block Diagram www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 3/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Block Description 1. Reference This Block generates Error Amp Standard Voltage. Standard Voltage is 1.0V. 2. REG This is a Gate Drive Voltage Generator and 5VLow Saturation regulator for internal Circuit Power supply. 3. OSC This is a precise wave Oscillation Circuit with Operation Frequency fixed to 750kHz fixed. 4. Soft Start A Circuit that does Soft Start to the Output Voltage of DC/DC Comparator, and prevents Rush Current during Start-up. Soft Start Time is set at IC internal, after 4mSecs from starting-up EN Pin, Standard Voltage comes to 1.0V, and Output Voltage becomes set Voltage. 5. ERROR AMP This is an Error amplifier what detects Output Signal, and outputs PWM Control Signal. Internal Standard Voltage is set to 1.0V. Also, C and R are connected between the Output (VC) Pin GND of Error Amp as Phase compensation elements. (See Page11) 6. ICOMP This is a Voltage-Pulse Width Converter that controls Output Voltage in response to Input Voltage. This compares the Voltage added to the internal SLOPE waveform in response to the FET WS Current with Error amplifier Output Voltage, controls the width of Output Pulse and outputs to Driver. 7. Nch FET SW This is an internal commutation SW that converts Coil Current of DC/DC Comparator. It contains 15V”withstand pressure” 100mΩSW. Because the Current Rating of this FET is 3.0A, including Ripple Current of DC Current+Coil, please use at within 3.0A 8. UVLO This is a Low Voltage Error Prevention Circuit. This prevents internal circuit error during increase of Power supply Voltage and during decline of Power supply Voltage. It monitors VCC Pin Voltage and internal REG Voltage、And when VCC Voltage becomes 4.4V and below, it turns OFF all Output FET and turns OFF DC/DC Comparator Output, and Soft Start Circuit resets. Now this Threshold has Hysteresis of 200mV. 9. TSD This is a Heat Protect (Temperature Protect) Circuit. When it detects an abnormal temperature exceeding Maximum Junction Temperature (Tj=150℃), it turns OFF all Output FET, and turns OFF DC/DC Comparator Output. When Temperature falls, it has/with Hysteresis and automatically returns. 10. EN With the Voltage applied to EN Pin(5pin), IC ON/OFF can be controlled. When a Voltage of 2.0V or more is applied, it turns ON, at Open or 0V application, it turns OFF. About 400kΩ Pull-down Resistance is contained within the Pin. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 4/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Reference Data (Unless otherwise specified, Ta=25℃,VCC=12V, Vo=5V,EN=3V) 6 6 0.5 5 5 0.4 4 0.3 0.2 VCC=14V 3 2 VCC=12V 0.1 Temp=85℃ Temp=25℃ -40 -20 0 20 40 60 80 100 3 VCC=7V VCC=5V 1 0 0 Temp (°C) VCC=12V 2 Temp=-40℃ VCC=7V 1 0.0 -60 VCC=15V 4 ICC(mA) ICC(mA) ICC (uA) 0.6 0 5 10 VCC(V) -60 -40 -20 0 20 40 60 Temperature(°C) 15 80 100 Fig.3. Standby Current Temperature Fig.4. Circuit Current Power supply Voltage Fig.5. Circuit Current Characteristics Characteristics Temperature Characteristics 6.0 800 High Threshold VCC=14V Low Threshold 3.0 2.0 600 VCC=12V VCC=7V 500 Max_Duty (%) 4.0 OSC_freq (KHz) UVLO_th (V) 5.0 120.0 700 400 300 200 100.0 80.0 VCC=14V VCC=12V VCC=7V 60.0 1.0 100 0.0 -60 -40 -20 0 20 40 60 80 0 -60 100 -40 -20 Temp (°C) 0 20 40 60 80 40.0 -60 100 -40 -20 Temp (°C) 0 20 40 60 80 Fig.6. UVLO Threshold Fig.7. Oscillation Frequency Fig.8. Max Duty Temperature Temperature Characteristics Temperature Characteristics Characteristics 1.2 1.2 1.0 1.0 100 Temp (°C) 50 40 Temp=85°C Temp=25°C Temp=-40°C 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0.0 -60 0.0 Temp=25°C 20 I_VC (uA) VCC=12V VCC=7V