impedance stabilization network (isn) for unscreened balanced pairs
... (ITE) as required in CISPR 22 and CISPR 32. The ISN is placed between the equipment under test (EUT) and auxiliary equipment (AE) or load which are necessary for the operation of the EUT. The ISN establishes the common-mode termination impedance for the EUT’s telecommunications port during measureme ...
... (ITE) as required in CISPR 22 and CISPR 32. The ISN is placed between the equipment under test (EUT) and auxiliary equipment (AE) or load which are necessary for the operation of the EUT. The ISN establishes the common-mode termination impedance for the EUT’s telecommunications port during measureme ...
EL5128 - Intersil
... high-frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended, lead lengths should be as short as possible and the power supply pins must be well bypassed to reduce the risk of oscillation. For normal single supply oper ...
... high-frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended, lead lengths should be as short as possible and the power supply pins must be well bypassed to reduce the risk of oscillation. For normal single supply oper ...
NTV Series - power, Murata
... It is well known that repeated high-voltage isolation testing of a barrier component can actually degrade isolation capability, to a lesser or greater degree depending on materials, construction and environment. The NTV series has toroidal isolation transformers, with no additional insulation betwee ...
... It is well known that repeated high-voltage isolation testing of a barrier component can actually degrade isolation capability, to a lesser or greater degree depending on materials, construction and environment. The NTV series has toroidal isolation transformers, with no additional insulation betwee ...
Data Sheet (current)
... Low Power CMOS Dual Operational Amplifier General Description The LPC662 CMOS Dual operational amplifier is ideal for operation from a single supply. It features a wide range of operating voltage from +5V to +15V, rail-to-rail output swing in addition to an input common-mode range that includes grou ...
... Low Power CMOS Dual Operational Amplifier General Description The LPC662 CMOS Dual operational amplifier is ideal for operation from a single supply. It features a wide range of operating voltage from +5V to +15V, rail-to-rail output swing in addition to an input common-mode range that includes grou ...
LT5519 - 0.7GHz to 1.4GHz High Linearity
... broadband 50Ω match with return loss better than 10dB at frequencies up to 1800MHz. The RF output band ranges from 700MHz to 1400MHz, with an internal RF transformer providing a 50Ω impedance match across the band. Low side or high side LO injection can be used. IF Input Port The IF inputs are conne ...
... broadband 50Ω match with return loss better than 10dB at frequencies up to 1800MHz. The RF output band ranges from 700MHz to 1400MHz, with an internal RF transformer providing a 50Ω impedance match across the band. Low side or high side LO injection can be used. IF Input Port The IF inputs are conne ...
LT1260 - Low Cost Dual and Triple 130MHz Current Feedback Amplifiers with Shutdown
... more stable at higher gains. Alternatively, a small resistor (10Ω to 20Ω) can be put in series with the output to isolate the capacitive load from the amplifier output. This has the advantage that the amplifier bandwidth is only reduced when the capacitive load is present. The disadvantage is that t ...
... more stable at higher gains. Alternatively, a small resistor (10Ω to 20Ω) can be put in series with the output to isolate the capacitive load from the amplifier output. This has the advantage that the amplifier bandwidth is only reduced when the capacitive load is present. The disadvantage is that t ...
IS31AP2010F
... Most wireless phones or PDAs need to sum signals at the audio power amplifier or just have two signal sources that need separate gain. The IS31AP2010F makes it easy to sum signals or use separate signal sources with different gains. Many phones now use the same speaker for the earpiece and ringer, w ...
... Most wireless phones or PDAs need to sum signals at the audio power amplifier or just have two signal sources that need separate gain. The IS31AP2010F makes it easy to sum signals or use separate signal sources with different gains. Many phones now use the same speaker for the earpiece and ringer, w ...
10-Port SPI-Interfaced I/O Expander with Overvoltage and Hot-Insertion Protection General Description Features
... Alternatively, MAX7317s can be daisy-chained by connecting the DOUT of one device to the DIN of the next, and driving SCLK and CS lines in parallel (Figure 3). This connection allows the MAX7317s to be read. Data at DIN propagates through the internal shift registers and appears at DOUT 15.5 clock c ...
