Download package ruggedness absolute maximum ratings features description

Survey
yes no Was this document useful for you?
   Thank you for your participation!

* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project

Document related concepts

Audio power wikipedia , lookup

Immunity-aware programming wikipedia , lookup

Decibel wikipedia , lookup

Electric power system wikipedia , lookup

Electrical ballast wikipedia , lookup

Electrical substation wikipedia , lookup

Heterodyne wikipedia , lookup

Ohm's law wikipedia , lookup

Three-phase electric power wikipedia , lookup

Current source wikipedia , lookup

Power over Ethernet wikipedia , lookup

Power engineering wikipedia , lookup

History of electric power transmission wikipedia , lookup

Resistive opto-isolator wikipedia , lookup

Power inverter wikipedia , lookup

Islanding wikipedia , lookup

Thermal runaway wikipedia , lookup

Rectifier wikipedia , lookup

Semiconductor device wikipedia , lookup

Variable-frequency drive wikipedia , lookup

Pulse-width modulation wikipedia , lookup

Transistor wikipedia , lookup

TRIAC wikipedia , lookup

Stray voltage wikipedia , lookup

Voltage regulator wikipedia , lookup

Tektronix analog oscilloscopes wikipedia , lookup

Surge protector wikipedia , lookup

Opto-isolator wikipedia , lookup

Voltage optimisation wikipedia , lookup

Switched-mode power supply wikipedia , lookup

Power electronics wikipedia , lookup

Buck converter wikipedia , lookup

Alternating current wikipedia , lookup

Mains electricity wikipedia , lookup

Transcript
DESCRIPTION
PACKAGE
The high power HV1011-1000L device is a high
voltage silicon enhancement mode RF transistor
designed for L-band pulsed avionics applications
operating over the frequency range of 1030 MHZ
to 1090MHz.
FEATURES
High Power Gain
Excellent Ruggedness
50V Supply Voltage
ABSOLUTE MAXIMUM RATINGS
Symbol
VDSS
VGS
Parameter
Drain-Source Voltage
Gate-Source Voltage
IDSX
PD2
TS
Drain Current
Power Dissipation
Storage Temperature
TJ
Junction
Temperature
Value
95
-10 to
+10
80
TBD
-65 to
+150
200
Unit
V
V
A
W
°C
°C
THERMAL CHARACTERISTICS
Symbol
1
JC
Parameter
Thermal Resistance
Max
TBD
Unit
°C/W
The device utilizes a RoHS compliant flanged
package with a ceramic lid. The HV1230
package style is qualified for gross leak test –
MIL-STD-883, Method 1014.
RUGGEDNESS
The HV1011-1000L device is capable of
withstanding an output load mismatch
corresponding to a 20:1 VSWR at rated output
power over all phase angles and operating
voltage across the frequency band of
operation.
Symbol
LMT1
Parameter
Load
Mismatch
Tolerance
Test Condition
POUT = 1000W
Max
20:1
Units
VSWR
F = 1030 MHz
ELECTRICAL CHARACTERISTICS
Symbol
VBR(DSS)
IDSS
IGSS
GP1
IRL1
1
D
1
PD
BD1
1
2
Parameter
Drain-Source Breakdown
Drain Leakage Current
Gate Leakage Current
Power Gain
Input Return Loss
Drain Efficiency
Pulse Droop
Burst Droop
Conditions
VGS=0V,ID=10mA
VGS=0V,VDS=50V
VGS=5V,VDS=0V
POUT=1000W, F=1030 MHz
POUT=1000W, F=1030 MHz
POUT=1000W, F=1030 MHz
POUT=1000W, F=1030 MHz
POUT=1000W, F=1030 MHz
Typ
102
<500
<10
15.5
10
50
<0.20
<0.20
Units
V
A
A
dB
dB
%
dB
dB
Under Pulse Conditions: Pulse Width = 32 s on/18 s off x 48, repeat every 24ms with VDD=50V, IDQ=200mA
Rated at TCASE = 25°C
7525 ETHEL AVENUE
NORTH HOLLYWOOD, CA 91605 (818) 982-1200
Specifications are subject to change without notice.
WWW.ADSEMI.COM
>LL'&''#'&&&B
'&&&MWjji"+&L"'&)&#'&/&C>p
)(kied%'.kie\\n*.h[f[Wj[l[ho(*ci
!
Typical device performance under Class AB mode of operation and RF signal conditions of 50!s pulse width and
2% duty cycle with VDD = 50V and IDQ = 100mA.
Typical device performance under Class AB mode of operation and RF burst conditions of 32!s on/18!s off x 48,
repeated every 24ms with VDD = 50V and IDQ = 100mA.
PACKAGE DIMENSIONS
ASI
PART NUMBER
JDATE CODE
inches
mm
DRAIN
Note: Drawing is not actual size.
GATE
SOURCE
ASI Semiconductor, Inc. (ASI) reserves the right to make changes to information published in this
document at any time and without notice. This document supersedes and replaces all information
supplied prior to the publication hereof. Information in this document is believed to be accurate and
reliable. However, ASI does not give any representations or warranties, either express or implied, as
to the accuracy or completeness of such information and shall have no liability no liability for conse-quences resulting from the use of such information. No license, either expressed or implied, is conveyed
under any ASI intellectual property rights, including any patent rights.