Download eTEC Series HV14,18,F0,0102,GG

eTEC Series HV14,18,F0,0102,GG
Thin Film Thermoelectric Module
The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density.
Due to its size, input power requirements and heat pumping capacity this device is suited
for use in applications to stabilize the temperature of sensitive optical components in
telecom and photonics industries.
The eTEC HV14 can produce 1.3 Watts of cooling capacity at 25°C ambient in a 4 mm2
footprint. Assembled with thin film semiconductor material and thermally conductive
Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications
with tight geometric space constraints. Custom designs are available to accommodate
metallization, pretin solder and ceramic patterns, however MOQ applies.
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
Micro Footprint
High Heat Pumping Density
Precise Temperature Control
Reliable Solid State Operation
<2 ms Response Time
RoHS Compliant
Laser Diodes
Photodiodes
Infrared (IR) Sensors
Pump Lasers
Crystal Oscillators
Optical Transceivers
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
25°C
50°C
Qmax (Watts)
1.3
1.3
Delta Tmax (°C)
45
45
Imax (Amps)
1.0
0.9
2.3
2.5
Qmax / area (W/cm )
64
64
Electrical Resistance (Ohms)
2.0
2.3
Thermal Resistance (K/W)
46
46
Vmax (Volts)
2
PACKAGE ASSEMBLY CONDITIONS
Max Time Exposure > 290°C
60 sec
Peak Assembly Temperature
325°C
TEMPERATURE CONDITIONS
Max Operating Temperature
150°C
OPERATING CONDITIONS
Max rate of change of current
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
[email protected]
www.lairdtech.com
1.75 Amps/sec
eTEC Series HV14,18,F0,0102,GG
Thin Film Thermoelectric Module
PERFORMANCE CURVES
COEFFICIENT OF PERFORMANCE
2.31
1.20
0.34
0.03
0.68
1.02
3.57
Tolerance for all dimensions
+/- 0.02 mm
2.36
2.04
3.54
ISOMETRIC DRAWING
0.06
0.45
0.95
0.52
0.06
3.54
0.06
0.40
0.27 0.01 mm
0.60 0.02 mm
0.01
0.27
1.89
Standard
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MM
TOLERANCES:
TWO PLACE DECIMAL
0.02
THREE PLACE DECIMAL 0.02
NAME
TITLE:
CHECKED
ENG APPR.
Paul Crocco 10/3/2013
MFG APPR.
INTERPRET GEOMETRIC
TOLERANCING PER:
PROPRIETARY AND CONFIDENTIAL
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
LAIRD ENGINEERED THERMAL SYSTEMS.
ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
LAIRD ENGINEERED THERMAL SYSTEMS IS
PROHIBITED.
OPERATING TIPS
5
MATERIAL
USED ON
NEXT ASSY
Laird Engineered Thermal Systems
4
1.15
DATE
Paul Crocco 10/3/2013
Au metallization on exterior ceramic substrate surfaces
Au wire bondable pads on hot side ceramic for lead attachment
DRAWN
A601
Q.A.
COMMENTS:
SIZE DWG. NO.
A
FINISH
REV
2.04
1
1
SHEET 1 OF 1
SCALE: 20:1 WEIGHT:
DO NOT SCALE DRAWING
2
3
1
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MM
TOLERANCES:
TWO PLACE DECIMAL
0.02
THREE PLACE DECIMAL 0.02
NAME
DRAWN
DATE
Paul Crocco 10/4/2013
• Maintain good surface contact on heat dissipation mechanism prior to operation
TITLE:
CHECKED
ENG APPR.
A608
Paul Crocco 10/4/2013
MFG APPR.
• Do not exceed Vmax or Imax values to maintain peak performance
PROPRIETARY AND CONFIDENTIAL
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
LAIRD ENGINEERED THERMAL SYSTEMS.
ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
LAIRD ENGINEERED THERMAL SYSTEMS IS
PROHIBITED.
USED ON
NEXT ASSY
Laird Engineered Thermal Systems
5
4
INTERPRET GEOMETRIC
TOLERANCING PER:
MATERIAL
Q.A.
COMMENTS:
SIZE DWG. NO.
A
FINISH
3
1
SHEET 1
SCALE: 50:1 WEIGHT:
DO NOT SCALE DRAWING
2
THR-DS-eTEC-HV14 1113
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use
and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird
Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products
are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
1
eTEC Series HV37,48,F2,0202,GG
Thin Film Thermoelectric Module
The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density.
