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Course Introduction

Purpose
 This Part-A course discusses techniques that are used to reduce noise
problems in the design of large scale integration (LSI) devices.

Objectives
 Understand the requirement for electromagnetic noise countermeasures.
 Learn approaches and design methods for minimizing the
electromagnetic interference (EMI) emitted by LSI devices.
 Gain insight into how Renesas applies these techniques for handling
noise problems in its microcomputer products.

Content

Learning Time
 16 pages
 20 minutes
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© 2008, Renesas Technology America, Inc., All Rights Reserved
Noise Can Cause Big Problems
Noise = “Unwanted electrical signals that produce undesirable effects
in the circuits of control systems in which they occur.”

Two types of noise:


Electromagnetic Compatibility (EMC) issues encompass both types
Noise reduction approaches:

 Techniques for reducing EMI (Electromagnetic Interference) —
Cutting the noise emitted by a specific system, circuit or device
that causes other devices/circuits to operate incorrectly
 Techniques for decreasing EMS (Electromagnetic Susceptibility) —
minimizing the effect that external noise has on the operation of
a system, circuit or device
Noise reduction: a goal common to both microcontroller (MCU) designers and
the system engineers who apply those devices
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© 2008, Renesas Technology America, Inc., All Rights Reserved
Why Is EMI Reduction Important?
Example of “real-world” effects: EMI can cause problems in the AV
equipment and CIS products in an automobile
Antenna picks up EMI noise,
which degrades radio reception
Noise is emitted by MCU
and harness, causing EMI
Battery
Audio-visual
equipment,
CIS products
MCU
LSI device
Wiring harness
(power line)
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© 2008, Renesas Technology America, Inc., All Rights Reserved
Minimize ALL Sources of EMI
EMI reduction requires a comprehensive
design approach and attention to detail
If measures are taken
to deal only with
secondary elements…
No source of noise
should be overlooked!
If measures are taken
to deal only with elements
of primary importance…
60
If measures are taken
to deal with all important
noise elements
60
60
Effect: -0.2dB
Effect: -3dB
Action:
10 dB
reduction
Before
After
countermeasure countermeasure
Before
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Before
Total EMI
Secondary
Primary Sources
Total EMI
30
Secondary Sources
Total EMI
Secondary Sources
Primary Sources
After
40
Primary Sources of EMI
EMI level (dB)
50
-10dB
Total EMI
30
Secondary Sources
EMI level (dB)
Total EMI
Secondary
Primary Sources
40
Primary Sources of EMI
50
Action:
10 dB reduction
-10dB
Total EMI
30
Secondary Sources
40
Primary Sources of EMI
EMI level (dB)
50
Effect:
-5dB
After
Explanation of Terms
Core
A microcontroller chip is composed of a core, I/O ports, and power
supply circuitry. The core consists of the CPU, ROM, RAM, and
blocks implementing timers, communication, and analog functions.
CPG
Clock Pulse Generator
Driver
buffer
Output circuit transistors as well as output circuits for driving
signals with large load capacitance and I/O port output transistors.
Clock/bus driver, signals between blocks, etc.
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
EMS
Electromagnetic Susceptibility
Harness
Cables (wires) connecting a board and power supply
or connecting one unit in a system to another.
I/O
Input/Output Port
OSC
Oscillator
PLL
Phase Locked Loop
POR/LVD
Power-On Reset/Low-Voltage Detect functions
Power
supply
Two power supplies are applied to the LSI: Vcc and Vss. The core
power supply internal to the LSI is VCL (internal step-down). The
Vss-based power supply routed through the LSI is VSL.
SSCG
Spread-Spectrum Clock Generator
WDT
Watchdog Timer
5
© 2008, Renesas Technology America, Inc., All Rights Reserved
Pin Assignments Help Reduce EMI
 Microcontroller pin assignments should provide power supply
and signal pin placements that closely match those of external
LSI devices
Vss
 Allows short interconnections
Vcc
 Helps prevent crossed wires
 Improves noise control
Renesas
microcontroller
 Facilitates crosstalk
External
LSI
countermeasures
 Reduces parasitic loads
Vss
Vcc
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© 2008, Renesas Technology America, Inc., All Rights Reserved
Arrangement of Key Pins
 Pins should be arranged in an electrical potential gradient
 Pin layout should concentrate key pins in one area
 Arrangement should make it easy to mount bypass capacitors for noise
countermeasures
 Standardized layouts promote design consistency
NMI
/
VCC
XIN
VSS
XOUT
Effects of electrical potential
differences are minimized
/RESET
XCOUT
XCIN
CNVSS
BYTE
Key pins are concentrated
in a single location
Oscillation
capacitors
Ceramic bypass
capacitor
Capacitor
for Reset
Oscillation
capacitors
Pin arrangement makes it
easy to mount bypass
capacitors between power
supply lines and ground
lines.
To Reset
IC
GND
GND
VCC Tantalum bypass capacitor
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© 2008, Renesas Technology America, Inc., All Rights Reserved
Power Supply Pin Assignments
 Placing power supply pins in pairs near each other makes it easy to mount bypass
capacitors where they can be effective
C3
I/O PORT-1 power supply pin
I/O PORT-1
CORE-1
power supply pin
CORE-1
CORE-2
CORE-2
power supply pin
Vcce
Vcc
C2
C4
Vsse
Vss
Vcl (Vdd)
Vcl (Vdd)
CA
CB
Vsscore
Vsscore
I/O PORT-2
C1, C2, C3, C4
CA, CB = Step-down
power supply (Vdd)
stabilization capacitors
= Power supply
bypass capacitors
C1
I/O PORT-2 power supply pin
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Analog vs. Digital Signal Pins

