Download Compunetics Capabilities Overview

Blind Micro-vias
Embedded Resistors
Multi-Tier Boards
Chip-on-flex
RF Product
Multi-chip Modules
Embedded Capacitance
Fine-line Technology
Capabilities Overview
2/8/08
Compunetics, Inc.
Agenda
• Corporate Overview
• Compunetics, Inc. Company Profile
• Current Capabilities
• Technology Roadmap
• Future Plans
• Samples
2/8/08
Compunetics, Inc.
Corporate Overview
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30+ Years
Experience in
Design,
Development and
Manufacture of
Highly-sophisticated Electronic Systems
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Telecommunications, Medical, Industrial, Transportation
and Government Markets
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Internal Control over Manufacturing
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330+ Employees
2/8/08
Compunetics, Inc.
Corporate Overview
Compunetix, Inc.
Compunetics, Inc.
Chorus Call, Inc.
Instrumentation
Systems Division
Communication
Systems Division
Chorus Call, Inc.
USA
Printed Circuit Board
Group
Chorus Call
International
Switzerland
Germany
Italy
India
South Africa
Greece
Brazil
Canada
Australia
Video
Systems Division
Federal
Systems Division
2/8/08
Compunetics, Inc.
Company Profile
Compunetics, Inc.
Manufacturing
Engineering
Quality
Services
Global
Products
Production
Engineering Group Consisting
Of 8 Engineers Dedicated To
Managing / Fabricating Critical
Or Technologically Challenging
Projects
2/8/08
Sales / Marketing
Company Differentiators
Compunetics, Inc.
Engineering
Services
PCB Layout & Design To
Handle Customer Design
Overflow And To Give Support
To Customer’s Design Group
Company Profile
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2/8/08
SBA/FAR 19 Small Business
38 Years Experience Producing Complex Interconnect
Systems
Customers in Commercial, Education,
Telecommunication, and Government Markets
Independent Internal R&D
ESOP
2007 Revenues: $11.0 Million
70+ Employees
25+ Engineers and Professionals
ISO9001:2000 Registered and MIL Spec Certified
Compunetics, Inc.
Company Profile
Quality Certifications
• ISO 9001:2000 Registered
• UL Certified for Single / Double Sided and
Multilayer Boards
• ITAR Registered
• MIL-P-55110 Certified for FR4, Polyimide
• General Dynamics Land Systems Certified for
Prototypes and Production
• Hamilton Sundstrand Space Certification
• JPL / NASA Flight Certified
• General Dynamics UK Award For “Best Overall
Business Performance 2004 / 2005”
2/8/08
Compunetics, Inc.
Company Profile
Types of Business
• Prototypes, Quick Turn & Small To Medium Production
• Military Spec PCBs
• Backplanes
• Rigid, Flex & Rigid/Flex (Class 2, 3 & Mil Spec)
• High Layer Count – Up to 52 Layers, High Density PCBs
• Independent Design/Drafting Group
• Buried Passives
• High Density Interconnects
• Multi Chip Modules, Chip-On-Board
• Engineering / Design Assistance
2/8/08
Compunetics, Inc.
Company Profile
Customer Base
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2/8/08
General Dynamics
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Land Systems
United Kingdom
AIS
ATP
Lockheed Martin
DoD / DoE
IBM
ITT / EDO
Intel
Tektronix
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Compunetics, Inc.
Orbital
DRS
Northrop Grumman
Terumo
Raytheon
L3 Communications
Philips Medical
Maxtek
David Sarnoff
Bombardier
Kadflex
Capabilities
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2/8/08
Engineering Services
PCBs With 35 Micron Lines And Spaces
Multilayer PCBs 52 Layers +
Buried Resistors to  10%, Laser Trimmed to +/- 1%
Embedded Capacitors
Controlled Impedance to  2%
Blind and Buried Vias, Laser Micro Vias Including
Stacked and Stepped Via Technology
4 mil Mechanically Drilled Holes
Drafting and Design From Netlist (Gerber Generation)
Special Selective Plating
High Density Flex and Rigid Flex Circuits
Compunetics, Inc.