VFB (V) VFB (V) 0.8 Temp=-40°C 30 VCC=14V 10 Temp=85°C 0 -10 -20 -30 -40 -40 -20 0 20 40 60 80 100 Temp (°C) Fig.9. FB Threshold Voltage Temperature Characteristics www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ -50 0 5 10 15 VCC (V) Fig.10. FB Threshold Power supply Characteristics 5/15 0 0.5 1 1.5 2 VFB (V) Fig.11. FB Voltage - IVC Current Characteristics 2010.02 - Rev.A Technical Note BD9859EFJ 6.0 360 1 00 Temp=-40°C 300 5.0 Temp=25°C 4.0 3.0 VCC=14V VCC=12V VCC=7V 2.0 Ta=25℃ 60 40 -20 0 20 40 60 80 Temp=85°C 180 120 60 0 0 -40 240 Ta=-40℃ 20 1.0 0.0 -60 Ta=85℃ I_LX (mA) △ VCC-VLx[mV] SS_Time (ms) 80 100 0 20 0 40 0 Temp (°C) 60 0 800 0 1 00 0 2 4 6 8 10 12 V_LX (V) ILx[mA] Fig.12. Soft Start Time Temperature Fig.13. Nch FET ON Resistance Fig.14. Pre-charge FET ON Resistance Characteristics Temperature Characteristics Temperature Characteristics 10.0 VCC=12V VEN_th (V) Iocp (A) 8.0 VCC=14V 6.0 VCC=8V 4.0 12.0 2.0 10.0 1.6 8.0 1.2 0.8 0.4 2.0 0.0 -60 2.4 REN (uA) 12.0 -40 -20 0 20 40 60 80 100 0.0 -60 -40 -20 0 20 40 60 80 100 Temp (°C) Fig.15 OCP Detect Current Fig.16. EN Threshold Temperature Temperature Characteristics Characteristics www.rohm.com 4.0 2.0 Temp (°C) c 2010 ROHM Co., Ltd. All rights reserved. ○ 6.0 6/15 0.0 -60 -40 -20 0 20 40 60 80 100 Temp (°C) Fig.17. EN Pin Influx Current 2010.02 - Rev.A Technical Note BD9859EFJ ●Example of Reference Application Circuit (Input 12V, Output 5.0V/ 2.5A) CBST 0.022 uF JEN VBAT 0 Ω SW CBAT 22 uF/ 16V GRM31CB31C226KE15 (murata) 4.7 uH (FDV0630 - 4R7M) VCC VCC BST EN Lx GND VC FB REN 0Ω CEN open EN 10 uF/ 6.3V GRM219B30J106KE18 (murata) L VOUT COUT CC2 RFRA 0Ω RINV1 120 kΩ RINV2 30 kΩ 1000 pF RC open 7.5 kΩ RSX301-LA30 (ROHM) (Example of Reference Application Circuit) Transformation Efficiency η [%] ●Reference Application Data CC1 D 100.0 80.0 VCC=7V VCC=10V 60.0 VCC=12V VCC=14V 40.0 20.0 0.0 0 500 1000 1500 2000 2500 3000 Load Current Io [mA] Fig.19 Electric Power Conversion www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 7/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Reference Application Data (Example of Reference Application Circuit) Gain [dB] Phase [deg] 40 90 Gain [dB] Phase [deg] 40 90 Phase Phase Gain 0 -40 100 10k Frequency[kHz] Gain 0 0 -90 -40 1M 100 Phase 0 -90 10k Gain Frequency[kHz] 1M Fig.20 Frequency Response Fig.21 Frequency Response Fig.22 Load Response Characteristics Characteristics(Io=1.5A) Characteristics (Io=3.0A) (Io=0A→3A) Fig.23 Load Response Characteristics Fig.24 Operation Waveform Fig.25 Stop Waveform (Io=3A→0A) www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 8/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Evaluation Board Pattern (Reference) VOUT Lx VBAT GND Fig.26 Evaluation Board Pattern ・ ・ Please make the Heat radiation plate of the Bottom layer to a plane of Low Impedance. Because large currents low into the lines of VCC, Lx, PGND, please make the patterns as thick as much as possible. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 9/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Application Components Selection Method (1)Inductor Something of the shield Type that Fulfills the Current Rating (Current value Ipecac below), with low DCR (Direct Current Resistance element) is recommended. Value of Inductor influences Inductor Ripple Current and becomes the cause of Output Ripple. In the same way as the formula below, this Ripple Current can be made small for as big as the L value of Coil or as high as the Switching Frequency. Ipeak =Iout + ⊿IL/2 [A] ⊿IL= Vin-Vout × Vout (1) × Vin L 1 [A] Δ IL (2) Fig.27 Inductor Current f (η:Efficiency、⊿IL:Output Ripple Current、f:Switching Frequency ) For design value of Inductor Ripple Current, please