Monolithic transformers and their application in a differential CMOS
... develop the necessary voltage gain for the LNA. Second, it acts as a high impedance for ac and a very low impedance for dc signals which makes the reuse of bias current feasible. Each MOSFET has the minimum 0.6 m drawn channel length. The widths of M1 and M2 are chosen to be 1080 m. Although this va ...
... develop the necessary voltage gain for the LNA. Second, it acts as a high impedance for ac and a very low impedance for dc signals which makes the reuse of bias current feasible. Each MOSFET has the minimum 0.6 m drawn channel length. The widths of M1 and M2 are chosen to be 1080 m. Although this va ...
Evaluating the Potential of an Energy Reduction Technique Based
... to Vth scaling if Vth is scaled together with Vdd [3]. We expect that this joint scaling will be possible with future technologies such as VT-CMOS[8] and ABB-MTCMOS[12]. In addition, Vdd reduction in deep-submicron CMOS is not as detrimental to speed as in long-channel CMOS[3]. To reduce power consu ...
... to Vth scaling if Vth is scaled together with Vdd [3]. We expect that this joint scaling will be possible with future technologies such as VT-CMOS[8] and ABB-MTCMOS[12]. In addition, Vdd reduction in deep-submicron CMOS is not as detrimental to speed as in long-channel CMOS[3]. To reduce power consu ...
Power Plant “Horror Stories” - Beckwith Electric Co., Inc.
... the phase-to-phase voltages involving the faulted phase and a modest neutral voltage shift. If the generator is ungrounded (also not usually the case), it will deliver a negligible amount of current to a bolted SLG fault at its terminals, accompanied by no reduction in the phase-to-phase terminal vo ...
... the phase-to-phase voltages involving the faulted phase and a modest neutral voltage shift. If the generator is ungrounded (also not usually the case), it will deliver a negligible amount of current to a bolted SLG fault at its terminals, accompanied by no reduction in the phase-to-phase terminal vo ...
Cable fault location
... via the TDR technology and automatically analysed. DC-SIM/MIM: Secondary/multiple impulse method in DC mode for pin-pointing intermittent faults. The cable is charged with voltage; in doing so, the cable capacitance is included in the testing. Conditioning-SIM/MIM: Faults that are difficult to loc ...
... via the TDR technology and automatically analysed. DC-SIM/MIM: Secondary/multiple impulse method in DC mode for pin-pointing intermittent faults. The cable is charged with voltage; in doing so, the cable capacitance is included in the testing. Conditioning-SIM/MIM: Faults that are difficult to loc ...
Document
... The voltage will increase. The voltage will stay the same. The voltage will decrease. ...
... The voltage will increase. The voltage will stay the same. The voltage will decrease. ...
PA-5000 Series Hardware Reference Guide
... connecting or disconnecting the wires to the power supplies. Figure 8 shows the DC power connections for the PA-5000 Series. Wind the power wires around the screws and tighten to secure. The -48VDC connection is on the left and the 0VDC connection is on the right, as labeled when facing the power su ...
... connecting or disconnecting the wires to the power supplies. Figure 8 shows the DC power connections for the PA-5000 Series. Wind the power wires around the screws and tighten to secure. The -48VDC connection is on the left and the 0VDC connection is on the right, as labeled when facing the power su ...
Atmel LED Drivers MSL2041/MSL2042
... flexible, four-string LED drivers that use external MOSFETs to allow high string currents, and include power supply control to maximize efficiency of up to two external string power supplies. Optimized for stand-alone operation they require only external PWM signal(s), a few external components (inc ...
... flexible, four-string LED drivers that use external MOSFETs to allow high string currents, and include power supply control to maximize efficiency of up to two external string power supplies. Optimized for stand-alone operation they require only external PWM signal(s), a few external components (inc ...
IOSR Journal of Electrical and Electronics Engineering (IOSR-JEEE)
... SCADA integration is a system operating with coded signals over communication channels so as to provide control of remote equipment. The supervisory system is combined with a data acquisition system, by adding the use of coded signals over communication channels to acquire information about the stat ...
... SCADA integration is a system operating with coded signals over communication channels so as to provide control of remote equipment. The supervisory system is combined with a data acquisition system, by adding the use of coded signals over communication channels to acquire information about the stat ...
section 16 - Siemens Industry
... minimum pickup time of the high-set instantaneous tripping element shall be 20ms. Ground Fault Overcurrent Protection. The relay shall incorporate definite time and inverse time overcurrent protection according to ANSI/IEEE and IEC. The definite time overcurrent protection shall have a low-set groun ...
... minimum pickup time of the high-set instantaneous tripping element shall be 20ms. Ground Fault Overcurrent Protection. The relay shall incorporate definite time and inverse time overcurrent protection according to ANSI/IEEE and IEC. The definite time overcurrent protection shall have a low-set groun ...
section 16
... CPU with factory programmed software that supports remote monitoring, configuration and control of embedded intelligent devices and structural monitoring devices. ...
... CPU with factory programmed software that supports remote monitoring, configuration and control of embedded intelligent devices and structural monitoring devices. ...
A Boundary-Element approach to Transient Simulation of Three-Dimensional Integrated Circuit Interconnect
... charge is that all currents flow through the conductor to the conductor surface, where they produce a build-up of surface charge. Note that this surface charge may be “bled off” by external circuitry at points where contact is made to the conductor. It is generally assumed that for integrated circui ...
... charge is that all currents flow through the conductor to the conductor surface, where they produce a build-up of surface charge. Note that this surface charge may be “bled off” by external circuitry at points where contact is made to the conductor. It is generally assumed that for integrated circui ...