Capabilities
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Conductive Epoxy w/ Dupont CB100
High Tolerance Laser Routing with Optical Alignment
Flex on Frames
Mechanical Routing with Optical Alignment
Controlled Depth Route to  2 mils
Panel Sizes to 28”x 26”
3-Dimensional Plating
Sequential Build (Build-up Technology)
RF / Microwave Product
Heat Sink Boards
High Speed Laminates Including: Rogers, Taconic
Arlon and High Speed FR4 (Isola, Nelco)
2/8/08
Compunetics, Inc.
Technology Road Map
Plating
Aspect Ratio
Production
Engineering
PTH Tolerance (finished hole size)
Production
Engineering
2/8/08
Current
12 Months
24 Months
9:1
12:1
10:1
13:1
11:1
14:1
Current
12 Months
24 Months
+/- 0.0030”
+/- 0.0015”
+/- 0.0025”
+/- 0.0012”
+/- 0.0020”
+/- 0.0010”
Compunetics, Inc.
Technology Road Map
Soldermask And Screening
Minimum Soldermask Web
Production
Engineering
Minimum Soldermask Clearance
Production
Engineering
Legend Min Height / Line Width
Production
Engineering
2/8/08
Current
12 Months
24 Months
0.0035”
0.0030”
0.0030”
0.0025”
0.0030”
0.0025”
Current
12 Months
24 Months
0.0030”
0.0025”
0.0025”
0.0020”
0.0025”
0.0020”
Current
12 Months
24 Months
0.050” / 0.006”
0.040” / 0.005”
0.030” / 0.006”
0.035” / 0.005”
0.035” / 0.005”
0.030” / 0.004”
Compunetics, Inc.
Technology Road Map
*.0.062” thick board
** 0.125 thick board
Mechanical
Number of Layers
Production
Engineering
Current
12 Months
24 Months
26
52
28
56
32
60
12 Months
24 Months
0.0060”
0.0040”
0.0050”
0.0030”
Smallest Mechanical Drilled Holes* Current
Production
Engineering
2/8/08
0.0060”
0.0040”
Compunetics, Inc.
Technology Road Map
Laser Drilled Microvias
Minimum Hole to Capture Pad
Current
12 Months
24 Months
0.006” / 0.010”
0.003” / 0.006”
0.005” / 0.009”
0.002” / 0.006”
0.004” / 0.008”
0.002” / 0.005”
Current
12 Months
24 Months
0.5:1
0.7:1
0.6:1
0.8:1
0.7:1
1:1
Current
12 Months
24 Months
Production
Engineering
No
Evaluation
No
Yes
Yes
Yes
Multi-Level Microvias (Stacked)
Current
12 Months
24 Months
No
Yes
Yes
Yes
Yes
Yes
Production
Engineering
Aspect Ratio of Blind Microvia
Production
Engineering
Copper Filled Microvias
Production
Engineering
2/8/08
Compunetics, Inc.
Technology Road Map
Imaging And Mechanical
Layer-to-Layer Registration
Current
12 Months
24 Months
Production
Engineering
+/- 0.0030”
+/- 0.0020”
+/- 0.0030”
+/- 0.0020”
+/- 0.0025”
+/- 0.0014”
Signal Pad Annular Ring Inners
Current
12 Months
24 Months
0.0040”
0.0030”
0.0035”
0.0025”
0.0030”
0.0020”
Current
12 Months
24 Months
0.016”
0.011”
0.014”
0.010”
0.012”
0.008”
Current
12 Months
24 Months
0.0050”
0.0030”
0.0045”
0.0025”
0.0040”
0.0020”
Production
Engineering
Plane Clearance Inners
Production
Engineering
Copper Feature to Board Edge
Production
Engineering
2/8/08
Compunetics, Inc.
