Phosphorene: An Unexplored 2D Semiconductor with a High Hole Mobility
... Figure 4a, indicates a reduction of the total resistance with decreasing gate voltage, a clear signature of its p-type characteristics. Consequently, few-layer phosphorene is a welcome addition to the family of 2D semiconductor materials since most pristine TMDs are either n-type or ambipolar as a c ...
... Figure 4a, indicates a reduction of the total resistance with decreasing gate voltage, a clear signature of its p-type characteristics. Consequently, few-layer phosphorene is a welcome addition to the family of 2D semiconductor materials since most pristine TMDs are either n-type or ambipolar as a c ...
REF3033-Q1 数据资料 dataSheet 下载
... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant ...
... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant ...
Current and Resistance
... ◦ I must be in Amperes, R in ohms and V in Volts The unit of energy used by electric companies is the kilowatt-hour ◦ This is defined in terms of the unit of power and the amount of time it is ...
... ◦ I must be in Amperes, R in ohms and V in Volts The unit of energy used by electric companies is the kilowatt-hour ◦ This is defined in terms of the unit of power and the amount of time it is ...
IPC 7801 - Reflow Oven Process Control Standard
... 5 Golden Board Design for Process Verifications 5.1 Optimal Golden Board Using the actual product is always the best Golden board. The actual printed circuit assembly gives feedback on the actual process and should provide more accurate data for troubleshooting or process improvement. However, it is ...
... 5 Golden Board Design for Process Verifications 5.1 Optimal Golden Board Using the actual product is always the best Golden board. The actual printed circuit assembly gives feedback on the actual process and should provide more accurate data for troubleshooting or process improvement. However, it is ...
DATA SHEET PEMZ7 NPN/PNP general purpose transistors
... Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result i ...
... Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result i ...
LTC1150 - ±15V Zero-Drift Operational Amplifier with Internal Capacitors
... Thermocouple effects must be considered if the LTC1150’s ultralow drift is to be fully utilized. Any connection of dissimilar metals forms a thermoelectric junction producing an electric potential which varies with temperature (Seebeck effect). As temperature sensors, thermocouples exploit this phen ...
... Thermocouple effects must be considered if the LTC1150’s ultralow drift is to be fully utilized. Any connection of dissimilar metals forms a thermoelectric junction producing an electric potential which varies with temperature (Seebeck effect). As temperature sensors, thermocouples exploit this phen ...
Thermal runaway
Thermal runaway refers to a situation where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback.In other words, ""thermal runaway"" describes a process which is accelerated by increased temperature, in turn releasing energy that further increases temperature. In chemistry (and chemical engineering), this risk is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation, although exothermic chemical reactions can be of concern here too. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar mass stars, the ""helium flash"".There are also concerns regarding global warming that a global average increase of 3-4 degrees Celsius above the preindustrial baseline could lead to a further unchecked increase in surface temperatures. For example, releases of methane, a greenhouse gas more potent than CO2, from wetlands, melting permafrost and continental margin seabed clathrate deposits could be subject to positive feedback.