Download Semi-Pac Forms the Semiconductor Packaging Team

Semi-Pac Forms the Semiconductor Packaging Team
A Complete Range of Packaging Capabilities from Prototype through Production
Sunnyvale, CA – July 28, 2014 – Semi-Pac today announced that it has formed the Semiconductor Packaging Team to
provide deep semiconductor packaging expertise from prototype through volume production. This level of expertise is
usually available only within large semiconductor companies.
Semi-Pac, whose specialty is rapid prototype development, recently formed an alliance with Silicon Valley based i2a
Technologies to provide volume production capabilities. According to John MacKay, Semi-Pac’s co-founder and CEO: “I
realized that we always turn to Thermal Engineering Associates (TEA) when we are faced with difficult thermal issues and
to Package Science Services (PSS) when we have package design and electrical analysis problems. The Semiconductor
Packaging Team was formed to deliver comprehensive packaging expertise to the industry. The principals at all four
companies (i2a, PSS, TEA and Semi-Pac) are acknowledged experts in their fields and each has 30+ years of experience
in their respective domains. The Semiconductor Packaging Team works together to analyze the customer’s packaging
requirements and in coming up with well-engineered cost effective solutions.”
Bernie Siegal, President of TEA pointed out: “we have been solving thermal engineering problems for Semi-Pac since the
company was founded in 1998. Formalizing this relationship into the Semiconductor Packaging Team enables us to pool
our resources to offer customers semiconductor packaging expertise that is usually only available within the packaging
engineering departments of large semiconductor companies. We have worked well together over the years and the
working relationship does have a team feel.”
“We have done a number of projects with Semi-Pac and TEA”, explained Thomas Tarter, President of Package Science
Services (PSS). “We’re called in to design packaging solutions where the performance and thermal requirements are
difficult to achieve and require our design and analysis capabilities.”
Victor Batinovich, President and CEO of i2a Technologies said: “We have been working closely with Semi-Pac in
transferring their prototype designs into production. Knowing that the prototypes are developed by the Semiconductor
Packaging Team gives us added confidence that the designs are manufacturable in a high volume environment.
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Semi-Pac Forms the Semiconductor Packaging Team
Go to http://www.semipacteam.com to find out more information about The Semiconductor Packaging Team.
About i2a Technologies
i2a Technologies offers a range of assembly solutions to meet your IC packaging needs from standard wire bonded
plastic, small and thin packages to flip chip bonding, system in-packaging, stacked die, and multi-chip and multi-package
assembly.
I2a supports a broad range of package technologies: i2a Technologies is located in Fremont, CA. The website is
http://www.i2atechnologies.com.
About Package Science Services (PSS)
PSS is dedicated to helping customers with solutions to all kinds of packaging needs. Every associate has many years of
experience and has demonstrated a pattern of success in their technical field. As a team, we can help you with any aspect
of IC packaging.
Our mission is to provide best-in-class engineering services from concept through mass production using state-of-the-art
tools and techniques in modeling, simulation, measurement and analysis for the design, development and manufacturing
of integrated circuit packaging and related technologies.
PSS is located in Santa Clara, CA. The website is http://www.pkgscience.com.
About Thermal Engineering Associates (TEA)
TEA is a company founded by Bernie Siegal, a 45+-year veteran and recognized technical leader in the semiconductor
thermal field. The company’s mission is to provide a central source for the products and services necessary for proper
semiconductor thermal measurement and modeling and solutions to attendant thermal management problems. Through
its own products and services, augmented by an extensive network of technical experts around the world, TEA can assist
customers in finding solutions. The Tech Briefs and Hot Links pages provide useful information to those interested in
semiconductor and electronics thermal issues. We welcome the opportunity to discuss your thermally-related
measurement, modeling and/or management requirements.
TEA is located in Santa Clara, CA. The website is: http://www.thermengr.com.
About Semi-Pac
Semi-Pac is a global semiconductor packaging engineering, quick turn prototype and volume production company
headquartered in Sunnyvale, California with additional production facilities in Singapore. Tom Molinaro and John Mackay
founded Semi-Pac in 1988 to address the demand for package engineering and research and development. Both Tom
and John have extensive packaging experience, having been in the industry since the 1970’s.
Semi-Pac specializes in quick turn high yield semiconductor assembly applications for prototype through production.
Semi-Pac thrives on developing innovative solutions to the most difficult packaging challenges including MCM, wafer
bumping, stacked die and wafer level packaging. Semi-Pac has an excellent quality record in supplying services to
commercial, medical and military chip manufacturers. Semi-Pac’s customers include top tier semiconductor
manufacturers.
Semi-Pac is headquartered in Sunnyvale, CA. More information can be found at www.semipac.com.
Contacts for Semi-Pac:
Steve Pollock, Semi-Pac., Sunnyvale, CA, Phone: +1 408 600-1496 Email:[email protected]
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Semi-Pac and Semiconductor Packaging Team are trademarks of Semi-Pac, Inc. All other tradenames and trademarks
are the property of their respective owners.