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Transcript
RF2044A
GENERAL PURPOSE AMPLIFIER
RoHS Compliant and Pb-Free Product
Package Style: Micro-X Ceramic
GND
4
Features






M A R K IN G - 7 4
DC to >6000MHz Operation
Internally matched Input and
Output
18.5dB Small Signal Gain @
2GHz
4.0dB Noise Figure
50mW Linear Output Power
Single Positive Power Supply
R F IN
1
3
RF OUT
2
GND
Applications






Broadband, Low-Noise Gain
Blocks
IF or RF Buffer Amplifiers
Driver Stage for Power Amplifiers
Final PA for Low-Power Applications
High Reliability Applications
Broadband Test Equipment
Functional Block Diagram
Product Description
The RF2044A is a general purpose, low-cost RF amplifier IC. The device is
manufactured on an advanced Gallium Arsenide Heterojunction Bipolar
Transistor (HBT) process, and has been designed for use as an easily-cascadable 50 gain block. Applications include IF and RF amplification in
wireless voice and data communication products operating in frequency
bands up to 6000MHz. The device is self-contained with 50 input and
output impedances and requires only two external DC biasing elements to
operate as specified.
Ordering Information
RF2044AGeneral Purpose Amplifier
RF2044A
RF204XPCBA-41X
GaAs HBT
GaAs MESFET
InGaP HBT
General Purpose Amplifier
Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
DS120706
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 8
RF2044A
Absolute Maximum Ratings
Parameter
Input RF Power
Rating
Unit
+13
dBm
Operating Ambient Temperature
-40 to +85
°C
Storage Temperature
-60 to +150
°C
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Parameter
Min.
Specification
Typ.
Max.
Unit
Overall
Condition
T=25 °C, ICC =65mA
Frequency Range
3dB Bandwidth
Gain
17.0
DC to >6000
MHz
>3
GHz
19.5
dB
Freq=100MHz
19.5
dB
Freq=850MHz
dB
Freq=2000MHz
dB
Freq=3000MHz
18.5
20
18.0
17.0
Freq=4000MHz
14.1
Freq=6000MHz
Noise Figure
3.5
Input VSWR
<1.6:1
In a 50 system, DC to 5000MHz
<1.5:1
In a 50 system, 5000MHz to 6000MHz
Output VSWR
Output IP3
Output P1dB
dB
Freq=2000MHz
<1.4:1
In a 50 system, DC to 3000MHz
<1.5:1
In a 50 system, 3000MHz to 6000MHz
+29
+32
dBm
Freq=2000MHz
+16.5
+17.5
dBm
Freq=2000MHz
22
dB
Reverse Isolation
Thermal
Freq=2000MHz
ICC =65mA, PDISS =300mW (See Note 1.)
ThetaJC
270
°C/W
VPIN =4.55V
Maximum Measured Junction
Temperature at DC Bias Conditions
166
°C
TAMB =+85°C
Mean Time To Failure
>100
years
TAMB =+85°C
Power Supply
Device Operating Voltage
Operating Current
With 24 bias resistor, T=+25°C
4.4
4.5
4.6
V
At pin 3 with ICC =65mA
5.5
5.9
6.5
V
At evaluation board connector, ICC =65mA
65
mA
See Note 2.
NOTES:
Note 1: The RF2044A must be operated at or below 65mA in order to achieve the thermal performance stated above. Operating at 65mA will
ensure the best possible combination of reliability and electrical performance.
Note 2: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution should be
used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 65mA over all intended operating conditions.
2 of 8
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120706
RF2044A
Pin
1
Function
RF IN
2
GND
3
RF OUT
Description
Interface Schematic
RF input pin. This pin is NOT internally DC-blocked. A DC-blocking capacitor,
suitable for the frequency of operation, should be used in most applications. DC-coupling of the input is not allowed, because this will override the
internal feedback loop and cause temperature instability.
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
RF output and bias pin. Biasing is accomplished with an external series
resistor and choke inductor to VCC. The resistor is selected to set the DC
current into this pin to a desired level. The resistor value is determined by
the following equation:
 V SUPPLY – V DEVICE 
R = -----------------------------------------------------I CC
4
GND
RF OUT
RF IN
Care should also be taken in the resistor selection to ensure that the current into the part never exceeds 65mA over the planned operating temperature. This means that a resistor between the supply and this pin is always
required, even if a supply near 4.5V is available, to provide DC feedback to
prevent thermal runaway. Because DC is present on this pin, a DC-blocking
capacitor, suitable for the frequency of operation, should be used in most
applications. The supply side of the bias network should also be well
bypassed.