Due to its size, input power requirements and heat pumping capacity this device is suited
for use in applications to stabilize the temperature of sensitive optical components in
telecom and photonics industries.
The eTEC HV37 can produce 3.7 Watts of cooling capacity at 25°C ambient in a 9 mm2
footprint. Assembled with thin film semiconductor material and thermally conductive
Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications
with tight geometric space constraints. Custom designs are available to accommodate
metallization, pretin solder and ceramic patterns, however MOQ applies.
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
Micro Footprint
High Heat Pumping Density
Precise Temperature Control
Reliable Solid State Operation
<2 ms Response Time
RoHS Compliant
Laser Diodes
Photodiodes
Infrared (IR) Sensors
Pump Lasers
Crystal Oscillators
Optical Transceivers
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
25°C
50°C
Qmax (Watts)
3.7
3.7
Delta Tmax (°C)
45
45
Imax (Amps)
1.1
1.0
6.0
6.4
Qmax / area (W/cm )
66
66
Electrical Resistance (Ohms)
4.8
5.5
Thermal Resistance (K/W)
16.5
15.5
Vmax (Volts)
2
PACKAGE ASSEMBLY CONDITIONS
Max Time Exposure > 290°C
60 sec
Peak Assembly Temperature
325°C
TEMPERATURE CONDITIONS
Max Operating Temperature
150°C
OPERATING CONDITIONS
Max rate of change of current
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
[email protected]
www.lairdtech.com
1.75 Amps/sec
eTEC Series HV37,48,F2,0202,GG
Thin Film Thermoelectric Module
PERFORMANCE CURVES
COEFFICIENT OF PERFORMANCE
0.04
1.26
0.04
0.75
1.10
0.75
0.03
3.39
2.07
2
2.05
0.06
0.06
0.25
ISOMETRIC DRAWING
0.62
0.27
1
1
0.06
0.75
0.25
0.01
Standard
3.77
Au metallization on exterior ceramic substrate surfaces
Au wire bondable pads on hot side ceramic for lead attachment
DIMENSIONS ARE IN INCHES
TOLERANCES:
FRACTIONAL
ANGULAR: MACH
BEND
TWO PLACE DECIMAL
THREE PLACE DECIMAL
PROPRIETARY AND CONFIDENTIAL
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
<INSERT COMPANY NAME HERE>. ANY
REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
<INSERT COMPANY NAME HERE> IS
PROHIBITED.
OPERATING TIPS
MATERIAL
NAME
0.01
2.36
DATE
DRAWN
CHECKED
ENG APPR.
MFG APPR.
Q.A.
COMMENTS:
NEXT ASSY
USED ON
APPLICATION
FINISH
SIZE
DWG. NO.
A HV37_01_DraftSource
DO NOT SCALE DRAWING
SCALE:20:1
WEIGHT:
2.36
2.38
REV.
SHEET 1 OF 1
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MM
TOLERANCES:
TWO PLACE DECIMAL
0.02
THREE PLACE DECIMAL 0.02
• Maintain good surface contact on heat dissipation mechanism prior to operation
NAME
DRAWN
DATE
Paul Crocco 10/4/2013
TITLE:
CHECKED
ENG APPR.
A604
Paul Crocco 10/4/2013
MFG APPR.
• Do not exceed Vmax or Imax values to maintain peak performance
INTERPRET GEOMETRIC
TOLERANCING PER:
PROPRIETARY AND CONFIDENTIAL
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
LAIRD ENGINEERED THERMAL SYSTEMS.
ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
LAIRD ENGINEERED THERMAL SYSTEMS IS
PROHIBITED.
MATERIAL
USED ON
NEXT ASSY
Laird Engineered Thermal Systems
5
4
Q.A.
COMMENTS:
SIZE DWG. NO.
A
FINISH
SCALE: 30:1 WEIGHT
DO NOT SCALE DRAWING
3
THR-DS-eTEC-HV37 1113
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use
and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird
Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products
are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
2
eTEC Series HV56,72,F2,0203,GG
Thin Film Thermoelectric Module
The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density.
Due to its size, input power requirements and heat pumping capacity this device is suited
for use in applications to stabilize the temperature of sensitive optical components in
telecom and photonics industries.