carry out design tentatively with about 20%~50% of Maximum Input Current. ※When current that exceeds Coil rating flows to the coil, the Coil causes a Magnetic Saturation, and there are cases wherein a decline in efficiency, oscillation of output happens. Please have sufficient margin and select so that Peak Current does not exceed Rating Current of Coil. (2)Output Capacitor In order for Capacitor to be used in Output to reduce Output Ripple, Low Ceramic Capacitor of ESR is recommended. Also, for Capacitor Rating, on top of putting into consideration DC Bias Characteristics, please use something whose Maximum Rating has sufficient margin with respect to the Output Voltage. Output Ripple Voltage is looked for using the following formula. 1 Vpp=⊿IL× + ⊿IL×RESR [V] ・・・ (3) 2π×f×Co Please design in a way that it is held within Capacity Ripple Voltage. (3)Output Voltage Setting ERROR AMP internal Standard Voltage is 1.0V.Output Voltage is determined as seen in (4) formula. VOUT ERROR AMP R1 (R1+R2) FB Vo= R2 R2 ×1.0 [V] ・・・ (4) VREF 1.0V Fig.28 Voltage Return Resistance Setting Method (4)Boost Capacitor Please connect CBST=0.022uF(Laminate Ceramic Capacitor) between BST Pin-Lx Pins as Output capacitors of Gate Drive Voltage Generator REG(5V). www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 10/15 2010.02 - Rev.A Technical Note BD9859EFJ (5)About Adjustment of DC/DC Comparator Frequency Characteristics Role of Phase compensation element CC1、CC2,RC (See P.7Example of Reference Application Circuit) Stability and Responsiveness of Loop are controlled through VC Pin which is the output of Error Amp. The combination of zero and ball that determines Stability and Responsiveness is adjusted by the combination of resistor and capacitor that are connected in series to the VC Pin. DC Gain of Voltage Return Loop can be calculated for using the following formula. Adc Rl Gcs A EA V FB Vout Here, VFB is Feedback Voltage(1.0V).AEA is Voltage Gain of Error amplifier(typ : 60dB), Gcs is the Trans-conductance of Current Detect(typ : 6A/V), and Rl is the Output Load Resistance value. There are 2 important balls in the Control Loop of this DC/DC. The first occurs with/ through the output resistance of Phase compensation Capacitor (CC1) and Error amplifier. The other one occurs with/through the Output Capacitor and Load Resistor. These balls appear in the frequency written below. fp1 GEA 2π CC1 AEA fp2 1 2π COUT Rl Here、GEA is the trans-conductance of Error amplifier(typ : 140uA/V). Here、in this Control Loop, one zero becomes important. With the zero which occurs because of Phase compensation Capacitor CC1 and Phase compensation Resistor RC, the Frequency below appears. fz1 1 2π CC1 RC Also, if Output Capacitor is big, and that ESR (RESR) is big, in this Control Loop, there are cases when it has an important, separate zero (ESR zero). This ESR zero occurs due to ESR of Output Capacitor and Capacitance, and exists in the Frequency below. fzESR 1 2π COUT RESR (ESR zero) In this case, the 3rd ball determined with the 2nd Phase compensation Capacitor (CC2) and Phase Correction Resistor (RC) is used in order to correct the ESR zero results in Loop Gain. This ball exists in the frequency shown below. fp3 1 2π CC2 RC (Ball that corrects ESR zero) The target of Phase compensation design is to create a communication function in order to acquire necessary band and Phase margin. Cross-over Frequency (band) at which Loop gain of Return Loop becomes “0” is important. When Cross-over Frequency becomes low, Power supply Fluctuation Response, Load Response, etc worsens. On the other hand, when Cross-over Frequency is too high, instability of the Loop can occur. Tentatively, Cross-over Frequency is targeted to be made 1/20 or below of Switching Frequency. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 11/15 2010.02 - Rev.A Technical Note BD9859EFJ Selection method of Phase Compensation constant is shown below. 1. Phase Compensation Resistor (RC) is selected in order to set to the desired Cross-over Frequency. Calculation of RC is done using the formula below. RC 2π COUT fc Vout 2π COUT 0.1 fs Vout < GEA GCS VFB GEA GCS VFB Here, fc is the desired Cross-over Frequency. It is made about 1/20 and below of the Normal Switching Frequency (fs). 2. Phase compensation Capacitor (CC1) is selected in order to achieve the desired phase margin. In an application that has a representative Inductance value (about several uH~20uH), by matching zero of compensation to 1/4 and below of the Cross-over Frequency, sufficient Phase margin can be acquired.CC1 can be calculated using the following formula. CC1> 4 2π RC fc RC is Phase compensation Resistor. 3. Examination whether the second Phase compensation Capacitor CC2 is necessary or not is done. If the ESR zero of Output Capacitor exists in a place that is smaller than half of the Switching Frequency, a second Phase compensation Capacitor is necessary. In other words, it is the case wherein the formula below happens. 1 fs < 2π COUT RESR 2 In this case, add the second Phase compensation Capacitor CC2, and match the frequency of the third ball to the Frequency fp3 of ESR zero. CC2 is looked for using the following formula. CC2 COUT RESR RC www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 12/15 2010.02 - Rev.A Technical Note BD9859EFJ ●I/O Equivalent Schematic Pin. No Pin Name 1 Lx 2 GND 6 BST 7 VCC 8 VCC Pin. No Pin Equivalent Schematic Pin Name Pin Equivalent Schematic VCC 4 FB FB GND VCC VCC VC 3 EN VC 5 GND www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ EN GND 13/15 2010.02 - Rev.A Technical Note BD9859EFJ ~ ~ ●Cautions for Use (1)About Absolute Maximum Rating When the absolute maximum ratings of application voltage, operating temperature range, etc. was exceeded, there is possibility of deterioration and destruction. Also, the short Mode or open mode, etc. destruction condition cannot be assumed. When the special mode where absolute maximum rating is exceeded is assumed, please give consideration to the physical safety countermeasure for the fuse, etc. (2)About GND Electric Potential In every state, please make the electric potential of GND Pin into the minimum electrical potential. Also, include the actual excessive effect, and please do it such that the pins, excluding the GND Pin does not become the voltage below GND. (3)About Heat Design Consider the Power Dissipation (Pd) in actual state of use, and please make Heat Design with sufficient margin. (4)About short circuit between pins and erroneous mounting When installing to set board, please be mindful of the direction of the IC, phase difference, etc. If it is not installed correctly, there is a chance that the IC will be destroyed. Also, if a foreign object enters the middle of output, the middle of output and power supply GND, etc., even for the case where it is shorted, there is a change of destruction. (5)About the operation inside a strong electro-magnetic field When using inside a strong electro-magnetic field, there is a possibility of error, so please be careful. (6)Temperature Protect Circuit (TSD Circuit) Temperature Protect Circuit(TSD Circuit) is built-in in this IC. As for the Temperature Protect Circuit (TSD Circuit), because it a circuit that aims to block the IC from insistent careless runs, it is not aimed for protection and guarantee of IC. Therefore, please do not assume the continuing use after operation of this circuit