Same as pin 2.
Package Drawing
0.025
± 0.002
0.052
0.041
3
0.070
sq.
0.068
± 0.002
45° ± 1°
0.005
± 0.002
0.020
± 0.002
0.200 Sq.
Typ.
0.015
+0.002
-0.001
0.040
± 0.002
NOTES:
1. Shaded lead is pin 1.
2. Darkened areas are metallization.
3. Dimension applies to ceramic lid minus epoxy coating.
DS120706
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
3 of 8
RF2044A
Application Schematic
VCC
10 nF
22 pF
47 nH
4
RBIAS
22 pF
RF IN
1
3
RF OUT
22 pF
2
4 of 8
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120706
RF2044A
Evaluation Board Schematic
P1
P1-1
NC
1
VCC
2
GND
Drawing 204X400-
VCC
P1-1
3
R1
24 
4
RF IN
J1
50  strip
L1
100 nH
C1
100 pF
1
C3
100 pF
50  strip
3
C2
100 pF
C4
1 F
RF OUT
J2
2
Evaluation Board Layout
Board Size 1.195" x 1.000"
DS120706
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
5 of 8
RF2044A
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3inch
to 8inch Gold over 180inch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Mask Pattern
A = 1.90 x 1.14 Typ.
B = 0.63 x 1.90 Typ.
Dimensions in
mm.
A
Pin 1
B
3.68 Typ.
B
1.84 Typ.
A
1.84 Typ.
3.68 Typ.
Figure 1. PCB Metal Land Pattern - RF204X (Top View)
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
6 of 8
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120706
RF2044A
A = 2.06 x 1.30 Typ.
B = 0.79 x 2.06 Typ.
Dimensions in
mm.
A
Pin 1
B
3.68 Typ.
B
1.84 Typ.
A
1.84 Typ.
3.68 Typ.
Figure 2. PCB Solder Mask - RF204X (Top View)
DS120706
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
7 of 8
RF2044A
Reverse Isolation versus Frequency Across
Temperature (ICC = 65 mA)
23.0
Gain versus Frequency Across Temperature
(ICC = 65 mA)
-40°C
20.0
25°C
22.0
85°C
Gain (dB)
Reverse Isolation (dB)
18.0
21.0
20.0
16.0
14.0
19.0
-40°C
18.0
12.0
25°C
85°C
17.0
10.0
0.0
1000.0
2000.0
3000.0
4000.0
5000.0
6000.0
0.0
1000.0
Frequency (MHz)
3000.0
4000.0
6000.0
Noise Figure versus Frequency Across Temperature
(ICC = 65 mA)
6.0
-40°C
-40°C
34.0
25°C
5.5
25°C
85°C
85°C
5.0
Noise Figure (dB)
32.0
30.0
OIP3 (dBm)
5000.0
Frequency (MHz)
Output IP3 versus Frequency Across Temperature
(ICC=65mA)
36.0
2000.0
28.0
26.0
4.5
4.0
3.5
24.0
3.0
22.0
2.5
20.0
2.0
0.0
500.0
1000.0
1500.0
2000.0
2500.0
3000.0
3500.0
4000.0
0.0
500.0
Frequency (MHz)
1000.0
1500.0
Input VSWR versus Frequency Across Temperature
2500.0
3000.0
Output VSWR versus Frequency Across Temperature
(ICC = 65 mA)
2.8
2000.0
Frequency (dB)
(ICC = 65 mA)
1.9
-40°C
2.6
25°C
1.8
2.4
1.7
2.2
1.6
2.0
1.5
VSWR
VSWR
85°C
1.8
1.4
1.6
1.3
1.4
1.2
1.2
1.1
-40°C
25°C
85°C
1.0
1.0
0.0
1000.0
2000.0
3000.0
4000.0
Frequency (MHz)
8 of 8
5000.0
6000.0
0.0
1000.0
2000.0
3000.0
4000.0
5000.0
6000.0
Frequency (MHz)
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120706