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FONTARGEN AP 22LL
Slow-drying, flux-free copper-tin hard solder paste with average metal content,
for steels, copper and copper alloys.
Specification
Based on DIN 8513: L - CuSn 20
Composition,
guiding analysis (%)
Sn Cu
20,0 80,0
Metal content
approx. 82 %
Technical specifications
Melting range: 800-890°C
Brazing range: 930-890°C
Sources of heat
Shielding gas furnace. The brazing temperature and furnace atmospheres
depend on the type of base materials that are brazen.
Paste application
Manually or automatically with pneumatic dosing
devices (see prospect FONTARGEN-“Dosing technology”).
Properties
FONTARGEN AP 22LL is a flux-free, slow-drying copper-tin
hard solder paste with a medium viscosity and medium metal
content. AP 22LL can be used in hydrogen-nitrogen mixtures
or exothermic atmospheres. Thanks to its low melting temperature
range, the paste is suited to brazing of work pieces made of
copper and copper alloys.
Application
AP 22LL can be used for the brazing of unalloyed and alloyed
steels, copper, copper alloys and coppered parts. The paste
should be used on components subject to low mechanical stress.
Tensile strength
On steel St 37-2/1.0037 in tensile tests complying with DIN 50145:
Gap of 0,05 mm: 205 N/mm 2
Gap of 0,15 mm: 127 N/mm2
Availability
Batch sizes: 5,0/25,0/50,0 kg
Smaller batch sizes on demand.
Rev.-No.: 0/08.01/pi