Evaluates: MAX3680 MAX3680 Evaluation Kit _______________General Description ____________________________Features
... The MAX3680 evaluation kit (EV kit) simplifies evaluation of the MAX3680 622Mbps, SDH/SONET 1:8 deserializer. The EV kit requires only a +3.3V supply, and includes all the external components necessary to interface with 3.3V PECL/TTL logic. The board can be connected directly to the output of a cloc ...
... The MAX3680 evaluation kit (EV kit) simplifies evaluation of the MAX3680 622Mbps, SDH/SONET 1:8 deserializer. The EV kit requires only a +3.3V supply, and includes all the external components necessary to interface with 3.3V PECL/TTL logic. The board can be connected directly to the output of a cloc ...
Analog Electric Circuits Synthesis using a Genetic Algorithm Approach
... meta-heuristic approaches including of course the EAs. Koza et al. [5] presented a single uniform approach for the automatic synthesis of eight different analog electrical circuits using genetic programming, in designing an electrical circuit, genetic programming starts with an embryo circuit and de ...
... meta-heuristic approaches including of course the EAs. Koza et al. [5] presented a single uniform approach for the automatic synthesis of eight different analog electrical circuits using genetic programming, in designing an electrical circuit, genetic programming starts with an embryo circuit and de ...
MAX16903 Evaluation Kit Evaluates: General Description Features
... on +5V output and should be approximately 10I. If using a resistor load, make sure it can handle 5W. 3) Turn on the power supply and electronic load. DMM2 gives the load current while DMM1 gives the output voltage. 4) Increase the load to 1A and observe the output. ...
... on +5V output and should be approximately 10I. If using a resistor load, make sure it can handle 5W. 3) Turn on the power supply and electronic load. DMM2 gives the load current while DMM1 gives the output voltage. 4) Increase the load to 1A and observe the output. ...
(A) R
... − Select/sketch diagrams of series and parallel circuits including proper placement of meters. − Use VIR charts and Ohm’s Law to solve series and parallel circuits. − Determine the power or electrical energy used by a circuit component or an entire circuit. − Use the Junction Rule to determine an un ...
... − Select/sketch diagrams of series and parallel circuits including proper placement of meters. − Use VIR charts and Ohm’s Law to solve series and parallel circuits. − Determine the power or electrical energy used by a circuit component or an entire circuit. − Use the Junction Rule to determine an un ...
Data Sheet
... 4) Set the two electronic loads to constant-current mode and disable the electronic loads. 5) Connect the positive terminal of the power supply to the VIN PCB pad and the negative terminal to the nearest PGND PCB pad. Connect the positive terminal of the first 100mA load to the +15V PCB pad and th ...
... 4) Set the two electronic loads to constant-current mode and disable the electronic loads. 5) Connect the positive terminal of the power supply to the VIN PCB pad and the negative terminal to the nearest PGND PCB pad. Connect the positive terminal of the first 100mA load to the +15V PCB pad and th ...
BDTIC www.BDTIC.com/infineon AN2011-01 – Module Adapter
... connected between the auxiliary collector and the gate of an IGBT module. When the CollectorEmitter voltage exceeds the diodes breakdown voltage the diodes current sums up with the current from the driver output. Due to the now increased gate-emitter voltage the transistor is held in an active mode ...
... connected between the auxiliary collector and the gate of an IGBT module. When the CollectorEmitter voltage exceeds the diodes breakdown voltage the diodes current sums up with the current from the driver output. Due to the now increased gate-emitter voltage the transistor is held in an active mode ...
Evaluates: MAX13487E/MAX13488E MAX13487E Evaluation Kit General Description Features
... during brownouts. If the input voltage at VIN falls below 1.9V (typ), the MAX256 IC will shut down. Surface-mount transformer T1 provides galvanic isolation and the VOUT output is powered from a centertapped full-wave rectifier circuit (D1 or D2) to reduce output-voltage ripple. It feeds a MAX1659 L ...
... during brownouts. If the input voltage at VIN falls below 1.9V (typ), the MAX256 IC will shut down. Surface-mount transformer T1 provides galvanic isolation and the VOUT output is powered from a centertapped full-wave rectifier circuit (D1 or D2) to reduce output-voltage ripple. It feeds a MAX1659 L ...
µBITS
... 2 of 0.13” bolts to hold assembly together. 10 of 0.13” nuts to hold the levels in place on the ...
... 2 of 0.13” bolts to hold assembly together. 10 of 0.13” nuts to hold the levels in place on the ...
Meter - AnaLog Services, Inc.
... Printed Circuit Board (PCB) CCL Meter (Revision A) The CCL Meter (Revision A) printed circuit board (PCB) implements the AnaLog Services, Inc. version of the old REMCO / SIE shooting casing collar locator (CCL) surface amplifier. This versatile circuit can be used for new panels, or can replace infe ...