The eTEC HV56 can produce 6.5 Watts of cooling capacity at 25°C ambient in a 13 mm2
footprint. Assembled with thin film semiconductor material and thermally conductive
Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications
with tight geometric space constraints. Custom designs are available to accommodate
metallization, pretin solder and ceramic patterns, however MOQ applies.
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
Micro Footprint
High Heat Pumping Density
Precise Temperature Control
Reliable Solid State Operation
<2 ms Response Time
RoHS Compliant
Laser Diodes
Photodiodes
Infrared (IR) Sensors
Pump Lasers
Crystal Oscillators
Optical Transceivers
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
25°C
50°C
Qmax (Watts)
6.5
6.8
Delta Tmax (°C)
47
50
Imax (Amps)
1.1
1.1
9.6
10.4
Qmax / area (W/cm )
78
81
Electrical Resistance (Ohms)
7.0
8.0
Thermal Resistance (K/W)
10
10
Vmax (Volts)
2
PACKAGE ASSEMBLY CONDITIONS
Max Time Exposure > 290°C
60 sec
Peak Assembly Temperature
325°C
TEMPERATURE CONDITIONS
Max Operating Temperature
150°C
OPERATING CONDITIONS
Max rate of change of current
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
[email protected]
www.lairdtech.com
1.75 Amps/sec
eTEC Series HV56,72,F2,0203,GG
Thin Film Thermoelectric Module
PERFORMANCE CURVES
COEFFICIENT OF PERFORMANCE
2.31
1.20
0.34
0.03
0.68
1.02
3.57
Tolerance for all dimensions
+/- 0.02 mm
2.36
3.54
3.54
ISOMETRIC DRAWING
0.27 0.01 mm
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MM
TOLERANCES:
TWO PLACE DECIMAL
0.02
THREE PLACE DECIMAL 0.02
Standard
2.31
1.20
0.34
0.60 0.02 mm
NAME
DRAWN
0.68
1.02
DATE
Paul Crocco 10/3/2013
TITLE:
CHECKED
ENG APPR.
Paul Crocco 10/3/2013
MFG APPR.
INTERPRET GEOMETRIC
TOLERANCING PER:
PROPRIETARY AND CONFIDENTIAL
MATERIAL
USED ON
NEXT ASSY
Laird Engineered Thermal Systems
5
4
3.57
SIZE
DWG.
COMMENTS:
A
FINISH
NO.
REV
1
2.361
2
To
+/-
SHEET 1 OF 1
SCALE: 20:1 WEIGHT:
DO NOT SCALE DRAWING
3
A601
Q.A.
Au metallization on exterior ceramic substrate surfaces
Au wire bondable pads on hot side ceramic for lead attachment
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
LAIRD ENGINEERED THERMAL SYSTEMS.
ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
LAIRD ENGINEERED THERMAL SYSTEMS IS
PROHIBITED.
0.03
1
3.54
3.54
OPERATING TIPS
• Maintain good surface contact on heat dissipation mechanism prior to operation
0.27 0.01 mm
• Do not exceed Vmax or Imax values to maintain peak performance
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MM
TOLERANCES:
TWO PLACE DECIMAL
0.02
THREE PLACE DECIMAL 0.02
INTERPRET GEOMETRIC
TOLERANCING PER:
PROPRIETARY AND CONFIDENTIAL
THR-DS-eTEC-HV56 1113
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
LAIRD ENGINEERED THERMAL SYSTEMS.
ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
LAIRD ENGINEERED THERMAL SYSTEMS IS
PROHIBITED.
MATERIAL
NEXT ASSY
USED ON
FINISH
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice.
Responsibility for the use
Laird Engineered Thermal Systems
and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird
4
Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential5 damages of any kind. All Laird Technologies
products
are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
DO NOT SCALE DRAWING
3
eTEG Series PG09,14,F0,0102,GG
Thin Film Energy Harvester
Innovative Technology
for a Connected World
The eTEG Series is a micro thermoelectric power generator that harvests waste heat and
converts it to usable output DC power. Due to its size, output power generation and heat
conversion to power ratio this device is suitable for use in applications to power wireless
sensors and wireless sensor networks.
One eTEG PG09 can produce 33 milliWatts of output power and 0.6 volts in an open
circuit at a temperature differential of 100°C all within a 1 mm2 footprint. This unit is
assembled with thin film semiconductor material, thermally conductive aluminum nitride
ceramics and gold plated wire bondable pads. The eTEG Series is designed for low power
output applications with tight geometric space constraints. Custom designs are available
to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies.