and the Temperature Protect Circuit operation. (7)About checking with Set boards When doing examination with the set board, during connection of capacitor to the pin that has low impedance, there is a possibility of stress in the IC, so for every 1 process, please make sure to do electric discharge. As a countermeasure for static electricity, in the process of assembly, do grounding, and when transporting or storing please be careful. Also, when doing connection to the jig in the examination process, please make sure to turn off the power supply, then connect. After that, turn off the power supply then take it off. (8)About common impedance For the power supply and the wire of GND, lower the common impedance, then, as much as possible, make the ripple smaller (as much as possible make the wire thick and short、and lower the ripple from L・C), etc., then and please consider it sufficiently. (9)In the application, when the mode where the VCC and each pin electrical potential becomes reversed exists, there is a possibility that the internal circuit will become damaged. For example、during cases wherein the condition when charge was given in the external capacitor、 and the VCC was shorted to GND, it is recommended to insert the bypass diode to the diode of the back current prevention in the VCC series or the middle of each Pin-VCC. (10)About High-side NchFET Please use within 3A containing ripple current, because the absolute maximum rating of high-side NchFET is 3A. (11)About over current detection The detecting current is the current flowing through high-side NchFET. Output current containing ripple current, therefore the detecting current is the current of the output current containing ripple current. (12)About IC Pin Input This IC is a Monolithic IC、and between each element, it hasP+isolation for element separation and P board. With the N layer of each element and this , the P-N junction is formed、and the parasitic element of each type is composed. For example、like the diagram below、when resistor and transistor is connected to Pin, ○When GND>(PinA) in Resistor、 when GND>(PinA)、when GND>(Pin B) in Transistor (NPN), the P-N junction will operate as a parasitic diode. ○Also, during GND>(Pin B) in the Transistor (NPN), through the N layer of the other elements connected to the above-mentioned parasitic diode , the parasitic NPN Transistor will operation. On the composition of IC, depending on the electrical potential, the parasitic element will become necessary. Through the operation of the parasitic element interference of circuit operation will arouse, and error, therefore destruction can be caused. Therefore please be careful about the applying of voltage lower than the GND (P board) in I/O Pin, and the way of using when parasitic element operating. Transistor (NPN) Resistor B (Pin B) E C (Pin A) P P+ N N N P P+ P+ N N (Pin A) P+ N ~ ~ GND N P Substrate P Substrate Parasitic Element GND Parasitic Element Fig.29 Example of simple structure of Bipolar IC www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 14/15 GND 2010.02 - Rev.A Technical Note BD9859EFJ ●ORDER MODEL NAME B D 9 Device 8 5 9 E Debice Name F J Package type HFN : HTSOP-J8 - E 2 Taping model name E2: Reel-shape emboss taping MSOP8 <Tape and Reel information> 2.8±0.1 4.0±0.2 8 7 6 5 0.6±0.2 +6° 4° −4° 0.29±0.15 2.9±0.1 (MAX 3.25 include BURR) Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 1PIN MARK 1pin +0.05 0.145 −0.03 0.475 0.08±0.05 0.75±0.05 0.9MAX S +0.05 0.22 −0.04 0.08 S Direction of feed 0.65 (Unit : mm) www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ Reel 15/15 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.02 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001