Technology Road Map
Imaging And Etching
* Half Ounce Copper
Trace / Space Outers *
Production
Engineering
Trace / Space Inners *
Production
Engineering
Trace Width Tol. Inners*
Production
Engineering
Controlled Impedance Tolerance *
Production
Engineering
2/8/08
Current
12 Months
0.0040” / 0.0040”
0.0015” / 0.0015”
0.0035” / 0.0035” 0.0030” / 0.0035”
0.0012” / 0.0012” 0.0010” / 0.0010”
Current
12 Months
0.0035” / 0.0035”
0.0015” / 0.0015”
0.0030” / 0.0030” 0.0025” / 0.0030”
0.0012” / 0.0012” 0.0010” / 0.0010”
Current
12 Months
24 Months
+/- 0.0005”
+/- 0.0003”
+/- 0.0004”
+/- 0.00025”
+/- 0.0003”
+/- 0.0002”
Current
12 Months
24 Months
+/- 10%
+/- 2%
+/- 7%
+/- 2%
+/- 5%
+/- 2%
Compunetics, Inc.
24 Months
24 Months
Future Plans
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2/8/08
Investigating Laser Direct Imaging Equipment
Working With Dielectric Solutions On Reducing Fiber Weave
Effect Using Proprietary Fiberglass Weave In PCB Materials
Evaluating Factory Relocation And Expansion
Sub-mil High Density Product
Multi-Layer LCP Packages
Investigating Large Panel Production Equipment
Compunetics, Inc.
Samples
Embedded Passives (Resistors)
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A True Thin-Film, Nickel-Phosphorous (NiP) Alloy.
About 0.1 To 0.4 Microns Of The Alloy Is Electro-Deposited
On To The Rough, Or Tooth Side Of Copper Foil During
Manufacturing
Typical Tolerance Of 10 – 20%
Resistors Tested At Final Test And During Inner Layer
OHMEGA-PLY LAMINATE
copper
resistive material (0.1-0.4 micron thick)
dielectric substrate
copper
(EXAMPLE OF AVAILABLE CORE)
2/8/08
Compunetics, Inc.
Samples
Embedded Passives (Capacitors)
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Bulk Capacitance Formed By Placing Power And Ground
Layers Close Together
Thin Dielectrics Separate Power And Ground To Create
Parallel Plate Capacitor
C = keA/t
Cu
Film Core
Where:
C = Capacitance
e = Dielectric Constant of Material
A = Board Area in Square Inches
k = Permittivity of Free Space – Constant of
225
t = Dielectric Thickness in inches
2/8/08
Cu
Copper clad laminate
Double sided (power and ground)
Dielectric is a Polyimide and BaTiO
composite.
Thickness of dielectric is key…thinner is
better
Compunetics, Inc.
Samples
Embedded Passives (Capacitors)
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2/8/08
Reduction In SMT Caps Needed On PCB
Closely Spaced Planes Have Lower Inherent Inductance
Therefore Supply Current On A Very Short Time Scale Thus
Damping Fluctuations Of Voltage At Device Input
Low Inductance Planes Reduces EMI
Initial Data Indicates That Surface Mounted Capacitance
Can Be Effectively Replaced By Embedded Capacitance
With Only A Small Fraction Of The Total Discrete
Capacitance
Compunetics, Inc.
Samples
Embedded Passives (Capacitors)
Products
Properties
Product Dupont Interra HK 04 Dupont Interra HK 10 Dupont Interra HK 11
Capacitance/Area
nF/in2
Dielectric Constant
Thickness
microns
Breakdown Voltage
Volts
Material
Dissipation Factor
UL Listed
Sequential Lam Process
2/8/08
0.8
3.5
25
6000
Polyimide
0.003
Yes
No
2.2
10
25
3100
Poyimide w/filler
0.01
Yes
Yes
Compunetics, Inc.
4.5
11
14
2500
Poyimide w/filler
0.02
Pending
Yes
3M C-Ply
5
16
16
>100
Ceramic filled Epoxy
0.005
Yes
Yes
Samples
Embedded Passives (Capacitors)
Application
• Before Embedded Capacitance
 18 Layers
 Blind vias: 1-2, 18-17
 Buried vias 2-17
 Over 2000 Caps
• After Embedded Capacitance
 18 Layers
 No Blind Vias
 Buried vias 2-17
 Removed 800+ Caps
2/8/08
Compunetics, Inc.
