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Transcript
Microtechnology and Nanoscience, MC2
Power amplifier efficiency
enhancement techniques
Christian Fager
Microwave Electronics Laboratory
Department of Microtechnology and Nanoscience, MC2
Chalmers University of Technology
2006-10-16
Microtechnology and Nanoscience, MC2
Outline
• Background
– Why is high efficiency important?
• Switched mode power amplifiers
– Why are SMPAs more efficient than traditional PAs?
• Device technologies
– Which devices are used to realize SMPAs?
• Transmitter architectures
– How can SMPAs be used to transmit modulated signals at high
efficiency?
• Summary
2017-05-23
Power amplifier efficiency enhancement techniques
2
Microtechnology and Nanoscience, MC2
Background
• Why high efficiency is important
– Increased power consumption
Battery cost
Heavier power supplies
Electrical power expenses
Environmental incentive
– Further multiplied by need
for extra cooling
– Deterioration of semiconductor
reliability
Constant 1 W output power
10
8
Power loss [W]
•
•
•
•
6
4
2
0
0
20
40
60
Efficiency [%]
80
100
• Example: Radio base stations
– Total energy consumed by base stations in Sweden: 1.2 - 2.1 TWh/yr
– Energi from of a Barsebäck size nuclear reactor: 4 TWh/yr...
• The final power amplifier handles the highest power levels
and dominates the total power consumption
– Power amplifier efficiency enhancement is very important!
2017-05-23
Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Dynamic input signal variations
• 3G base station: Transmitted WCDMA signal
Frequency domain
Time domain (sample)
40
40
RF signal power
RF signal power
20
0
-20
-40
-60
2125
2130
2135
2140
2145
Frequency [MHz]
2150
2155
30
20
10
0
50
51
52
53
Time [µs]
54
55
• The modulation creates dynamic signal power variations
10
Probability [%]
8
6
Peak power: 40.3 dBm
4
Average power: 30.0 dBm
2
Peak-to-average: 10.3 dB
0
2017-05-23
0
10
20
30
Output power [dBm]
40
Power amplifier efficiency enhancement techniques
4
Microtechnology and Nanoscience, MC2
Traditional linear PA operation
• The peak output power is determined by its saturation
Pout [dBm], PAE [%], Prob. [%]
– PA efficiency is maximum close to saturation
– Operating it into compression results in severe distortion
30
Pout
PAE
Prob.
25
20
15
10
5
0
-25
-20
-15
-10
-5
Input power [dBm]
0
5
• The total PA efficiency is weighted by the signal input
power probability density function
– For this case: Peak PAE = 27%, total average PAE = 15%
• How can more efficient PAs be realized???
2017-05-23
Power amplifier efficiency enhancement techniques
5
Microtechnology and Nanoscience, MC2
Switched mode power amplifiers
Why are SMPAs more efficient than traditional PAs?
Microtechnology and Nanoscience, MC2
Traditional power amplifiers
• Transistor is used as variable current source
Measured vs. modelled Ids(Vds)
60
0.20
Voltage
Current
Dissipated power
50
0.15
40
Ids
Loadline
30
0.10
20
0.05
10
0
0.00
0
5
10
15
20
25
30
0
0.2
0.4
0.6
0.8
1
Time
Vds
• Typically biased in class AB operation, where linearity
and efficiency trade-off is most favorable
• Simultaneous voltage and current
– Dissipation across the device
– Limits practical efficiency to < 50%
• How can the voltage×current overlap be minimized?
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Switched mode power amplifiers (SMPA)
• Designed to use the transistor as a switch, rather than a
controlled current source as in a linear amplifier
– Example: Class E
Intrinsic load line
Intrinsic waveforms
0.4
100
80
10*Idsi1*Vdsi1
200*Idsi1
Vdsi1
Ids
0.3
Loadline
0.2
0.1
60
40
20
0
0.0
-20
0
20
40
60
Vds
80
95
0
100
200
300
400
500
600
700
time, psec
• The output network creates non-overlapping waveforms
• Dissipated power is low
– High efficiency is enabled
– Design of the device load network is very critical
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
SMPA input power dependence
• High input power is required to make the transistor
switch properly
– At low power, SMPAs work like poorly designed traditional PA
– Low efficiency, high nonlinearity
Intrinsic load line
0.4
Draineff
Pin 15
0.2
Pin 10
0.1
Pin 5
0.0
18
80
16
60
14
40
12
20
10
8
0
0
20
40
60
Vds
80
95
Gain [dB]
Ids
0.3
100
0
5
10
15
20
25
Input power [dBm]
• Output power should not be modulated with the SMPA
input power
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Microtechnology and Nanoscience, MC2
General SMPA switching conditions
• Consider two simplified switch models (i.e. transistors)
A
B
PC , Loss 
1
 C  Vc 2  f
2
PL , Loss 
1
 L  IL2  f
2
• Most transistors are best described by model A
• Minimzation of losses at RF requires:
– Vc = 0 when switch closes at t = 0
• Zero voltage switching condition (ZVS)
– Even better: dVc/dt = 0
• Many ZVS SMPA classes have been presented...