For best analog circuit performance, some types of digital signal pins
must not be located close to the analog signal pins
AVCC AVSS
AVREF
Analog signal pins
 The following types of digital
signal pins should not be
placed in these locations:
– High-current ports
– Clock-related ports
– High-speed telecom ports
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© 2008, Renesas Technology America, Inc., All Rights Reserved
Power Supply Circuit

Internal step-down power supply circuit
runs off 5V, produces precise lower
voltage (Vdd) for core
 The lower the core voltage,
the greater the EMI reduction
•
•
•
Vcl
Step-down
voltage
EMI
None
Low
High
Reduced
•
•
•
Step-down circuit
Core:
External step-down
power supply circuit
stabilization capacitor
Vcc
• CPU
• ROM
• RAM
• TIMERS
• SCI
• Etc.
Vsl
or
Vss
Vdd (core voltage) = 1.2V
• • •
5V I/O
 A slower slew rate cuts EMI
Vcc = 5.0V
A low Vdd reduces power
consumption, too.
Vss
•
•
•
•
•
•
• • •
A/D, D/A
Layout of internal step-down circuit (conceptual)
10
© 2008, Renesas Technology America, Inc., All Rights Reserved
Step-down Power Supply Voltage


Step-down voltage is used at the 0.5µm process generation and below to
reduce EMI
Process limitations at 0.35µm and 0.5µm process generations and below
mandate lower core voltages
Further decreases in Vdd are expected, allowing additional EMI reductions and
power savings
Core power supply voltage (Vdd), typ. [V]

I/O = 5V
5.0
Process
limitations
4.0
3.0V
3.0
Core voltage aimed
at preventing EMI
Ultralow-noise
version
2.0
1.0
1.8V
1.2V
Ultralow-noise
version
0.8µm
0.5µm
0.35µm
0.5µm
0.18µm
(with internal step-down
voltage specification)
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Further reductions
in core voltage
Process generation
EMI Filter in Step-down Supply

π - type R-C filter is located between step-down circuit and core
 Uses parasitic capacitances of step-down transistors and core and parasitic
resistance of internal power supply lines
Electromagnetic
filter circuit
Vcc
To external
stabilization
capacitor
Internal
step-down
circuit
Parasitic resistance of
internal power supply lines
Parasitic
capacitances
Vss
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© 2008, Renesas Technology America, Inc., All Rights Reserved
Vdd
CORE
Wiring for Power Supply Lines

In devices with multiple power supply pins, Vcc and Vss
should be . . .
 Supplied in pairs

 Located near each other
This design approach ensures that the chip’s internal
power supply lines do not cross
Core-A
power
supply
I/O-A
power
supply
I/O-A
I/O-B
Vcc
Vss
I/O-B
Power
Vss supply
CORE -A
Vcc
CORE -B
Vcc
Vcc
Vss
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Core-B
power
Vss supply
Main Power Supply Lines in Core


Power supply lines to I/O and core are separated
Mesh configuration is used for supply lines to core
Bonding pads
CORE
Primary core supply lines
Vcc
CORE
Vss
SCI
TIMER
Vcc
Vcc
Vss
Vss
CPG
CPU
ROM
I/O circuits
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RAM
Capacitors in Power Supply Lines


Capacitors can be placed in various locations
within the LSI device
They deliver supplemental charge needed for
driving digital-circuit switching
 Without embedded capacitors, ripple component of
power supply waveform is large
 With capacitors, ripple component is small and EMI
is reduced
5V-I/O
Step-down circuit
Embedded
Capacitor
A/D, D/A
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© 2008, Renesas Technology America, Inc., All Rights Reserved
Course Summary

Types of noise (EMI and EMS) in microcomputers

Importance of EMC

Reducing EMI by using optimum methods for pin assignments,
step-down power supply design, and on-chip power wiring
For more information on specific devices and related
support products and material, please visit our Web site:
http://america.renesas.com
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© 2008, Renesas Technology America, Inc., All Rights Reserved