Samples
Controlled Impedance Flex
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Faster Signals with Faster Rise/Fall Times Require
Controlled Impedance Flex Cables
In Order To Have Cable Flexible, Need To Etch Traces Near
3 mils (Larger Traces Require Thicker Dielectrics For Same
Impedance, Making Board Less Flexible)
• Controlled Impedance Flex
 8 Layers
 Trace / Space – 3.0 / 3.0
 DuPont AP & LF Flex Material
 Differential Controlled Impedance
2/8/08
Compunetics, Inc.
Samples
Rigid-Flex
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Common Application To Add Reliability And/Or To
Reduce Assembly Costs Through Removal Of
Connectors And Cabling
More Common Due To Tight Spaces And Need For
Increased Reliability In Products, Especially In Military
• Military Avionics Rigid Flex
 8 Layers
 2 oz. Copper
 Loose-leaf Design for Increase Flexibility
 3 Double Sided Flex Cores w/Coverlay
 Military Specification
2/8/08
Compunetics, Inc.
Samples
Rigid-Flex
• Satellite Systems
 12 Layers
 Flight Certified Product
 Polyimide / DuPont AP Flex
 Immersion Gold
• Military
 22 Layers
 6 Layer Loose-leaf Flex
 Polyimide / DuPont AP Flex
 HAL Finish
2/8/08
Compunetics, Inc.
Samples
High Speed – Mixed Material Boards
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Need For Low Df/Dk Materials for Today’s Technology
Mix Low Df/Dk, High Cost Material with Higher Df/Dk Low
Cost Material
Keep Critical Signals on/with Low Df/Dk Material
Some Materials can not be Mixed with Certain Other
Materials
• Mixed Material 10Gb Ethernet
 8 Layers
 Blind Vias – 1-4 For Stub Control
 Conductive Epoxy Filled Vias
 Rogers 4003 / FR4 Material
 Cavity Construction at Gold Fingers
2/8/08
Compunetics, Inc.
Samples
High Speed – Mixed Material Boards
• FR4 Material
(Glass Bundles)
• Rogers 4000
(Ceramic Filled)
2/8/08
Compunetics, Inc.
Samples
Heat Dissipation Boards
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Smaller Spaces and Hotter Running Parts Require Design
Consideration for Heat Dissipation
Need To Provide Thermal Path Away From Components
Several Design Changes Can be Made To Minimize Thermal
Impact to Components
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–
–
–
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–
2/8/08
Place Heat Generating Part Near Heat Sink or Board Edge
Provide Thermal Path In Copper Including Using Edge Plating
Use Thermal Vias to Connect to Internal Planes or Heat Sink
Use of CB100 for Thermal Vias
Heat Sinks
Thinner Board Materials Place Component Closer To Heat Sink
Compunetics, Inc.
Samples
Heat Dissipation Boards
• Heat Dissipation Board
 4 Layers
 Thin Core FR4
 Conductive Epoxy
 Heat Spreader Attached w/ Thermagon
 HASL Finish
2/8/08
Compunetics, Inc.
Samples
RF Boards
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2/8/08
Boards Typically Made on Teflon or Teflon Blend Products
Etching Tolerance of +/- .0003”
Several Areas of Tight Tolerance Routing +/- .002 (Requires
Laser Routing w/Vision System
Some Designs Require Metal Backing
Most Require Wirebondable Gold
Compunetics, Inc.
Samples
RF Boards
•Commercial RF
 2 Layers
 Rogers 3003
 Laser Routed Slots
 Trace Tolerance +/- .0003”
 Wirebondable Gold
2/8/08
• Military RF
 4 Layers
 Rogers 6002, 4350, 4403
 Blind 1-2, 4-3; Buried 2-3
 Cavity 4 to 3
 Trace Tolerance +/- .0003”
 Wirebondable Gold
Compunetics, Inc.
Samples
Laser Drilled Blind Micro-vias
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2/8/08
Typically .004” to .006” Laser Drilled Hole From Layers 1 to
2 and/or From N to (N-1)
Dielectric Distance .003” to .004”
Aspect Ratios less than .50:1
Material Typically RCC (Resin Coated Copper) or Flat Glass
FR4
Enables Pin Escaping Small Pitch BGAs or BGAs on Thick
PCBs
Used to Conserve Routing Channels on Inner Layers
Enables Double Sided Assembly in Some Cases
Compunetics, Inc.