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Class E
• Presented (patented by Sokal) in 1975
100
200*Idsi1
Vdsi1
80
60
40
20
0
0
100
200
300
400
500
600
700
time, psec
• Load network derived to provide ZVS and dVds/dt = 0
• Cds of active device may be considered part of C1
• Maximum frequency:
f max 
Pout
 CdsVdd2
• Peak voltage: 3.6×Vdd
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Class F and inverse F (class F-1)
• Square-wave shaping of voltage or current waveforms
by termination of harmonics (ZVS)
Basic class F circuit
• Class F-1: Voltage and current waveforms interchanged
– Zn = {R for n = 1; ∞ for even n; 0 for odd n}
• Maximum frequency limited by the device parasitics
– Higher harmonics are "short circuited" inside the device
– Practically max 5 harmonics need to be considered
– Limits maximum efficiency to ~80%
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Class D / D-1
• Push-pull connection of two class F (F-1) PAs
– Balanced structure provides the loading conditions needed
– No need for harmonic filters
– Baluns are needed to provide balanced input and output for D-1
Class D (voltage mode)
Class D-1 (current mode)
4
4
Voltage, V 1
Current, I 1
3
3
2
2
1
1
0
Voltage, V 1
Current, I 1
0
0
0.2
0.4
0.6
0.8
1
0.2
0.4
0.6
0.8
1
Time
Time
• Difficult to implement at RF
• Cds cannot be absorbed
2017-05-23
0
• Demonstrated to 2 GHz
• More wideband than class F-1
• Twice output power
Power amplifier efficiency enhancement techniques
13
Microtechnology and Nanoscience, MC2
Published SMPAs
• LDMOS technology
• f > 800 MHz
• Pout > 7 W
2017-05-23
Year
Class
f (GHz)
η (%)
Pout (W)
Gain (dB)
2002
Inverse-D
1
60
13
14
2003
E
1
73
7.9
10
2003
E/F
0.8
60
30
10
2005
Inverse-F
1
77.8
12.4
12
2005
Inverse-F
1.8
60
13
10
2005
Inverse-D
1.8
63
50
10
2006
E
1
76
8.1
15
2006
Inverse-D
1
71
20
15
Power amplifier efficiency enhancement techniques
14
Microtechnology and Nanoscience, MC2
Example: Inverse class D circuit
M.Sc. thesis work by Hossein Nemati, 2006
10.5 cm
8.5 cm
Output balun
Input balun
MRF282
2017-05-23
Transmission
line as inductor
Power amplifier efficiency enhancement techniques
15
Microtechnology and Nanoscience, MC2
Measured results
Low efficiency
High efficiency
• High peak efficiency, but only for high input power
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Device technologies
Which devices are used to realize SMPAs?
Microtechnology and Nanoscience, MC2
Important SMPA device parameters
• Consider again the simplified switch/transistor model
• Important device parameters for SMPAs
– L: Package bond wire parasitics
– Ron: Electron mobility (1/Ids)
– C: Device output capacitance, Cds (Ids)
• Ron×Cds important figure of merit
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Device technologies used
• LDMOS
–
–
–
–
Dominating at f < 3GHz
High power applications
Base station amplifiers
Heating
• Main advantages
– Cheap (Si)
– Mature, reliable
• Competing technologies
– GaAs
– Wide bandgap
• SiC, GaN
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Basic LDMOS device physics
• Cross section of high power LDMOS device*
•
•
•
•
•
Vdbr : ~100 V
Id : ~150 mA/mm
Pout: ~ 1 W/mm
Cds: ~ 0.6 pF/mm
Ron: ~ 20 W·mm
• Drift region/substrate p-n junction reverse biased at Vds > 0
– Cds = depletion capacitance
• p-top inserted to reduce surface field towards gate
(RESURF)
– Increases breakdown voltage
* J. Olsson et al."1 W/mm RF Power Density at 3.2 GHz for a Dual-Layer RESURF LDMOS Transistor", IEEE EDL, Apr. 2002
2017-05-23
Power amplifier efficiency enhancement techniques
20
Microtechnology and Nanoscience, MC2
Wide bandgap (GaN) device technology
• Cross section of GaN device
•
•
•
•
•
Vdbr > 150 V
Id : >1 A/mm
Pout: > 5 W/mm
Cds: ~ 0.5 pF/mm
Ron: ~ 2 W·mm
• 2d electron gas layer
– High mobility, low on-resistance
• Very high breakdown field
– Very high power density (W/mm)
– Low capacitances for a given output power
– Low switch losses
• Efficiency > 80% reported at 2.14 GHz
– Overdriven class AB operation!