FEATURES
APPLICATIONS
•
•
•
•
•
• Wireless Sensors
• LED Lighting
• Battery Charging
Micro Footprint
High Output Power Density
High Waste Heat Conversion Ratio
Reliable Solid State Operation
RoHS Compliant
ΔT
PERFORMANCE SPECIFICATIONS
50°C
100°C
Power Output (mW)
8.6
33
Voltage Output (V)
0.15
0.3
Current Output (mA)
58
111
Voltage Open Circuit (V)
0.3
0.6
Current, Short Circuit (mA)
115
222
THERMAL PARAMETERS
Thermal Resistance
Thermal Conductance
46 K/W
0.022 W/K
PACKAGE ASSEMBLY CONDITIONS
Max Time Exposure > 290°C
60 sec
Peak Assembly Temperature
325°C
TEMPERATURE CONDITIONS
Max Operating Temperature
150°C
Performance maximized with matched electrical load
global solutions: local support
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
[email protected]
www.lairdtech.com
TM
eTEG Series PG09,14,F0,0102,GG
Thin Film Energy Harvester
Innovative Technology
for a Connected World
PERFORMANCE CURVES
ISOMETRIC DRAWING
Standard
Au metallization on exterior ceramic substrate surfaces
Au wire bondable pads on hot side ceramic for lead attachment
OPERATING TIPS
• Maintain good surface contact on heat dissipation mechanism prior to operation
THR-DS-eTEG-PG09 0812
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with
the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird
Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products
are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
eTEG Series PG24,48,F2,0202,GG
Thin Film Energy Harvester
Innovative Technology
for a Connected World
The eTEG Series is a micro thermoelectric power generator that harvests waste heat and
converts it to usable output DC power. Due to its size, output power generation and heat
conversion to power ratio this device is suitable for use in applications to power wireless
sensors and wireless sensor networks.
One eTEG PG24 can produce 90 milliWatts of output power and 1.7 volts in an open
circuit at a temperature differential of 100°C all within a 6.9 mm2 footprint. This unit is
assembled with thin film semiconductor material, thermally conductive aluminum nitride
ceramics and gold plated wire bondable pads. The eTEG Series is designed for low power
output applications with tight geometric space constraints. Custom designs are available
to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies.
FEATURES
APPLICATIONS
•
•
•
•
•
• Wireless Sensors
• LED Lighting
• Battery Charging
Micro Footprint
High Output Power Density
High Waste Heat Conversion Ratio
Reliable Solid State Operation
RoHS Compliant
ΔT
PERFORMANCE SPECIFICATIONS
10°C
50°C
100°C
Power Output (mW)
1
24
90
Voltage Output (V)
0.09
0.4
0.85
Current Output (mA)
12
60
105
Voltage Open Circuit (V)
0.18
0.8
1.7
Current, Short Circuit (mA)
24
115
210
THERMAL PARAMETERS
Thermal Resistance
21 K/W
Thermal Conductance
0.048 W/K
PACKAGE ASSEMBLY CONDITIONS
Max Time Exposure > 290°C
60 sec
Peak Assembly Temperature
325°C
TEMPERATURE CONDITIONS
Max Operating Temperature
150°C
Performance maximized with matched electrical load
global solutions: local support
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
[email protected]
www.lairdtech.com
TM
eTEG Series PG24,48,F2,0202,GG
Thin Film Energy Harvester
Innovative Technology
for a Connected World
PERFORMANCE CURVES
ISOMETRIC DRAWING
Standard
Au metallization on exterior ceramic substrate surfaces
Au wire bondable pads on hot side ceramic for lead attachment
Optional
Bare solder wires, 2.0 inches in length
DEFINITIONS
Pmax ∆T
The maximum amount of power created from the thermoelectric generator’s
Seebeck effect. This point occurs when the load resistance matches the device
resistance resulting in an output voltage of ½ Voc, where Voc is the open
circuit voltage.
Delta T is the temperature difference across the thermoelectric generator.
THR-DS-eTEG-PG24 0812
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with
the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird
Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products
are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
eTEG Series PG37,72,F2,0203,GG
Thin Film Energy Harvester
Innovative Technology
for a Connected World
The eTEG Series is a micro thermoelectric power generator that harvests waste heat and
converts it to usable output DC power. Due to its size, output power generation and heat
conversion to power ratio this device is suitable for use in applications to power wireless
sensors and wireless sensor networks.