Samples
Laser Drilled Blind Micro-vias
2/8/08
Compunetics, Inc.
Samples
Chip On Flex (Direct Die Attach)
• Chip On Flex
 2 Layers
 Trace / Space – 2 / 2
 2 mil Laser Drilled Vias
 Wirebondable Gold
 2 mil Adhesiveless Pyralux
2/8/08
Compunetics, Inc.
Samples
Buried Resistors on Flex
• Buried Resistor on Flex
 2 Layers
 Ohmega Ply Resistor
 Resistor Covered By Kapton
 Immersion Silver Finish
 2 mil Adhesiveless Pyralux
2/8/08
Compunetics, Inc.
Samples
Laser Trimmed Embedded Resistors
• Laser Trimmed Resistors
 Resistor Laser Trimmed Under Measurement
 Resistor Trimmed to +/- 1%
 Final Resistor Tolerance +/- 3%
 Application: High Speed Testing
2/8/08
Compunetics, Inc.
Samples
Copper Filled Micro-vias
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2/8/08
Via-in-pad Provides Flat Pad Surface for BGA Attach
Flat Surface Optimal For Stacked Micro-vias
Need For Special Plating Chemistry
Need For Special Plating Equipment
Enables Pin Escaping High Pin Count .5 mm Pitch BGAs
Technology Under Development at Several US Shops
Compunetics, Inc.
Samples
Copper Filled Micro-vias
Current Plating Technology
2/8/08
Compunetics, Inc.
Samples
Copper Filled Micro-vias
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2/8/08
Test Vehicles Manufactured and
Evaluated
Technology Approved for
Production Using In-house
Equipment
The Smaller The Hole, The More
Flat the Plating
Plating of Close to 1:1 on Blind
Microvias
Compunetics, Inc.
Samples
Copper Filled Micro-vias
Stacked Micro-vias
2/8/08
Compunetics, Inc.
Samples
DuPont PF Material
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2/8/08
All Polyimide Adhesive
Flex “prepreg” Without Acrylic
Lower Z-axis Expansion Without Acrylic
Increase Reliability
Much Lower Df (.02 vs. .004)
Product Withstands MIL-Spec Thermal Shock Testing
Product Still In Beta-Test at Several Shops Including
Compunetics, Inc.
Evaluations On-going at Several Large OEMs
Compunetics, Inc.
Samples
DuPont PF Material
• Multi-Layer Flex w/ PF Material
2/8/08
• Multi-Layer Flex w/ LF Bondply
Compunetics, Inc.
Samples
Fine Line Technology (2 mil Trace/Space & Down)
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2/8/08
Required for High Pin Count Fine Pitch BGA Routing
(<= 0.5 mm Pitch)
Chip On Board / Chip On Flex
Used To Reduce Layer Count – More Tracks per Channel
Seen with Laser Drilled Micro-vias
Typically on Boards with Small Annular Rings
Can be Combined with Embedded Passives
Compunetics, Inc.
Samples
Fine Line Technology (2 mil Trace/Space & Down)
• Multi-Level Chip Package
 6 Layer FR4
 2 / 2 Trace / Space
 Embedded Resistors for Termination
 Multi-Level Cavity Construction
 Wirebondable Gold
• Fine Line Package
 1.5 / 1.5 (35 / 35 um) Trace / Space
 Wirebondable Gold
 4 Layers FR4
 31 mil Thick +/- 1 mil
2/8/08
Compunetics, Inc.
Samples
Laser Ablation Of Soldermask
Problem
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Tighter Pitch Parts Require Better Soldermask
Registration
Conventional Mask Annular Rings Leave Insufficient Mask
Dams
Solution
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2/8/08
BGA Area Covered With Soldermask
YAG Laser Used To Remove Mask From BGA Pads
Mask Annular Ring Less Than 1 mil
Mask Dams Remain Aiding Assembly
Compunetics, Inc.