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Probe Design and Construction
Probe Design and Construction

... From the early days of NMR, the word probe (or probe-head) has been used to refer to the complete piece of equipment intimately associated with the sample (except the sample tube). For the simplest experiments, the probe consists of the mechanical structure required to hold the sample in the ‘sweet ...
Thick film chip resistors - Type CRG Series - Tyco Electronics
Thick film chip resistors - Type CRG Series - Tyco Electronics

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CARTRIDGE PUMPS MK5 Type

Floorizwarm Install Manual
Floorizwarm Install Manual

... and/or soldered correctly. Risk of fire possible if cuts or other damage to FloorizwarmTuff Cable are not repaired correctly. Note: The safety features and testing procedures incorporated into Heatizon Systems products cannot detect cuts in Cold Leads or Tuff Cable element. Do not allow Tuff Cable t ...
Practical Thermocouple Temperature Measurements
Practical Thermocouple Temperature Measurements

polytechnics - WordPress.com
polytechnics - WordPress.com

Temperature Amplifier Manual
Temperature Amplifier Manual

... The Temperature preamplifier, 13-4615-47, is an amplifier primarily designed to gi temperature readings to the fraction of a degree celsius utilizing as a transducer, a platinum type 385 RTD (Resistance Temperature Device) when wired to a ”2000” Se Recorder or related equipment. The preamplifier wil ...
HSPICE Device Models Quick Reference Guide
HSPICE Device Models Quick Reference Guide

AS Electricity Part I
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Solving Series and Parallel Circuits

pickeringtest.com
pickeringtest.com

The MOSFET Device Symbols Device Equations
The MOSFET Device Symbols Device Equations

... If the FET output is taken from the drain, the input can be either applied to the gate or to the source. If it is applied to the gate, the circuit is called a common-source amplifier. If it is applied to the source, the circuit is called a common-gate amplifier. In some cases, separate inputs can be ...
High Capacitance Stacked Multi-Layer Ceramic Capacitors
High Capacitance Stacked Multi-Layer Ceramic Capacitors

... The military stack has a much lower temperature increase even though the ESR at 100 kHz was 2.20mΩ that is higher than the 2220 at 1.65mΩ. The thermal resistivity differences are even more pronounced in this case because of the large difference in size, the J-lead 2220 stack capacitors take up 0.14 ...
AD5222 数据手册DataSheet 下载
AD5222 数据手册DataSheet 下载

... The AD5222 contains a push-button controllable interface. The active inputs are clock (CLK), CS and up/down (U/D). While the MODE, and DACSEL pins control common updates or individual updates. The negative-edge sensitive CLK input requires clean transitions to avoid clocking multiple pulses into the ...
Lecture 16: Pitfalls & Reliability
Lecture 16: Pitfalls & Reliability

... – nMOS and pMOS fight each other. – If the pMOS is too strong, nMOS cannot pull X low enough.  Solution: Check that ratio is satisfied in all corners ...
Circuit Pitfalls
Circuit Pitfalls

... – nMOS and pMOS fight each other. – If the pMOS is too strong, nMOS cannot pull X low enough.  Solution: Check that ratio is satisfied in all corners ...
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT

ADP124 数据手册DataSheet 下载
ADP124 数据手册DataSheet 下载

... ΨJB is the junction-to-board thermal characterization parameter and is measured in °C/W. The ΨJB of the package is based on modeling and calculation using a 4-layer board. The Guidelines for Reporting and Using Package Thermal Information: JESD51-12 states that thermal characterization parameters ar ...
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Dynamics of two coupled canonical Chua`s circuits
Dynamics of two coupled canonical Chua`s circuits

Linear Mode Operation and Safe Operating Diagram of
Linear Mode Operation and Safe Operating Diagram of

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... Magnetic field effect on the orthogonal loop can be zero ! This is supposed to be the reason why the partial inductive coupling between orthogonal wires is zero ...
Section 1 Simple Circuits: Practice Problems
Section 1 Simple Circuits: Practice Problems

VISHAY IRF71 datasheet
VISHAY IRF71 datasheet

MELF Resistors - Token Components
MELF Resistors - Token Components

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Lumped element model



The lumped element model (also called lumped parameter model, or lumped component model) simplifies the description of the behaviour of spatially distributed physical systems into a topology consisting of discrete entities that approximate the behaviour of the distributed system under certain assumptions. It is useful in electrical systems (including electronics), mechanical multibody systems, heat transfer, acoustics, etc.Mathematically speaking, the simplification reduces the state space of the system to a finite dimension, and the partial differential equations (PDEs) of the continuous (infinite-dimensional) time and space model of the physical system into ordinary differential equations (ODEs) with a finite number of parameters.
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