Principles of Electrostatic Chucks
... clamp pressures. However, more perfect insulators (e.g., glass) require a "dipole" attraction mechanism and require interdigitated chuck electrodes, yielding lower clamp pressures. Position sensing: Substrate sensing measures the capacitance of a substrate on the chuck, using charge transfer rates h ...
... clamp pressures. However, more perfect insulators (e.g., glass) require a "dipole" attraction mechanism and require interdigitated chuck electrodes, yielding lower clamp pressures. Position sensing: Substrate sensing measures the capacitance of a substrate on the chuck, using charge transfer rates h ...
FAN2558/FAN2559 180mA Low Voltage CMOS LDO
... sink of surrounding copper ground on the PWB. Depending on the size of the copper area, the resulting θJA can range from approximately 180°C /W for one square inch to nearly 130°C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also ...
... sink of surrounding copper ground on the PWB. Depending on the size of the copper area, the resulting θJA can range from approximately 180°C /W for one square inch to nearly 130°C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also ...
article
... Information) is dominated by the thermal resistance of the SiO2 layer, rather than by heat flow along the graphene sheet itself. The thermal transport is reduced to a one-dimensional problem, as in previous work on carbon nanotubes (CNTs).26,27 Thus, the thermal coupling between graphene and the sil ...
... Information) is dominated by the thermal resistance of the SiO2 layer, rather than by heat flow along the graphene sheet itself. The thermal transport is reduced to a one-dimensional problem, as in previous work on carbon nanotubes (CNTs).26,27 Thus, the thermal coupling between graphene and the sil ...
BIPOLAR JUNCTION TRANSISTOR
... connected to two voltage sources. To make the transistor conduct appreciable current (on the order of 1 mA) from C to E, VBE must be above a minimum value sometimes referred to as the cut-in voltage. • The cut-in voltage is usually about 600 mV for silicon BJTs at room temperature but can be differe ...
... connected to two voltage sources. To make the transistor conduct appreciable current (on the order of 1 mA) from C to E, VBE must be above a minimum value sometimes referred to as the cut-in voltage. • The cut-in voltage is usually about 600 mV for silicon BJTs at room temperature but can be differe ...
Supercritical Water Gasification of Glucose and Cellulose for
... The Figure 2 (a) show the comparison with the experimental data obtained with a constant temperature of 973.15 K (700 °C) with a pressure of 248 bar and a feed with 1 wt% of glucose, the experimental results are obtained with the catalytic bed empty and with a catalyst of Ru/Al 2O3. In the Figure 2 ...
... The Figure 2 (a) show the comparison with the experimental data obtained with a constant temperature of 973.15 K (700 °C) with a pressure of 248 bar and a feed with 1 wt% of glucose, the experimental results are obtained with the catalytic bed empty and with a catalyst of Ru/Al 2O3. In the Figure 2 ...
LM117 LM317A LM317 3-Terminal Adjustable Regulator
... An input bypass capacitor is recommended. A 0.1 mF disc or 1 mF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the po ...
... An input bypass capacitor is recommended. A 0.1 mF disc or 1 mF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the po ...
www.mccsemi .com - Micro Commercial Components
... Micro Commercial Components Corp. reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or u ...
... Micro Commercial Components Corp. reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or u ...
IGC70T120T8RL IGBT4 Low Power Chip
... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automo ...
... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automo ...
ANLAN206 KSZ9031 Gigabit PHY Optimized Power Scheme for High Efficiency, Low-Power Consumption and
... without compromising on performance. 4MHz switching frequency ensures low peak current into the inductor with a low inductance value. The issue of inductor saturation is that effective inductance value drops very quickly when the magnetic circuit starts to saturate. The main consequence of this is t ...
... without compromising on performance. 4MHz switching frequency ensures low peak current into the inductor with a low inductance value. The issue of inductor saturation is that effective inductance value drops very quickly when the magnetic circuit starts to saturate. The main consequence of this is t ...
HF81 - Monolithic Power System
... HF81. The discharge resistors are divided into two separate surface mount resistors. Resistors R1 and R2 need to be rated for 50% power dissipation and voltage rating in order to dissipate loss and withstand the input voltage under a short between the L1 and L2 terminals of the HF81. If the applicat ...
... HF81. The discharge resistors are divided into two separate surface mount resistors. Resistors R1 and R2 need to be rated for 50% power dissipation and voltage rating in order to dissipate loss and withstand the input voltage under a short between the L1 and L2 terminals of the HF81. If the applicat ...
DISCONTINUED PRODUCT - Allegro Microsystems
... device. The state-of-the-art technology provides the same output polarity for either pole face. It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall element) between the supply and ground of the device to reduce both external noise and noise gener ...
... device. The state-of-the-art technology provides the same output polarity for either pole face. It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall element) between the supply and ground of the device to reduce both external noise and noise gener ...
Linear Mode Operation and Safe Operating Diagram of
... D≠0. In that case the thermal impedance diagram ZthJC=f(tp, D) has to be used to get the correct ZthJC value. Then, the maximum power limit-line can be calculated by equation 2 according to the needs of the engineer. Thermal (in-)stability limit-line Following the maximum-power limit-line reveals a ...
... D≠0. In that case the thermal impedance diagram ZthJC=f(tp, D) has to be used to get the correct ZthJC value. Then, the maximum power limit-line can be calculated by equation 2 according to the needs of the engineer. Thermal (in-)stability limit-line Following the maximum-power limit-line reveals a ...
MAX16910 200mA, Automotive, Ultra-Low Quiescent Current, Linear Regulator EVALUATION KIT AVAILABLE
... Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum ...
... Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum ...
PD84002
... Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a ...
... Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a ...
Features Mechanical Data
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
TB62262FTAG
... current recirculates back to the power supply due to the effect of the motor back-EMF. If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and mo ...
... current recirculates back to the power supply due to the effect of the motor back-EMF. If the power supply does not have enough sink capability, the power supply and output pins of the device might rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and mo ...
Thermal runaway
Thermal runaway refers to a situation where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback.In other words, ""thermal runaway"" describes a process which is accelerated by increased temperature, in turn releasing energy that further increases temperature. In chemistry (and chemical engineering), this risk is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation, although exothermic chemical reactions can be of concern here too. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar mass stars, the ""helium flash"".There are also concerns regarding global warming that a global average increase of 3-4 degrees Celsius above the preindustrial baseline could lead to a further unchecked increase in surface temperatures. For example, releases of methane, a greenhouse gas more potent than CO2, from wetlands, melting permafrost and continental margin seabed clathrate deposits could be subject to positive feedback.