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Transcript
SOLUTIONS - SEMESTER ONE –REPEAT - 2007
MODULE:
Digital Circuits and Systems (EE201)
COURSE:
B.Eng. in Info and Communications Engineering
B.Eng. in Mechatronic Engineering
B.Eng. in Electronic Engineering
B.Eng. in Digital Media Engineering
YEARS:
2 (two) and 3 (three)
EXAMINERS:
Mr. David Bermingham
Dr. R. Millar
Dr. F. Derek
TIME ALLOWED: 2 hours
INSTRUCTIONS:
Answer FOUR questions. All questions carry equal marks
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 1/10
QUESTION 1
A)
Design a 1-line to 4-line demultiplexer using logic gates and briefly
describe its operation. How can this demultiplexer be used as a 2-line
to 4-line decoder?
A demultiplexer transfers its input to one of the outputs depending on
the binary code provided at the select inputs.
O0
O1
I
DMUX
ON-1
S0 S1
SM-1
1:4 line Demultiplexers:
1 data line (I), 2 select line (S0 & S1) and 4 output lines(O3-O0)
S
0
0
1
1
S
O2
O3
0
0
1
0
0
0
1
I
O1
0
0
0
I
I
0
0
0
O0
I
0
0
0
Using logic gates
I
O0
S0
S1
O1
O2
O3
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 2/10
By connecting the data line to 1, the 1:4 demultiplexer can be used as
2:4 line decoder. For every input sequence on S0, S1 a single output bit
will set.
(10 Marks)
B)
Implement the following logic function using only 4-line to 1-line
multiplexers:
F  A.B.C.D  A.B.C.D  A.B.C.D  A.B.C.D
Question 2
A)
Compare the serial and the parallel interfaces between computers and
peripherals by indicating their advantages and disadvantages.
Serial Interface – advantages

Peripheral ca be located far from the computer

Lower cost of wiring

Less susceptible to noise

More flexible in terms of transmission technologies
Serial Interface – disadvantages

Low transmission rate

Requires parallel-serial and serial-parallel conversion
Parallel Interface – advantages

High transmission rate

Does not require conversion
Parallel Interface – disadvantages

Peripheral has to be located close to the computer

High cost of wiring

More susceptible to noise

Less flexible in terms of transmission technologies
(8 Marks)
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 3/10
b)
Draw a block diagram of an ACIA type serial interface controller.
Clock
Generator
Transm.
Status
Parity
Generator
Data/Shift
Register
Register
Control
Register
IR
Q
Reception
RCLK
Clock
Generator
Data/Shift
Register
Parity
Generator
TxCL
K
Data Bus
Tx
D
CTS
RTS
RxD
(7 Marks)
C)
Describe the function of each block of the diagram drawn in Q2 b)

Transmission Data/Shift Register – accepts parallel data from
Data Bus, inserts necessary parity bits and shifts data, one-bit at
a time, to TxD serial line

Reception Data/Shift Register – receives serial data from RxD
line, shifts the data, removing also the parity bits and delivers
parallel data to the Data Bus

Control Register – determines the format of the serial data
(transmission frequency, number of data bits, parity), the clock
to be used (external or built-in) and enables interrupts during the
transmission and reception of data respectively

Status Register – gives information about the status of the
conversion process transmit/receive (e.g. errors, parity,
interrupts, handshaking signals, etc.)

Clock Generator – generates clock signal for transmission and
reception of data respectively

Parity Generator – generate parity bits for transmission and
reception of data respectively
(10 Marks)
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 4/10
Question 3
A) Compare the three possible output configurations possible when using
TTL circuits. Compare and contrast the methods when applied to data
bussing.
Open collector output:
+5V
4k
A
Q1
1.6k
F
Q2
Q2B
Q3
1k
0V
The output signal F changes between floating high (1) and logic 0
when Q3 is ON. Open collector output can only sink current with an
additional pull-up resistor at the output to allow current to be sourced
for the next logic stage. The resistor value will determine how fast an
open-collector TTL circuit can be switched.
TTL Totem-Pole:
+5V
4k
A
B
1k
Q3B
Q1
Q3
Q2
Q2B
D1
Q4B
F
Q4
1k
0V
In totem pole configuration and additional pair of BJTs are added to
the TTL logic to ensure both proper logic levels and faster operation.
The figure above shows a TTL NAND gate using totem-pole
configuration
B)
Describe, using a diagram, the structure and operation of a CMOS
NAND gate. Why does its power dissipation depend on the frequency
of operation?
C)
A 74LS00 NAND gate is used to drive similar NAND gates. Given the
following parameters for a 74LS00 NAND, IIH=20µA, IOH=-0.4mA, IIL=0.4mA, IIH=8mA. Determine the fanout of a single 74LS00 NAND gate.
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 5/10
Determine Fanout when logic high:
Fanout when high => IOH / IIH = 400/20
=> 20 Gates
Determine Fanout when logic low:
Fanout when low => IIH / IIL =
8/0.4
=> 20 Gates
To determine the Fanout you select the lower of the two figures. For
74LS00 NAND gate the Fanout is the same for both states.
=> Each NAND gate can drive 20 gates.
(5 Marks)
Question 4
A) An 8-bit ripple carry adder is constructed using NAND logic. If the
propagation delay for a NAND gate is 250 pS what is the maximum
addition time for the adder?
Ripple carry adder has 2 gates in the critical path, an AND gate and OR gate.
Both gates are comprised of a NAND array with 2 NAND delays. The overall
delay for a single NAND RCA cell is 4 NAND gates.
For an 8-bit RCA, there will be 8*4 NAND gates in the critical path.
=> 8 * 4 * 250ps = 8nS adder delay
(5 Marks)
B)
Outline an algorithm for addition of two floating-point numbers.
Lets assume that A*2a and B*2b will be added

