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Built-In Test Software for Deformable Mirror High Voltage Drivers Jianwei Zhou Home Institution: University of Hawaii at Manoa CfAO Akaimai Internship 2008 Subaru Telescope Mentor: Stephen Colley Funding provided by the Center for Adaptive Optics through its National Science Foundation Science and Technology Center grant (#AST-987683) Today’s Presentation Background Importance of Build-In Test software Design Process Conclusion Acknowledgement Acronyms A/D – Analog to Digital D/A – Digital to Analog BIT- Built-In Test DM- Deformable Mirror HV – High Voltage ICD – In-Circuit Debugger LGSAO – Laser Guide Star Adaptive-Optics MUX – Multiplexer Project Overview Design Built-In Test (BIT) software for deformable mirror high voltage driver in the Subaru LGSAO system. Measurements performed by BIT circuitry Input Voltages Output Voltages Power Supply Voltages Board Temperature Deformable Mirror (DM) DM is used with wavefront sensor to provided optical control and correction. The DM is divided into 188 segments with separate control voltage to each segment DM operates with maximum voltages of +400V, and HV amplifiers with gain of 40 are used to amplify input voltages of + 10v to +400v. HV Driver Subsystem The HV driver subsystem in the Subaru LGSAO system consist of 10 HV Amplifier boards High Voltage Amplifier Board Importance of Built-In Test Software + 10v Digital Real-Time Control Computer Data D/A Converter Board 188 + 400 v HV Amplifier Board w/BIT 188 DM Built-In Test Circuit Main components: Analog Multiplexer (Mux) Analog-To-Digital Converter Microcontroller (PIC 16F877) Temperature Sensor Mux A/D Converter BIT Circuit Microcontroller Temperature Sensor Host Computer Built-In Test Software Program Language use: C Step 1: Program in C Step 2: Compile to Assembly language by PICC STD. Pros and cons C is easier and much shorter than assembly language Programming requires the knowledge of microcontroller In-Circuit Debugger Real-time debugger and programmer MPLAB IDE Memory Constraints of Microcontroller Programs must fit in the available on-chip program memory ( very small compare to computer) Must optimize the code to reduce the memory Conclusion Tested the BIT circuit 1 bad A/D converter is found in one board Fabrication error of temperature sensor BIT software successfully measures the input voltages, output voltages, and power supply voltages on a HV amplifier board Work To Be Completed Communication between the BIT circuit and host computer Run the BIT software in the whole LGSAO system Personal Thought A valuable opportunity to learn about circuit design Application of the knowledge learnt in school to real life practice Increased research ability Increased Confidence Acknowledgements Stephen Colley, Mentor Akamai Internship staff Sarah Anderson, Hawaii Island Internship Coordinator Lynne Raschke, Science Communication Lead Instructor Scott Seagroves, Science Communication Co-instructor Lisa Hunter, Akamai Internship Director