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VLSI and ULSI
Group 4
Paul Grant, Michaela Womack, Avaniben Shah,
Earl Ashleigh Dela Cruz, Shawn Hutcherson
Integrated Circuits
● Also called a microchip
● Thousands of resistors, transistors, and
capacitors are on a tiny semiconductor
wafer
inside:
● die
outside:
● package
● gold wires connect the package to the die
● pins are located outside of the package
Integrated Circuits
●
Jack Kilby invented first integrated circuit
o
increased the number of components on a chip and
automated the process
●
Number of components put on an integrated circuit
is called the level of integration
●
o
Small Scale Integration (SSI) : 10 - 100 components
o
Medium Scale Integration (MSI): 100 - 1000 components
o
Large Scale Integration (LSI): 1000 - 10,000 components
o
Very Large Scale Integration (VLSI): more than 10,000 components
o
Ultra Large Scale Integration (ULSI) : more than 1,000,000 components
ICs allowed computers to become faster and cheaper
Very Large Scale Integration (VLSI)
● Marks the beginning of the fourth generation of
computers
● Chip contains hundreds of thousands of components
● Allowed Intel to produce the first microprocessor and
RAM chip, which lead to microcomputers
Ultra Large Scale Integration (ULSI)
Building blocks of Multitude!!
Block
Gate
Transistor
Device
Further Understanding ULSI
ULSI
SSI
Moore’s Law
● A computing term originated in 1965 by Gordon Moore, cofounder of Intel
o Density of transistors and computing power doubles every
18-24 months
● Economical Impact
o As more transistors fit into smaller spaces, processing power
increased and energy efficiency improved, making the chips
smaller, cheaper, faster and more powerful
Intel Processor Transistor Count vs. Transistor Size
1970-2000
2002-2015
Future of Moore’s Law: Moore’s Law vs. Law of
Physics
● Currently, the gap between the silicon channels on a transistors is 15 nM
● Expected to decrease to 5 nM within next decade
o Constraints with increasing number of transistors and decreasing
sizes
 Less heat resistant
 Quantum Tunneling: Data is corrupted while it is moving around
inside computer
o Alternatives to continue the growth of processing power
 Graphene: highly conductive material which lets electrons travel
across much faster than silicon
 More chips and multi-core processors
How Integrated Circuits are made
● Fabrication facility
● Process
Facility
● sterile environment “Clean room”
● Workers “Clean room suit”
Process
● Cylindrical ingot of silicon
● Photoresist
● Doping
o
o
Atomic diffusion
Ion implantation
References
●
Integrated Circuits. (n.d.). Retrieved April 1, 2015, from https://learn.sparkfun.com/tutorials/integrated-circuits
●
The History of the Integrated Circuit. (n.d.). Retrieved April 1, 2015, from
http://www.nobelprize.org/educational/physics/integrated_circuit
●
http://arstechnica.com/gadgets/2008/09/moore/
●
http://www.wired.com/2015/04/50-years-moores-law-still-pushes-tech-double/
●
http://www.mooreslaw.org/
●
http://www.intel.com/content/www/us/en/silicon-innovations/moores-law-technology.html