In order for the addition to be performed, the exponents of the
two numbers have to be equalised and their mantissas shifted
accordingly:
Test the values of a and b using either a comparator or subtractor


If a>b, B is right shifted a-b places, obtaining B’

If a<b, A is right shifted b-a places, obtaining A’

If a=b, no shift is required
To obtain the mantissa of the result

If a>b => MANTISSARES = A + B’

If a<b => MANTISSARES = A’ + B

If a=b => MANTISSARES = A + B
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 6/10


To obtain the exponent of the result:

If a>b => EXPRES= a

If a<b => EXPRES= b

If a=b => EXPRES= a or b
Normalise result by shifting right until bits either side of decimal point are
different.
C)
Multiply using the Booth algorithm +8 and –12. Design the hardware
required for this multiplication. Indicate the major signals required.
Multiplicand
Load Md
A3 A2 A1 A0
!Add/Sub
B3 B2 B1 B0
!Nop/Op
Multiplier
Reset
R7 R6 R5 R4 R3 R2 R1 R0
Load Mr
R-1
Reset
R Shift

the 8-bit register R is cleared using the signal Reset

the multiplicand is loaded using Load Md

the multiplier is loaded using Load Mr

Depending on the values of R0 and R-1 addition, subtraction or no
operation is performed at every Clock:


when the R0R-1 are 10 SUB is performed

when the R0R-1 are 01 ADD is performed

when the R0R-1 are 00 or 11 no operation is performed
register R is right shifted at every Clock using signal R Shift
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 7/10
Multiplicand (Y)
0
1
0
0
0
Multiplier (X)
1
0
1
0
0
Result (R)
Step



(+810)
0
(-1210)
Action
0
0
0
0
0
0
0
0
0
0
Initialisation
0
0
0
0
0
0
0
0
0
0
00 => NOP
0
0
0
0
0
0
0
0
0
0
A. Right Shift
0
0
0
0
0
0
0
0
0
0
00 => NOP
0
0
0
0
0
0
0
0
0
0
A. Right Shift
0
1
0
0
0
10 => SUB (R, Y)
1
0
1
1
1
A. Right Shift
1
1
0
0
0
01 => ADD(R,Y)

A. Right Shift
11 => NOP

A. Right Shift
Verif.
Result = -9610
Question 5
A)
Briefly describe the dynamic RAM cell and its operation. How does it
compare with a single static RAM cell in terms of area, speed, control
circuitry and power
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 8/10
DRAM Structure
To access such a cell one needs to have access to a word line and a bit line.
To write the memory cell, the bit line is charged to a logic 1 or 0 voltage
while the word line is asserted. This enables the access transistor, making it
possible to charge up the storage capacitor with the desired logic voltage.
The read operation takes place by asserting the word line. The access
transistor is turned on, sharing the voltage on the capacitor with the bit line.
Sensitive amplifier circuits detect small changes on the bit line to determine
whether a 1 or 0 was stored in the selected memory element.
The destructiveness of the read operation makes DRAMs complex. To
read the contents of the storage capacitor, we must discharge it across the bit
line. Thus, external circuitry in the DRAM must buffer the values that have
been read out and then write them right back.
The second problem with DRAMs, and the most significant one is that
their contents decay over time. Every once in a while (measured in
milliseconds), the charge on the storage capacitors leaks off. To counteract
this, the DRAM must be refreshed. Periodically, the memory elements must
be read and written back to their storage locations.
To make this operation reasonably efficient, the DRAM's memory array
is a two-dimensional matrix organized as follows:
The figure shows the block diagram of a 4096 by 1-bit DRAM. Rather than refresh
individual bits, a refresh cycle reads out and writes back an entire row. This happens
about once every few microseconds. The row is typically a multiple of the DRAM's
word size. In this case, it is 64 bits wide. The refresh cycles are generated by an
external memory-controller.
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 9/10
Comparison to SRAM
 Advantages of DRAM
o Denser : Smaller Area required
o Cheaper: Cost per bit is less
o Power: More power efficient than high speed SRAM
 However SRAM can be designed to consume little
power

B)
Disadvantages of DRAM
o Control Logic : Requires memory controller to ensure
data is refreshed automatically unlike SRAM
o Interface: Much more complicated to interface than
simple address/data bus structure of SRAM
o Speed: Difficult to scale DRAM to ultra high performance
without long latencies, errors, etc. High speed memory
like processor cache uses SRAM cells
o Power: Power consumption analysis must include
additional control circuitry in calculations.
 PD(SRAM) = Power dissipated by SRAM cells at
freq f
 PD(SRAM) = Power dissipated by DRAM cells at
freq f + Power dissipated by DRAM controller
(15 Marks)
Compare the architecture of PROM and PLA and state the
advantages, disadvantages and suitable applications of each?
___________________________________________________________________________________________
EE201 - Digital Circuits and Systems - Semester One - 2006/2007
page 10/10