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Wide bandgap prospects
• All major LDMOS manufacturers are starting up GaN
activities
Nitronex GaN PA
• Problems to be solved
– Thermal handling
• Extreme material stress
– Material processing
• Traps
• Reliability
– Packaging
• Thermal matching
• Parasitic capacitances
Chalmers SiC PA
– Price
• Very expensive compared to Si
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Power amplifier efficiency enhancement techniques
22
Microtechnology and Nanoscience, MC2
Transmitter architectures
How can SMPAs be used to transmit modulated
signals at high efficiency?
Microtechnology and Nanoscience, MC2
• Traditional power amplifiers
– Output power is modulated by
changing the input power level
– High peak-to-average signals
lead to low average efficiency
Pout [dBm], PAE [%], Prob. [%]
Efficient modulation of SMPAs
30
Pout
PAE
Prob.
25
20
15
10
5
0
-25
-20
-15
-10
-5
Input power [dBm]
0
5
• Very high efficiency SMPAs
have been presented
– How shall the high efficiency be maintained for varying signal amplitudes?
• Special transmitter architectures
are considered
–
–
–
–
–
2017-05-23
Supply modulation
Polar architectures
Load modulation
Outphasing architectures
Digital architectures
Power amplifier efficiency enhancement techniques
24
Microtechnology and Nanoscience, MC2
Supply modulation: Envelope tracking
• Class AB amplifier example
Measured vs. modelled Ids(Vds)
Measured vs. modelled Ids(Vds)
0.20
0.20
High power loadline
-> OK efficiency
0.10
0.05
High power loadline
-> OK efficiency
0.15
Ids
Ids
0.15
0.10
Reduction of VDS
0.05
Wasted VDS DC power!
0.00
0.00
0
5
10
15
20
25
30
0
5
Vds
Low power loadline
-> Poor efficiency
10
15
20
25
30
Vds
Low power loadline
-> High efficiency maintained
• Envelope tracking means to reduce VDS at low power
levels to avoid unnecessary dc consumption
– The input signal is not changed
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Envelope elimination and restoration (EER)
• Decomposition into separate amplitude and phase
signals
 I  t   jQ  t  e
jwRF t
 A t  e
j f  t wRF t 
Supply voltage
• A(t): Baseband amplitude
RF input Switched mode
f(t): Baseband phase
RF output
PA
j(
f
(t)+
w
t)
e
: Unity amplitude signal
• Unity amplitude suitable to drive SMPA in saturation
– High efficiency can be maintained
• Amplitude signal can be applied to SMPA supply voltage
to control output power
2
– Pout  Vdd
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
Supply modulation of Class D-1
• Efficiency > 50% can be maintained for 10dB variation
in output power
– Vds modulated between 10 - 30 V
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Power amplifier efficiency enhancement techniques
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Microtechnology and Nanoscience, MC2
EER (and Envelope tracking) properties
• Advantages
– Ideally 100% modulated efficiency
– Power loss is distributed between PA and supply
Envelope signal
• Main problems
– Envelope amplifier (drain DC supply)
requirements
– Time alignment between the supply
and RF paths (EER only)
Supply voltage
RF input
• Envelope signal properties
0
-50
-100
-40
2017-05-23
RF output
80
Envelope signal power
RF signal power
50
Switched mode
PA
-20
0
20
Frequency [MHz]
40
60
Bandwidth: > 30 MHz
Power: > 80% below 10 kHz
40
20
0
-20
-40
0
10
20
Frequency [MHz]
30
Power amplifier efficiency enhancement techniques
28
Microtechnology and Nanoscience, MC2
Influence of time alignment mismatch
• Misalignment between amplitude and phase paths
– Leads to severe signal distorton
3
Amplitude
Phase
2
0.5
1.5
0
1
-0.5
0.5
-1
0
0.5
1
Time
1.5
Input signal
Output signal
1
2
-1.5
40
Amplitude
2.5
0
50
1.5
30
20
10
0
0.5
1
1.5
Time
2
2.5
3
0
Frequency
– Alignment requirements in the order of a few nsec.