... Alternatively, MAX7317s can be daisy-chained by connecting the DOUT of one device to the DIN of the next, and driving SCLK and CS lines in parallel (Figure 3). This connection allows the MAX7317s to be read. Data at DIN propagates through the internal shift registers and appears at DOUT 15.5 clock c ...
FIN1108 — LVDS 8-Port, High-Speed Repeater FIN 1108 — LVD
... 1. tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and are switching in the same direction. 2. tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same di ...
... 1. tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and are switching in the same direction. 2. tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same di ...
One-Stage Op Amps
... Old Op Amps Two decades ago, op amps were designed to satisfy the requirements of many different applications, i.e., the design was to approach an ideal op amp: AV = ∞ , Rin = ∞ , Rout = o In doing so, many other aspects of the performance had to be sacrificed: power, output swing, speed. Old op amp ...
... Old Op Amps Two decades ago, op amps were designed to satisfy the requirements of many different applications, i.e., the design was to approach an ideal op amp: AV = ∞ , Rin = ∞ , Rout = o In doing so, many other aspects of the performance had to be sacrificed: power, output swing, speed. Old op amp ...
S-parameters - WordPress.com
... because they generally do not exist for small dimensions Open circuit capacitance = impedance at high frequencies Probe and via impedance not insignificant ...
... because they generally do not exist for small dimensions Open circuit capacitance = impedance at high frequencies Probe and via impedance not insignificant ...
Input Source Impedance and Its Effects on DC
... where D is the duty cycle of a pulse-width modulator (PWM) converter. In the case of a zero-current switching (ZCS) DC-DC converter, the control variable of the regulation loop is not the duty cycle, but the repetition frequency instead; therefore, as a first approximation: ...
... where D is the duty cycle of a pulse-width modulator (PWM) converter. In the case of a zero-current switching (ZCS) DC-DC converter, the control variable of the regulation loop is not the duty cycle, but the repetition frequency instead; therefore, as a first approximation: ...
Advance electroncis Assignment Question
... (2) Band width of each stage. Describe the effect of bypass capacitor and coupling capacitor in multi stage common emitter amplifier. Chapter 1: Transistor at High Frequencies Write short note on: Validity of Hybrid – PI model. Write short note on Hybrid π model for a transistor on CE configuration ...
... (2) Band width of each stage. Describe the effect of bypass capacitor and coupling capacitor in multi stage common emitter amplifier. Chapter 1: Transistor at High Frequencies Write short note on: Validity of Hybrid – PI model. Write short note on Hybrid π model for a transistor on CE configuration ...
AN-1704 LMH6555 Application as High Speed ADC Input Driver
... applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask ...
... applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask ...
a AN-584 APPLICATION NOTE
... will couple to the secondary output terminal that is closest to the primary’s driven side. On the other hand, no signal will be coupled to the opposite terminal of the secondary, because its nearest primary terminal is not driven (see Figure 9). The exact amount of this imbalance will depend on the ...
... will couple to the secondary output terminal that is closest to the primary’s driven side. On the other hand, no signal will be coupled to the opposite terminal of the secondary, because its nearest primary terminal is not driven (see Figure 9). The exact amount of this imbalance will depend on the ...
IS32AP2120 - Integrated Silicon Solution
... preamplifier into a switched signal of varying duty cycle. This is the critical stage that defines the Class-D architecture. In the IS32AP2120, the modulator is an advanced design with high bandwidth, low noise, low distortion, and excellent stability. The pulse-width modulation scheme allows increa ...
... preamplifier into a switched signal of varying duty cycle. This is the critical stage that defines the Class-D architecture. In the IS32AP2120, the modulator is an advanced design with high bandwidth, low noise, low distortion, and excellent stability. The pulse-width modulation scheme allows increa ...
74LS07 - Unicorn Electronics
... Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C ...
... Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C ...