... Printed Circuit Board (PCB) CCL Meter (Revision A) The CCL Meter (Revision A) printed circuit board (PCB) implements the AnaLog Services, Inc. version of the old REMCO / SIE shooting casing collar locator (CCL) surface amplifier. This versatile circuit can be used for new panels, or can replace infe ...
Signaling capacity of FR4 PCB traces for chip-to
... in which K is a constant related to the PAM constellation size; dmi, is the minimum distance between the points of the PAM constellation, and (5 is the standard deviation of the received noise. If a Gray coding scheme is used then the bit error rate is approximately P,/log2M for M-PAM signaling. Usi ...
... in which K is a constant related to the PAM constellation size; dmi, is the minimum distance between the points of the PAM constellation, and (5 is the standard deviation of the received noise. If a Gray coding scheme is used then the bit error rate is approximately P,/log2M for M-PAM signaling. Usi ...
TN1238 - STMicroelectronics
... users shall plug very carefully the connectors together. In case of misalignment of pins or row inversions, it is possible to damage boards definitively. ...
... users shall plug very carefully the connectors together. In case of misalignment of pins or row inversions, it is possible to damage boards definitively. ...
motion sensor for secqurity light
... family of resistors manufactured using a particular technology. A family of discrete resistors is also characterized according to its form factor, that is, the size of the device and the position of its leads (or terminals) which is relevant in the practical manufacturing of circuits using them. ...
... family of resistors manufactured using a particular technology. A family of discrete resistors is also characterized according to its form factor, that is, the size of the device and the position of its leads (or terminals) which is relevant in the practical manufacturing of circuits using them. ...
Reliability Maintenance Concerns
... Although fuse terminations, clips, and disconnects require periodic maintenance, the fuse itself does not require any maintenance or testing to assure proper operation and protection under overcurrent conditions. This is because the fuse does not contain any mechanical linkages that could adversely ...
... Although fuse terminations, clips, and disconnects require periodic maintenance, the fuse itself does not require any maintenance or testing to assure proper operation and protection under overcurrent conditions. This is because the fuse does not contain any mechanical linkages that could adversely ...
Paper-like electronic displays - Microsystems Technology Laboratories
... avoid unwanted switching, the transistors must not produce more than ⬇30 nA of ‘‘off’’ current when Vg ⫽ 0 V and Vsd ⫽ ⫺50 V, or more than ⬇30 nA of ‘‘leakage’’ current when Vg ⫽ ⫺50 V and Vsd ⫽ 0 V. The driving scheme demands that the total capacitance associated with each pixel is sufficiently sma ...
... avoid unwanted switching, the transistors must not produce more than ⬇30 nA of ‘‘off’’ current when Vg ⫽ 0 V and Vsd ⫽ ⫺50 V, or more than ⬇30 nA of ‘‘leakage’’ current when Vg ⫽ ⫺50 V and Vsd ⫽ 0 V. The driving scheme demands that the total capacitance associated with each pixel is sufficiently sma ...
Components and Methods for Current Measurement
... minimizes solder joint stress that is a result of a CTE mismatch between the resistor and the circuit board. The cyclic stresses that result from the CTE mismatch due to a lifetime of thermal cycling can lead to fatigue stress cracks in the solder joint that can compromise long-term reliability. The ...
... minimizes solder joint stress that is a result of a CTE mismatch between the resistor and the circuit board. The cyclic stresses that result from the CTE mismatch due to a lifetime of thermal cycling can lead to fatigue stress cracks in the solder joint that can compromise long-term reliability. The ...
Export To Word
... 02.17 Determine the polarity and function of each wire connected to the trunk release switch. 02.18 Evaluate the foot brake switch wiring and associated circuits. 02.19 Test the foot brake switch circuit. 02.20 Determine the polarity and function of each wire connected to the foot brake switch. 03.0 ...
... 02.17 Determine the polarity and function of each wire connected to the trunk release switch. 02.18 Evaluate the foot brake switch wiring and associated circuits. 02.19 Test the foot brake switch circuit. 02.20 Determine the polarity and function of each wire connected to the foot brake switch. 03.0 ...
A Circuit Model for ESD Performance Analysis of
... it is low and its resistance is low when the magnitude of the voltage across it is high [7], [8]. A varistor circuit model can be created using SPICE components. The accuracy and simulation time of the varistor model in a SPICE-like circuit simulator will be restricted by the non-linear block expres ...
... it is low and its resistance is low when the magnitude of the voltage across it is high [7], [8]. A varistor circuit model can be created using SPICE components. The accuracy and simulation time of the varistor model in a SPICE-like circuit simulator will be restricted by the non-linear block expres ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.