One eTEG PG37 can produce 130 milliWatts of output power and 2.5 volts in an open
circuit at a temperature differential of 100°C all within a 10.3 mm2 footprint. This unit is
assembled with thin film semiconductor material, thermally conductive aluminum nitride
ceramics and gold plated wire bondable pads. The eTEG Series is designed for low power
output applications with tight geometric space constraints. Custom designs are available
to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies.
FEATURES
APPLICATIONS
•
•
•
•
•
• Wireless Sensors
• LED Lighting
• Battery Charging
Micro Footprint
High Output Power Density
High Waste Heat Conversion Ratio
Reliable Solid State Operation
RoHS Compliant
ΔT
PERFORMANCE SPECIFICATIONS
10°C
50°C
100°C
Power Output (mW)
1.5
36
130
Voltage Output (V)
0.13
0.6
1.25
Current Output (mA)
12
60
105
Voltage Open Circuit (V)
0.26
1.2
2.5
Current, Short Circuit (mA)
24
115
210
THERMAL PARAMETERS
Thermal Resistance
13.1 K/W
Thermal Conductance
0.076 W/K
PACKAGE ASSEMBLY CONDITIONS
Max Time Exposure > 290°C
60 sec
Peak Assembly Temperature
325°C
TEMPERATURE CONDITIONS
Max Operating Temperature
150°C
Performance maximized with matched electrical load
global solutions: local support
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
[email protected]
www.lairdtech.com
TM
eTEG Series PG37,72,F2,0203,GG
Thin Film Energy Harvester
Innovative Technology
for a Connected World
PERFORMANCE CURVES
ISOMETRIC DRAWING
Standard
Au metallization on exterior ceramic substrate surfaces
Au wire bondable pads on hot side ceramic for lead attachment
Optional
Bare solder wires, 2.0 inches in length
DEFINITIONS
Pmax ∆T
The maximum amount of power created from the thermoelectric generator’s
Seebeck effect. This point occurs when the load resistance matches the device
resistance resulting in an output voltage of ½ Voc, where Voc is the open
circuit voltage.
Delta T is the temperature difference across the thermoelectric generator.
THR-DS-eTEG-PG37 0812
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with
the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird
Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products
are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
Thermobility WPG-1
Wireless Power Generator
The WPG-1 is a self-contained thin-film thermoelectric power generator that harvests waste heat
and converts it to usable output DC power. Due to its compact size, output power generation and
ability to regulate voltage this device is suitable for use in applications to power wireless sensors
and wireless sensor networks.
One WPG-1 can produce up to 1.5 mW of usable output power and can handle a wide range of
load resistances. An ultra-low voltage step-up converter is incorporated to provide usable output
power at low temperature differentials, < 20°K. The output power can be regulated to accommodate
three voltage set points: 3.3V, 4.1V or 5.0V. Custom design services are available to accommodate
alternate heat absorption and heat dissipation mechanisms or output power requirements,
however MOQ applies.
FEATURES
APPLICATIONS
• Compact form factor
• Regulated output voltage
• High waste heat conversion ratio
• Ultra-low voltage converter
• Reliable solid state operation
• Wireless sensors and transmitters
• LED lighting
• Battery charger
Heat is absorbed through a flat heat exchanger plate, energy is harvested by the thin-film
thermoelectric and heat is exhausted into ambient environment by the pin fin heat sink.
Note: Unit of measure is in mm’s
Americas: +1.888.246.9050
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
[email protected]
www.lairdtech.com/thermal
Thermobility WPG-1
Wireless Power Generator
OUTPUT POWER CURVES
OPERATING RANGE
Max Heat Source Temp
100°C
Ambient Temp
24°C
Temp Differential
15 to 76°C
REGULATOR
SETTINGS
SW-1 - VOLTAGE SELECTOR
SW2 - LOAD AND STORAGE SELECTOR
Silkscreen
5.0
4.1
3.3
Silkscreen
C
S
Vout
5.0 V
4.1 V
3.3 V
Load
J2 and J3
J2 and J3
LED
Storage
Off-board
only
Onboard
1000uF Cap
N/A
L
CAUTION
• Keep areas around the heat sink clear for optimal air flow
• Avoid excessive shock or vibration
• Avoid exposure to water or high moisture environments
THR-DS-WPG-1 0613
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird
Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability
of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold
pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird,
Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the
property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.