Download Master Program in Semiconductor Technology

Master Program in Semiconductor Technology (MS)
The Semiconductor Technology program bridges the gap between theoretical research and the reality of
the semiconductor industry. Our students gain rare hands-on work experience through utilizing the
Department’s virtual fabrication capabilities and collaborating with leading high-tech companies, including
TSMC, Vanguard, and Nuvoton. Additionally, we work with our industry partners to ensure all of the
students in our program secure summer internships at leading international electronics companies.
Our core curriculum includes device physics, semiconductor process engineering, advanced electronic
device/circuit design, and device reliability. We leverage proprietary leading edge Technology- ComputerAided-Design (TCAD) simulations to better prepare our students for the real world of electronics design and
manufacturing. All of our recent alumni have graduated into successful careers in areas such as analog
circuit design, nano-scale, microelectronics, and power device engineering.
學程名稱:(中文) 半導體資訊
(英文) Master Program in Semiconductor Technology
Category Course Title(中,英文)
Year of
Semester Credits
the
program
（6）
University Master Thesis
2nd
1st and 2nd
6
Required 碩士論文
Credits
（2）
Program Thesis Presentations (I) (II)
1st
1st and 2nd
2
Required 論文研討(一)(二)
Credits
Microelectronics
電子電路(一)
1st
1st or 2nd
3
Integrated Circuits
積體電路
1st
1st or 2nd
3
Semiconductor Device Physics
半導體物理及元件
1st
1st or 2nd
3
1st
1st or 2nd
3
1st
1st or 2nd
3
Material Engineering
材料分析
1st
1st or 2nd
3
Semiconductor Manufacturing
Technology
積體電路製造實務
2nd
1st or 2nd
3
VLSI Design and Process Technology
超大型積體電路設計實務
2nd
1st or 2nd
3
Semiconductor Process Engineering
（24）
半導體製程
Program
Elective Product Design and Development
Credits
產品工程
Remarks
Advanced Microelectronics
電子電路(二)
1st
1st or 2nd
3
Analog Circuits
類比電路
1st
1st or 2nd
3
Integrated Circuits Testing
積體電路測試導論
1st
1st or 2nd
3
Semiconductor Failure Analysis
半導體故障分析
1st
1st or 2nd
3
總畢業學分數為 32 學分(含校、系定必修核心課程 8 學分與系定選修課程 24 學分)
Graduation requirement: 32 credits (including 8 credits of Required Courses and 24 credits of Elective
Courses)
Course Description
Course Title
Course description
This course covers the following contents:
1. Selection of research topics
2. Introduction to thesis design
Thesis Presentations(I)(II) 3. Methodologies and references in research
4. Motivation of thesis study
論文研討(一)(二)
5. Approaches to researches
6. Writing methods
7. Introduction of presentation skills
8. Oral presentation
This course covers the following contents:
1. Semiconductor diodes circuits
2. Introduction of bipolar junction transistors (BJTs)
Microelectronics
3. DC biasing analysis of BJTs
4. Modeling of BJT transistors
電子電路
5. Introduction of metal-oxide-semiconductor capacitors
6. Introduction of field-effect transistors (FETs)
7. Biasing analysis of FETs
This course covers the following contents:
1. Introduction of integrated circuit history and production
2. Fundamentals of semiconductor physics
Integrated Circuits
3. Introduction of NMOS and PMOS devices
4. Introduction of CMOS process integration
積體電路
5. Concept of CMOS integrated circuit design
6. Introduction of bipolar transistors
7. Introduction of BiCMOS integrated circuitry
This course is designed to teach students basic silicon device physics,
Semiconductor Device
including band gap theory, PN junction, doping and fermi level,
Physics
threshold voltage, MOS device, and silicon on insulator physics.
半導體物理及元件
Semiconductor Process
Engineering
半導體製程
Product Design and
Development
產品工程
Material Engineering
材料分析
This course will provide students with the knowledge of semiconductor
device fabrication processes, including
1. Wafer production
2. Ion implantation and etching, and thermal processes (such as
oxidation, thermal annealing, and dopant diffusion)
3. Film deposition
4. Device isolation
5. Metallization of contact, and so forth
This course covers the following contents:
1. Product development process
2. Concept generation
3. Concept evaluation
4. Concept selection
5. ID design
6. Proto typing
7. Robust design
8. Harvard case study
The aim of this course is to introduce the fundamentals and
measurements of analytical methods in order to enable students to
understand material characteristics, such as SEM, AFM, TEM, XPS,
and so forth. Upon the completion of this course, students will be able
to understand microstructure, chemical, and composition analysis of a
variety of materials.
Semiconductor
Manufacturing
Technology
積體電路製造實務
This course covers the following contents:
1. Introduction of semiconductor fabrication process
2. BCD (Bipolar, CMOSFET, DMOSFET) process technology
3. Integration circuit fabrication
This course covers the following contents:
1. Introduction to Semiconductors
2. Semiconductor Basic Electronic Device
3. Fabrication of N MOS and N MOS Transistor
4. CMOS Transistors
The course covers the following contents:
1. Characteristics of MOS capacitors
2. DC biasing analysis of FETs
3. AC biasing analysis of FETs
Advanced
4. Frequency response of FETs
Microelectronics
5. DC biasing analysis of BJTs
6. AC biasing analysis of BJTs
電子電路(二)
7. Frequency response of BJT
8. Compound configurations, including cascade and cascode
connection, current source circuitry, current mirror circuitry, amplifier
circuitry and CMOS circuitry, and so forth
This course provides students with knowledge on the various essential
analog circuit designs and layouts, including:
1. Single-Transistor and Two-Transistor Amplifiers
2. Coupled Circuit and Differential Amplifiers
Analog Circuits
3.Transister Current Sources and Active Loads
4. Matching and Biasing Circuits
類比電路
5. Operational Amplifiers
6. Frequency Response of ICS
7. Frequency Response and Stability of Feedback Amplifiers
8. Device and Circuit layout consideration
The course covers the following contents:
Integrated Circuits Testing 1. Introduction to Electrical Measurements
2. Resistance and Junction Measurements
積體電路測試導論
3. Gate oxide and MOSFET Measurements
4. Reliability Measurements
VLSI Design and Process
Technology
超大型積體電路設計實
務
Semiconductor Failure
Analysis
半導體故障分析
Understanding a material’s microstructure is becoming more critically
important in the development of engineering materials. This course
aims to help students gain insights into the fault analysis of
semiconductor devices by examining the many case studies offered
throughout the course (such as x-ray diffraction (XRD) and SEM and
TEM analysis)
Faculty Members
Instructor’s title
資工系主任/教授
Department Chairman
/Professor
教授
Professor
助理教授
Assistant Professor
助理教授
Assistant Professor
助理教授
Assistant Professor
Instructor’s name
陳永欽 博士
Dr.Yun.Chin Chen
Contact Information
Ext ; 6100
Email: [email protected]
許 健 博士
Dr. Gene Sheu
蔡宗叡 博士
Dr. Jung-Ruey Tsai
楊紹明 博士
Dr. Shao-Ming Yang
陳興忠 博士
Dr.Hsing-Chung Chen
Ext (or Mobile): 0916-853861
Email: [email protected]
Ext (or Mobile): 0986-725850
Email: [email protected]
Ext (or Mobile): 0975-718720
Email: [email protected]
Ext ; 48015
Email: [email protected]