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Master Program in Semiconductor Technology (MS) The Semiconductor Technology program bridges the gap between theoretical research and the reality of the semiconductor industry. Our students gain rare hands-on work experience through utilizing the Department’s virtual fabrication capabilities and collaborating with leading high-tech companies, including TSMC, Vanguard, and Nuvoton. Additionally, we work with our industry partners to ensure all of the students in our program secure summer internships at leading international electronics companies. Our core curriculum includes device physics, semiconductor process engineering, advanced electronic device/circuit design, and device reliability. We leverage proprietary leading edge Technology- ComputerAided-Design (TCAD) simulations to better prepare our students for the real world of electronics design and manufacturing. All of our recent alumni have graduated into successful careers in areas such as analog circuit design, nano-scale, microelectronics, and power device engineering. 學程名稱:(中文) 半導體資訊 (英文) Master Program in Semiconductor Technology Category Course Title(中,英文) Year of Semester Credits the program (6) University Master Thesis 2nd 1st and 2nd 6 Required 碩士論文 Credits (2) Program Thesis Presentations (I) (II) 1st 1st and 2nd 2 Required 論文研討(一)(二) Credits Microelectronics 電子電路(一) 1st 1st or 2nd 3 Integrated Circuits 積體電路 1st 1st or 2nd 3 Semiconductor Device Physics 半導體物理及元件 1st 1st or 2nd 3 1st 1st or 2nd 3 1st 1st or 2nd 3 Material Engineering 材料分析 1st 1st or 2nd 3 Semiconductor Manufacturing Technology 積體電路製造實務 2nd 1st or 2nd 3 VLSI Design and Process Technology 超大型積體電路設計實務 2nd 1st or 2nd 3 Semiconductor Process Engineering (24) 半導體製程 Program Elective Product Design and Development Credits 產品工程 Remarks Advanced Microelectronics 電子電路(二) 1st 1st or 2nd 3 Analog Circuits 類比電路 1st 1st or 2nd 3 Integrated Circuits Testing 積體電路測試導論 1st 1st or 2nd 3 Semiconductor Failure Analysis 半導體故障分析 1st 1st or 2nd 3 總畢業學分數為 32 學分(含校、系定必修核心課程 8 學分與系定選修課程 24 學分) Graduation requirement: 32 credits (including 8 credits of Required Courses and 24 credits of Elective Courses) Course Description Course Title Course description This course covers the following contents: 1. Selection of research topics 2. Introduction to thesis design Thesis Presentations(I)(II) 3. Methodologies and references in research 4. Motivation of thesis study 論文研討(一)(二) 5. Approaches to researches 6. Writing methods 7. Introduction of presentation skills 8. Oral presentation This course covers the following contents: 1. Semiconductor diodes circuits 2. Introduction of bipolar junction transistors (BJTs) Microelectronics 3. DC biasing analysis of BJTs 4. Modeling of BJT transistors 電子電路 5. Introduction of metal-oxide-semiconductor capacitors 6. Introduction of field-effect transistors (FETs) 7. Biasing analysis of FETs This course covers the following contents: 1. Introduction of integrated circuit history and production 2. Fundamentals of semiconductor physics Integrated Circuits 3. Introduction of NMOS and PMOS devices 4. Introduction of CMOS process integration 積體電路 5. Concept of CMOS integrated circuit design 6. Introduction of bipolar transistors 7. Introduction of BiCMOS integrated circuitry This course is designed to teach students basic silicon device physics, Semiconductor Device including band gap theory, PN junction, doping and fermi level, Physics threshold voltage, MOS device, and silicon on insulator physics. 半導體物理及元件 Semiconductor Process Engineering 半導體製程 Product Design and Development 產品工程 Material Engineering 材料分析 This course will provide students with the knowledge of semiconductor device fabrication processes, including 1. Wafer production 2. Ion implantation and etching, and thermal processes (such as oxidation, thermal annealing, and dopant diffusion) 3. Film deposition 4. Device isolation 5. Metallization of contact, and so forth This course covers the following contents: 1. Product development process 2. Concept generation 3. Concept evaluation 4. Concept selection 5. ID design 6. Proto typing 7. Robust design 8. Harvard case study The aim of this course is to introduce the fundamentals and measurements of analytical methods in order to enable students to understand material characteristics, such as SEM, AFM, TEM, XPS, and so forth. Upon the completion of this course, students will be able to understand microstructure, chemical, and composition analysis of a variety of materials. Semiconductor Manufacturing Technology 積體電路製造實務 This course covers the following contents: 1. Introduction of semiconductor fabrication process 2. BCD (Bipolar, CMOSFET, DMOSFET) process technology 3. Integration circuit fabrication This course covers the following contents: 1. Introduction to Semiconductors 2. Semiconductor Basic Electronic Device 3. Fabrication of N MOS and N MOS Transistor 4. CMOS Transistors The course covers the following contents: 1. Characteristics of MOS capacitors 2. DC biasing analysis of FETs 3. AC biasing analysis of FETs Advanced 4. Frequency response of FETs Microelectronics 5. DC biasing analysis of BJTs 6. AC biasing analysis of BJTs 電子電路(二) 7. Frequency response of BJT 8. Compound configurations, including cascade and cascode connection, current source circuitry, current mirror circuitry, amplifier circuitry and CMOS circuitry, and so forth This course provides students with knowledge on the various essential analog circuit designs and layouts, including: 1. Single-Transistor and Two-Transistor Amplifiers 2. Coupled Circuit and Differential Amplifiers Analog Circuits 3.Transister Current Sources and Active Loads 4. Matching and Biasing Circuits 類比電路 5. Operational Amplifiers 6. Frequency Response of ICS 7. Frequency Response and Stability of Feedback Amplifiers 8. Device and Circuit layout consideration The course covers the following contents: Integrated Circuits Testing 1. Introduction to Electrical Measurements 2. Resistance and Junction Measurements 積體電路測試導論 3. Gate oxide and MOSFET Measurements 4. Reliability Measurements VLSI Design and Process Technology 超大型積體電路設計實 務 Semiconductor Failure Analysis 半導體故障分析 Understanding a material’s microstructure is becoming more critically important in the development of engineering materials. This course aims to help students gain insights into the fault analysis of semiconductor devices by examining the many case studies offered throughout the course (such as x-ray diffraction (XRD) and SEM and TEM analysis) Faculty Members Instructor’s title 資工系主任/教授 Department Chairman /Professor 教授 Professor 助理教授 Assistant Professor 助理教授 Assistant Professor 助理教授 Assistant Professor Instructor’s name 陳永欽 博士 Dr.Yun.Chin Chen Contact Information Ext ; 6100 Email: [email protected] 許 健 博士 Dr. Gene Sheu 蔡宗叡 博士 Dr. Jung-Ruey Tsai 楊紹明 博士 Dr. Shao-Ming Yang 陳興忠 博士 Dr.Hsing-Chung Chen Ext (or Mobile): 0916-853861 Email: [email protected] Ext (or Mobile): 0986-725850 Email: [email protected] Ext (or Mobile): 0975-718720 Email: [email protected] Ext ; 48015 Email: [email protected]