• Hybrids between EER and ET is normally used
– A lower Vds limit is set
– Low output power is controlled by the input amplitude
– Reduces sensitivity to time alignment
2017-05-23
Power amplifier efficiency enhancement techniques
29
Microtechnology and Nanoscience, MC2
Envelope amplifier
• High efficiency envelope amplifier is required
–
–
–
–
Bandwidth: > 20 MHz for 5 MHz signal
Voltage range: 5 - 30 V
Current: > 1 A
Efficiency: >>50%
• Linear assisted switched mode amplifier topology
– Slow variations supplied by
switch (high efficiency)
– Fast variations supplied by
linear stage (low efficiency)
– Efficiency >75% published
• Problems
– Complicated circuit
– Limited voltage range
– Limited bandwidth
2017-05-23
Power amplifier efficiency enhancement techniques
30
Microtechnology and Nanoscience, MC2
Polar architecture heat advantage
[P. Draxler, IMS2006 workshop on memory effects in power amplifiers]
• Distribution of power loss
• Drastic reduction of loss (temperature) in the device
– Improved reliability
2017-05-23
Power amplifier efficiency enhancement techniques
31
Microtechnology and Nanoscience, MC2
Outphasing architecture
• Signal is splitted in two components with constant
amplitude but with phase difference
– Suitable for driving a SMPA
• Difficult to realize the combiner
– Output impedance of one PA affects the other through the combiner
– Difficult to reuse the power at backoff
– Efficiency at backoff usually not very high
2017-05-23
Power amplifier efficiency enhancement techniques
32
Microtechnology and Nanoscience, MC2
Load modulation architecture
• Variation of output power by dynamically tuning the
output network
Varactor voltage
Output
matching
network
RF input
Switched mode
PA
RF output
• Varactors typically used
– Breakdown voltage > 100V
– Low series resistance
• Simple and efficient electronics can be used for the control
– No need for high power dc converters etc.
2017-05-23
Power amplifier efficiency enhancement techniques
33
Microtechnology and Nanoscience, MC2
Schematic of 1 GHz class F-1 PA
• Based on high performance
inverse class-F PA
– LDMOS MRF282
– h = 77.8%
– Pout = 12.4W @ 1GHz
• Modified for the load
modulation technique by
adding a tuneable capacitor in
output network (C2)
2017-05-23
Power amplifier efficiency enhancement techniques
34
Microtechnology and Nanoscience, MC2
Experimental load modulation results
•
•
•
Straightforward power back-off
(dotted line)
Load modulation (solid line)
Load modulation combined with an
input power tuning (dashed line)
• 20% efficiency improvement when output power is controlled by
variable capacitor
• An output power range of 11 dB is obtained with efficiency over
40% (dashed line)
2017-05-23
Power amplifier efficiency enhancement techniques
35
Microtechnology and Nanoscience, MC2
Digital architectures
• Convert the RF input signal into a digital pulse-train
– Suitable to drive a switching transistor amplifier (class S)
RF output
RF input
• Very fast transistors are needed to minimize switch losses
– Very high current/capacitance ratio needed (GaN?)
• The class S PA and bandpass filter are already combined in
most SMPAs (e.g. class D)
• Very high digital modulator speed/accuracy is required!
2017-05-23
Power amplifier efficiency enhancement techniques
36
Microtechnology and Nanoscience, MC2
Digital signal converters
• Pulse width modulation
Carrier PWM
– RF PWM
• Pulse width and position modulation
– Carrier PWM
• Multiplication of PWM and RF signals
– Very high timing accuracy needed
• High clock frequency
• Bandpass D-S modulation
– Quantization noise shaping around center frequency
– Noise floor set by modulator order and clock frequency
Keyzer et al., "Digital generation of RF signals for wireless communications with band-pass delta-sigma modulation". Proc. MTT-S, 2001
2017-05-23
Power amplifier efficiency enhancement techniques
37
Microtechnology and Nanoscience, MC2
Digital arhitecture future prospects
• CMOS clock frequency roadmap
– Scaling -> microwave digital circuits available
• Reconfigurable PA systems
– The amount of nonlinearity is controlled
by digital parameters
– System can be reconfigured depending on requirements
– Bandwidth vs. distortion can be interchanged dynamically
• Reliability
– No aging or drift
– No need for tuning or tweaking of fabricated circuits
• Integration
– Microwave and digital circuit functions
can be integrated into the same chip
– Especially suited for hand held units
Asbeck et al., "Synergistic design of DSP and power amplifiers for wireless communications", IEEE Trans. MTT, Nov. 2001
2017-05-23
Power amplifier efficiency enhancement techniques
38
Microtechnology and Nanoscience, MC2
Summary
• SMPAs give higher peak efficiency than traditional PAs
– Load networks designed to prevent current/voltage overlap
– Several classes have been presented
• Recent developments in WBG technology (GaN)
– Very high output power and low capacitances makes it ideally
suited for high efficiency SMPA applications
– Huge industrial interest
• Efficient modulation of SMPAs
– Supply modulation, outphasing, load modulation all promising
– Digital architectures are attractive for the future, but require
extreme clock rates
• How to modulate SMPAs efficiently is still an open
question…
2017-05-23
Power amplifier efficiency enhancement techniques
39