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Power and a New Class of Future FPGA Architectures Sinan Kaptanoglu Actel, Fellow A Rough Outline A historical look at FPGAs A new market driver? Future Technologies Future Design Methods Future Architectures 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 2 A Historical Look at FPGAs 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 3 Infancy (1985-1990) FPGAs were invented in the 1985-1987 time frame. ● Other programmable logic (PALs and PLDs) predate FPGAs by several years. Infancy period is marked by: ● Immature architectures and SW. ● Too small, too slow, and too expensive for anything other than glue logic. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 4 Childhood (1990-1994) Very exciting and inventive years. ● Many startups, many new architectures. ● PLDs grew into CPLDs and temporarily challenged the FPGAs. ● FPGAs grew bigger, faster and cheaper. ● Software became much better. ● Synthesis replaced schematic capture. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 5 But… By and large, FPGAs were still limited to doing glue logic. ● For most applications, FPGAs were still not big enough, fast enough, or easy enough to design with. The IC industry was driven by the PCs, in which FPGAs played no role at all. In 1993, it looked like the entrenched ASICs would not budge at all. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 6 Then something new came… Something that profoundly changed the FPGA landscape. ● It was NOT a fantastic new FPGA architecture… ● It was NOT a great and totally unexpected breakthrough in technology. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 7 It was a new market for FPGAs “The Internet Age” had begun. ● The rapidly growing datacom/telecom markets valued design flexibility and quick time-to-market more than cost or performance. ● Suddenly, everybody needed bigger and faster routers and base infrastructure. ● Development cycles for datacom were shrunk to mere months. ● The volumes were low (not in millions). 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 8 Datacom/telecom and FPGAs FPGAs and datacom/telecom ideally suited each other, and they mutually drove each other’s boom: ● FPGAs provided the needed flexibility and made new datacom/telecom products possible in short development cycles. ● Datacom/telecom rapidly increased the FPGA revenues, starting a boom. ● New applications ignited a rapid increase in the density and performance of FPGAs. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 9 The young adult years (1995-2001) The datacom/telecom markets grew very rapidly, and their share of the programmable market grew with it. ● Communication’s share was less than 10% in 1994. ● It peaked out at 58% by 2000. New architectures were developed and refined to better serve this market. ● FPGA vendors had a great ally: Moore’s law and the ever shrinking process technology! 12/12/2007, IC-FPT, Kitakyushu, Japan This allowed FPGAs to keep up with the needs of datacom by doubling the density every two years. FPGAs became the next generation process drivers in the process foundries. Sinan Kaptanoglu, Actel Corp. 10 Changing landscape… Many startups died in this period. FPGAs which were not targeted to datacom fell behind in revenue: ● Anti-fuses were not reprogrammable and not well suited to datacom. This pushed Actel into other less lucrative markets. ● Altera was flying high early, but it was in trouble by late 1990s, because CPLDs could not keep up with the increasing density of the FPGAs and the needs of the newer datacom applications. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 11 Then came the bust in 2001… The communications industry felt the bust harder than any other sector. Countless datacom/telecom start-ups went out of business. ● Demand for new datacom/telecom equipment nosedived. ● In parallel, FPGA revenues declined 40% within a single year. And the middle ages started. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 12 In the middle ages… Xilinx kept designing FPGAs for the datacom/telecom market first and foremost. ● Virtex was followed by: Virtex-2,4,5… But they also developed lower cost derivatives for other markets. ● Revenues declined initially, but they gradually recovered. ● An era of slower growth began. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 13 In the middle ages… Altera made a successful transition from CPLDs to FPGAs starting with Stratix and its derivatives. ● Ironically, Stratix was aimed at the data-com market of the boom years. Other markets were addressed with derivative lower cost products. ● Like Xilinx’s, Altera’s revenues also declined initially, but gradually recovered. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 14 In the middle ages… Actel successfully transitioned itself from making only anti-fuse FPGAs to flash based reprogrammable FPGAs. ● These new devices were aimed at the low cost markets as well as markets that put a premium on design security. ● Revenues declined initially, but recovered quickly. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 15 Middle ages (2002-2008) FPGAs have settled down to a pattern of healthy but slower growth, with small ups and downs. ● Market leading FPGAs continue being designed for datacom, but their low cost derivatives target all other markets combined. FPGAs no longer appear to be a very vibrant industry with a lot of rapid innovation. ● That’s the price one pays for maturity? ● Take comfort: the ASICs are worse off. 12/12/2007, IC-FPT, Kitakyushu, Japan Dataquest estimates that ASICs shrunk by 4% in 2007. Sinan Kaptanoglu, Actel Corp. 16 Which future awaits FPGAs? More of the same FPGAs? ● Similar architectures for everybody? ● Less innovation, more marketing? Good continued growth, but at a slower pace… OR Another boom: but what might start it? If history repeats, it will be a rapidly growing new market for FPGAs! 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 17 A new market driver? 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 18 A new rapidly growing market We are witnessing a dramatic increase in portable devices. ● These are usually battery operated. Not a temporary blip: ● More new devices and types of devices are coming to market continuously. ● Expected to accelerate in the 2010s. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 19 Spectrum of portable devices Consumer Volume Industrial, Medical Military, Automotive Features 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 20 Portable market predictions Gartner-Dataquest predicts 1.6B smart phones by 2010. Juniper Research predicts 56M high end MP3 players by 2010. Industrial/Medical/Automotive sectors are growing more rapidly than any other FPGA market. ● Portable devices within these sectors are growing the fastest. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 21 Gartner-Dataquest estimates 2002 Market - $2.3B Mil/Aero 6.9% 2010 Market - $6.8B Auto 0.6% Mil/Aero 9.3% Consumer 7.6% Industrial 15.3% Comm 53.8% Consumer 14.6% Auto 6.2% Comm 37.4% Data Proc 15.7% New adopters are mostly from the consumer and the industrial sectors 12/12/2007, IC-FPT, Kitakyushu, Japan Industrial 24.2% Sinan Kaptanoglu, Actel Corp. Data Proc 8.2% 22 What’s the big deal about the portable market? Possibly there is no big deal: ● Perhaps these are just yet another type of devices which may use FPGAs sometimes. ● But we could have said the same thing about the datacom market back in 1993. What similarities are there between the datacom market in 1993 and the portable device market in 2007? 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 23 Similarities are… In 1993, datacom had very short design cycles and preferred FPGAs. ● But it could not use FPGAs frequently because the FPGAs often failed to meet minimum performance and density requirements. In 2007, portable device market has short design cycles and prefer FPGAs. ● But it cannot use FPGAs frequently because the FPGAs often fail to meet the minimum static power requirements. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 24 This market is different… Because: ● Most portables are battery powered. ● Portable devices spend most of their time awake, idle, but doing very little. Varies from 50% to 99.99% of the life. This requires very low static power usage. Compare that to datacom: ● An FPGA in a router is active all the time. ● Idle is for repairs and updates only. ● A good FPGA for datacom is unlikely to be well suited for portables and vice versa. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 25 Don’t the low-cost derivatives address this market? The low cost derivatives of market leading FPGAs indeed save area and power both. But the static power of these devices are still two to three orders of magnitude too large for most battery powered applications. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 26 The minimum requirements: The FPGAs for portable devices need a very low power “Idle” state. ● Measured in tens of mW. Idle state does not mean “switched off” or even deep “stand-by”: ● Idle means very light activity. ● Idle means that all FPGA flip-flops retain their state without being saved to and restored from a memory. ● Switching from idle to active must be very quick in a few clock cycles, not thousands. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 27 Can this be done? 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 28 An optimist’s view… If we design new FPGA architectures custom tailored for the unique needs of the Portable device market, we give ourselves the best chance to witness a second boom in FPGAs. ● These new FPGAs will not replace today’s products. They will co-exist with them to serve different markets. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 29 A pessimist’s view… Most ICs don’t experience any boom. FPGAs were lucky to have had one! We are unlikely to meet the idle power requirements of the portable market very soon. Therefore: ● Accept maturity, and be happy with the slower but steady growth. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 30 OK, let’s be optimists for a while… How do we design FPGAs for the portable market? 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 31 First learn from ASICs… Use all the circuit and process tricks that the low-power ASICs have employed: ● For the lowest leakage power, start by using a designated “low power” process from your favorite FAB. ● Use high-k dielectrics for the gate, if available. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 32 Learn from ASICs: Use a multiple-VT process. ● Use highest VT devices wherever you can without adversely affecting performance. ● For example, all configuration bits in an SRAM based FPGA should be built out of highest VT transistors. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 33 More tricks from ASICs… Consider using a multi-Vdd process. ● There has been a wealth of research on multi-VT and multi-Vdd circuit design for power reduction in ASICs. ● If a multi-Vdd process is not available, consider using a reduced Vdd operation. Consider using long-channel devices. Consider power gating. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 34 More tricks from ASICs… Consider using a triple-oxide-process, if available: ● Good for gate leakage. ● Extra mask, extra cost. If available, use a triple-well process to take advantage of well biasing. ● Again good for leakage, but costly. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 35 And yet more… If you are really desperate, as a last resort, consider stacked gates. ● Very costly (in area) for incommensurate returns in leakage reduction. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 36 And then, get help from SW… Use all power-driven synthesis, tech-mapping, and place & route. ● If you used well-biasing, or multiple VT, or multiple Vdd, let place & route arrange it as best as it can (in different parts of the FPGA) for the best power. At the end, do power based bit-mask selection for configuration bits. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 37 When you have adopted most of these tricks from ASICs… You have far exceeded the level of “low power” derivatives of the current popular FPGA architectures. ● You have definitely improved static power, but not sufficiently. ● You kept the changes to a minimum so that you can amortize the development effort for the original architectures. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 38 This is good, but not enough… We need to explore fancier process technologies, circuit design methods and FPGA architectures. ● The new FPGAs must be fully custom tailored for the portable market. 12/12/2007, IC-FPT, Kitakyushu, Japan Even if that means they will not be very good for datacom applications. Sinan Kaptanoglu, Actel Corp. 39 Promising technologies for FPGAs specifically targeted to portable devices 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 40 The trend is not good… CMOS process and portable devices seem to be heading in opposite directions. The transistor leakage has increased with every CMOS shrink to date. ● For source-drain and gate leakage both. As we move down the silicon dimensions the leakage will only get worse. ● It’s just physics. ● Using the exact same type of materials, a shrink will leak more than the previous generation, unless the voltage is scaled. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 41 Vdd is not scaling! Most 130nm low-power CMOS processes use 1.2V core operation. So do most 90nm and 65nm low-power CMOS processes. Most 45nm low-power processes will use 1.0V, or 0.9V at best. ● Even those which use high-k dielectric materials. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 42 This is not very likely to change Vdd will not scale very much in order to maintain a modest performance and in order to keep the gate leakage under control. ● With or without high-k materials. But the source-drain leakage will keep increasing from each process node to the next. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 43 Future technologies Three examples of promising technologies for future FPGAs for the portable device market 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 44 Here is an incomplete list… In increasing order of maturity: 1) SOIAS (Silicon-on-Insulator-with-an-ActiveSubstrate) technology. 2) Very high-k gate-oxide technology, with very small gate leakage. 3) Embedded flash-switch technology. It is possible to combine any two or even all three. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 45 SIOAS technology 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 46 SOIAS based architectures Let’s start first with the basic SOI: Metal-1 bulk-SiO2 Metal-1 gate (poly/ metal) n+ p- gate oxide n+ Insulator (Si02) 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 47 SOIAS adds a back-substrate From Yang et al. (1995, IEEE-IEDM) Metal-1 bulk-SiO2 Metal-1 gate (poly/ metal) n+ p- gate oxide n+ Insulator (Si02) p+ i-poly Insulator (Si02) 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 48 Fine-grain dynamic back-gate biasing Fine grain back-bias: ● In space and time both. ● We can back bias individual logic modules, FFs or individual routing buffers. ● Change biasing frequently. ● Order of magnitude reduction in static power compared to low-power bulk-CMOS. Need a highly sophisticated power driven synthesis, place and route. ● Even ASICs can’t do this very well yet. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 49 SOI uses less dynamic power Dynamic power is lower for any SOI due to lower gate and junction capacitances. Many standard cell designs claim 50% dynamic power reduction compared to bulk CMOS (SOITECH claim.) 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 50 Very high-k gate oxides 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 51 Very high-k dielectric gate oxides Literature is full of promising new gate insulators. ● Penryn is shipping with hafnium oxide. ● Other’s examples will follow suit soon. ● Feasibility is proven, but reaching maturity will take time. These materials will allow us to play a onetime game with VT and Vdd. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 52 Ready for the next shrink? Suppose you are at a process node X, with operating voltage V, threshold voltage T, and gate oxide thickness G. Ideal shrink is at sX, sV, sT, and sG, where s is the shrink factor. ● Often s = sqrt(0.5) = 0.7. All’s good here, except performance, which is roughly proportional to (V-T)2, which now becomes s2*(V-T)2 for the shrink. 2 ● Your new performance is only s that of the old one, which is unacceptable. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 53 Restoring the performance… To counter, you go with sX, pV, qT, and pO, with q < s < p < 1 Now the speed of the shrink will go like (pV – qT)2. ● Choose (pV – qT) >= (V – T). ● For example V = 1.2, T = 0.4, p = 0.83, q = 0.5, and V-T = 0.8 before and after. But now your source-drain leakage is unacceptably bad! 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 54 Now fight the leakage… If you don’t have very high-k gate oxide, you are out of luck. You have to live with the worsened leakage. With a high-k gate oxide however, you can do sX, V, T, rO, where r < 1. Now the performance is even better than before, and the leakage (both kinds) are no worse than before. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 55 Starting from low VT and high source-drain leakage… Reduce sourcedrain leakage Increase VT 12/12/2007, IC-FPT, Kitakyushu, Japan Increase gate leakage Decrease gate leakage Use High-k dielectric Increase Vdd Reduce Idsat Increase Idsat Reduce speed Increase speed Sinan Kaptanoglu, Actel Corp. 56 Flash-switch technology 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 57 Flash-switch technology The most mature technology today for low static power. Not the same as flash-memory-on-the-side (FMOS) which loads SRAM configuration bits in the FPGA. ● FMOS approach may make a good FPGA, but not a good low-power FPGA. ● Most Lattice products and MAX-2 from Altera has FMOS. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 58 Actel’s combined flash cell Flash Cell Flash-switch NOR-Flash memory-bit 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 59 Actel’s flash cell Very low leakage: Each switch leaks only a few pico-amps! This technology combines the flash memory bit and the flash-switch to a single very low leakage cell. ● This cell is used directly in the signal path, not for controlling SRAM bits. ● The technology is ideal for configuration, but the leakage of the CMOS logic and routing buffers still needs to be dealt with. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 60 Not just some futuristic technology It is shipping today in IGLOO™. TM Actel IGLOO is the lowest power family of reprogrammable FPGAs in the market. Depending on the expected idle time, it can extend the battery life by more than a factor of 10 compared to any other FPGA in the market! 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 61 Static power comparison 150 mW 160 140 Igloo has the lowest static power. ● 100 80 mWatts 120 60 mW 60 40 mW 40 20 0 Its leakage in “flash-freeze” state is 300 to 1000 times better! Igloo advantage comes from flash switches in signal path! 0.12 mW Igloo 12/12/2007, IC-FPT, Kitakyushu, Japan Competitor "A" Competitor "B" Competitor "C" Sinan Kaptanoglu, Actel Corp. 62 Battery life comparison at 95% idle 95% idle, 5% at 100MHz, Smart-phone application low cost FlashSRAM hybrid low cost SRAM fpga low power CPLD anti-fuse fpga Igloo 0 500 1000 1500 2000 2500 3000 3500 4000 4500 Hours of Battery life 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 63 Are we already there then? We are indeed very close, IGLOO™ is a great product for portable devices. ● But we can do even better. A future FPGA using an order of magnitude less “idle” power than IGLOO™ is possible. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 64 A promising circuit design technique On-chip low-swing differential signaling 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 65 Low-swing differential signaling Lowest dynamic and static power! ● But costly in silicon area! One needs sense-amps at every input of the logic modules and FFs. ● Also costly in development effort. Immunity to noise and immunity to SEU is unproven. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 66 Low-swing differential signaling Hybrids are possible: ● Some regular routing resources, plus some (mostly) differential signal routing resources. Let a smart place and route make the right choices for the power and performance. ● Can also be combined with SOIAS and flash-cell technologies. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 67 Examples of promising architectural changes 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 68 Overall architecture optimization Current FPGAs are architected to minimize [(Area)a * (Delay)d]. ● The exponents a and d vary by a factor of two: 0.7 < a, d < 1.5. Instead, we need to minimize: [(Area)a * (Delay)d / (Battery-life)b] ● With 0.7 < a, d < 1.0 < b <= 2 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 69 Current architectures are very heavily DSP-oriented Market leading low cost FPGAs come with many hard multipliers. This makes good sense in many markets but not for portable devices: ● Very few portable apps will benefit from a hundred 18X18 multipliers on FPGA. ● For most portable applications just a few multipliers are enough. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 70 Ratio of used routing buffers FPGAs use unidirectional buffers nowadays. For a typical design, more than half of these remain unused after place and route. ● They contribute to leakage in “Idle”. It is possible to redesign the interconnect architecture such that only 20% of the buffers remain unused for typical designs. ● Then the total number of buffers can be reduced, with a corresponding decrease in leakage. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 71 A hand-waving explanation Ratio of used routing buffers Doing this without increasing the mux area very much and without reducing routability is the key! ● Different interconnect topology is needed! ● Changes are not simple. ● There is a performance penalty, but it could be kept well below 10%. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 73 Ratio of used carry chains In a typical design 70% to 90% of all ripple carry chains are unused! ● Carry chain drivers are large by necessity, and they leak a lot. ● The carry chain can be redesigned to reduce the leakage by up to 50%. Performance loss can be kept in single digits. ● Overall impact on total leakage is not that big, but every little bit helps. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 74 Dual port RAMs Dual port RAMs are popular. ● Especially useful to build FIFOs. ● For the argument here “dual port” and “two port” amount to the same thing. However, the dual port RAMs are used as single port RAMs more than 90% of the time. ● Except in datacom applications! 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 75 Dual port RAMs A dual port RAM used in single port mode has half of its outputs tied OFF. ● These will leak in the unused state. Dual port RAM cells have two or more additional transistors, which increase leakage. For FPGAs for portable devices, it is better to provide mostly single port RAMs, and some dual port RAMs. ● Significant help with leakage. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 76 IO leakage… Unused IO drivers do not leak much because of the thicker gate oxide. But there is a huge amount of other circuitry in front of the pad drivers. ● These leak a lot more, especially because the FPGA IOs are designed to support many different IO standards. By circuit redesign and by supporting fewer IO standards the leakage can be reduced significantly. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 77 Don’t forget the peripherals… One rarely worries about PLLs, crystal oscillators, other clock generators, voltage pumps, etc... ● They don’t contribute much to the dynamic power, but they are a major component of the “idle” static power. These mostly analog blocks should be redesigned for FPGAs serving portable applications with much reduced idle power consumption. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 78 Now tackle dynamic power 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 79 Next tackle the dynamic power: Even though not as critical as static idle power, dynamic power is still very important for battery operated apps. We can improve dynamic power by doing similar things as ASICs. ● All changes combined, we can improve it up to a factor of two or so. ● Unlike the static power, there is no way to improve it by several orders of magnitude. 12/12/2007, IC-FPT, Kitakyushu, Japan The only way to improve it by an order of magnitude is by low-swing differential signaling. Sinan Kaptanoglu, Actel Corp. 80 FPGA specific optimizations… For dynamic power, FPGA specific optimization involves primarily IOs and clock networks. ● Other parts of FPGAs are optimized similarly to ASICs. IOs use 30% to 50% of dynamic power. ● For IOs, the most effective strategy is integration: Low voltage (1.2V) IOs are preferred. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 81 Clock architectures will change In current architectures 20% to 50% of the core power is burned by clocks! ● This is 3 to 10 times larger than ASICs. This is a relic of the mid-1990s design: ● FPGAs come with 6 to 24 global distribution networks, because this was the only reliable way of distributing low-skew signals on FPGAs in 1990s. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 82 It even affected FPGA synthesis… FPGA synthesis generates (relatively) few clocks, with many clock enables. ● This is a very nice and clean methodology. ● Very friendly for synchronous design. ● But it wastes power! We need FPGAs that can support many (hundreds) small clocks. ● No support for explicit ENA on flip-flops. ● That’s what ASICs have been doing! 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 83 Clocks will make the switch first It may take a long time for the first FPGA using all low-swing differential signaling to come to market. ● Way before then, however, we will have FPGAs that use differential signaling in global clock networks. ● It’s the lowest hanging fruit. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 84 Summary 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 85 The second FPGA boom may be on its way… The rapidly growing portable device market is the best candidate that may start the second FPGA boom. But the FPGAs must meet the static power requirements of this market. ● We can do this by designing new FPGAs specifically for portable devices, rather than trying to retrofit old ones. ● The old FPGAs will not go away, they continue to serve markets which do not care very much about battery life. 12/12/2007, IC-FPT, Kitakyushu, Japan Sinan Kaptanoglu, Actel Corp. 86 Thank you!