Survey
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
Listing Number: 829 Automatic Optical Inspection Low cost, automated optical inspection system for a fast, high resolution production line inspection. Market Markets Test & Measurement Industrial Processes Process control Problem Solved by the Technology The technology enables a high resolution, high throughput, automated optical inspection of products in production line at much lower cost than existing systems. Typical inspection systems utilize collection of multiple images with different fields of view to detect defective products. To gain the high resolution and throughput, multiple expensive high resolution cameras with high pixel rates are needed. How the Technology Solves the Problem High resolution camera and an image scanning module with multiple objectives arranged to each have a field of view covering a portion of the inspected article. An image selection mirror sequentially transfers images from the multiple fields of views to the camera. The images captured by the camera are processed to detect defects in the article. Primary Application Inspection of semiconductor wafers, electrical devices, solar panels, flat panel displays such as LCD, plasma, FET, and printed circuit boards. Other Potential Applications The technology can be used to examine both large and small area articles. Inspection and control of any other production lines such as aerospace, cars, medical devices, printing and web substrates. Competitive Advantage High resolution High speed Low cost Modular Easily expanded for wider substrates Bolts onto existing equipment, or free standing Low Cost Advantage Multiple objectives shared by each camera Camera is the more expensive component High Precision Defects as small as 1 micron can be detected. Suitable for minimum features in the range of ~1 micron to 10’s of microns. Well suited for wafers, flat panel displays, printed circuit boards. Development Status Prototype built and demonstrated Intellectual Property Ownership IP is owned by the seller. There are no known liens or encumbrances. Patent Status U.S. patents are pending Deal Structure Sought The deal structure envisaged is the sale of this technology asset. Acquisition in 3 parts: Initial acquisition. Payment triggered when patents are issued. Royalties on product sales 3-5% Royalties Follow Up Please refer to Tynax listing number: 829 with regard to this opportunity. Inquiries should be directed to: Moshe Sarfaty [email protected] Thank You