Download RF3394 GENERAL PURPOSE AMPLIFIER Features

RF3394
RF3394General Purpose
Amplifier
GENERAL PURPOSE AMPLIFIER
RoHS Compliant & Pb-Free Product
Package Style: QFN, 12-Pin, 3 x 3
„
20dB Small Signal Gain
„
+32dBm Output IP3
„
+18dBm Output Power
„
GND
9 NC
Basestation Applications
Broadband, Low-Noise Gain
Blocks
„
Driver Stage for Power Amplifiers
Final PA for Low-Power Applications
High Reliability Applications
8 RF OUT
NC 3
Footprint Compatible with MicroX
IF or RF Buffer Amplifiers
„
10
RF IN 2
„
„
11
NC 1
Applications
„
12
7 NC
4
5
6
GND
„
GND
Internally Matched Input and
Output
GND
„
DC to >6000MHz Operation
GND
„
GND
Features
Functional Block Diagram
Product Description
The RF3394 is a general purpose, low-cost RF amplifier IC. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as an easily-cascadable 50Ω gain block.
Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 6000MHz. The device is self-contained with 50Ω input and output impedances and requires only two external DCbiasing elements to operate as specified. The device is designed for cost effective
high reliability in a plastic package. The 3mmx3mm footprint is compatible with
standard ceramic and plastic Micro-X packages.
Ordering Information
RF3394
RF3394PCBA-41X
9GaAs HBT
GaAs MESFET
InGaP HBT
General Purpose Amplifier
Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Rev A14 DS070226
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RF3394
Absolute Maximum Ratings
Parameter
Input RF Power
Rating
Unit
+13
dBm
Operating Ambient Temperature
-40 to +85
°C
Storage Temperature
-60 to +150
°C
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Parameter
Min.
Specification
Typ.
Max.
Unit
Overall
Condition
T=25 °C, ICC =65mA (See Note 1.)
Frequency Range
3dB Bandwidth
Gain
DC to >6000
MHz
3
GHz
18.7
20.2
18.5
20.0
21.0
dB
dB
Freq=850MHz
17.0
18.7
22.0
dB
Freq=2000MHz
dB
Freq=3000MHz
16.7
15.7
Freq=4000MHz
12.1
Freq=6000MHz
Noise Figure
3.5
Input VSWR
<1.8:1
Output VSWR
dB
+29.0
Freq=2000MHz
In a 50Ω system, <500MHz
<1.25:1
In a 50Ω system, 500MHz to 5000MHz
<2.2:1
In a 50Ω system, 5000MHz to 6000MHz
<2.0:1
In a 50Ω system, <500MHz
<1.35:1
In a 50Ω system, 500MHz to 4000MHz
<1.8:1
Output IP3
Freq=500MHz
In a 50Ω system, 4000MHz to 6000MHz
+32.0
dBm
Freq=2000MHz
Output P1dB
+17.5
dBm
Freq=2000MHz
Reverse Isolation
22.0
dB
Freq=2000MHz
ThetaJC
147
°C/W
Maximum Measured Junction
Temperature at DC Bias Conditions
139
°C
TAMB =+85°C
Mean Time To Failure
3065
years
TAMB =+85°C
Thermal
ICC =65mA, PDISS =274mW. (See Note 3.)
Power Supply
Device Operating Voltage
Operating Current
VPIN =4.2V
With 22Ω bias resistor
4.4
4.5
4.6
V
At pin 8 with ICC =65mA
5.5
5.9
6.5
V
At evaluation board connectors, ICC =65mA
80
mA
See Note 2.
Note 1: All specification and characterization data has been gathered on standard FR-4 evaluation boards. These evaluation boards are not
optimized for frequencies above 2.5GHz. Performance above 2.5GHz may improve if a high performance PCB is used.
Note 2: The 3394 must be operated at or below 80mA in order to achieve the thermal performance listed above. While the RF3394 may be
operated at higher bias currents, 65mA is the recommended bias to ensure the highest possible reliability and electrical performance.
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
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Rev A14 DS070226
RF3394
Note 3: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution should be
used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 80mA over all intended operating conditions.
Rev A14 DS070226
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
www.BDTIC.com/RFMD
3 of 12
RF3394
Pin
1
2
Function
NC
RF IN
3
4
5
6
7
8
NC
GND
GND
GND
NC
RF OUT
Description
Interface Schematic
No internal connections. It is not necessary to ground this pin.
RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor,
suitable for the frequency of operation, should be used in most applications. DC coupling of the input is not allowed, because this will override the
internal feedback loop and cause temperature instability.
No internal connections. It is not necessary to ground this pin.
Ground connection.
Ground connection.
Ground connection.
No internal connections. It is not necessary to ground this pin.
RF output and bias pin. Biasing is accomplished with an external series
resistor and choke inductor to VCC. The resistor is selected to set the DC
current into this pin to a desired level. The resistor value is determined by
the following equation:
( V SUPPLY – V DEVICE )
R = ------------------------------------------------------I CC
RF OUT
RF IN
Because DC is present on this pin, a DC blocking capacitor, suitable for the
frequency of operation, should be used in most applications. The supply
side of the bias network should also be well bypassed.
9
10
11
12
Die
Flag
NC
GND
GND
GND
GND
No internal connections. It is not necessary to ground this pin.
Ground connection.
Ground connection.
Ground connection.
Ground connection. To ensure best performance, avoid placing ground vias
directly beneath the part.
Package Drawing
0.05 C
2 PLCS
0.10 C A
3.00
-A-
2 PLCS
0.10 C B
3
0.90
0.85
0.20
REF.
0.05
0.00
1
3.00
12°
MAX
0.10 C B
2 PLCS
0.10 C A
2 PLCS
-B-
2.75
SQ
-C-
SEATING
PLANE
0.10 M C A B
0.60
0.24
TYP
0.35
0.30
PIN 1 ID
R0.20
1.90
1.60
0.45
0.35
Dimensions in mm.
Shaded lead is pin 1.
4 of 12
0.375
0.275
1.15
0.85
0.65
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
www.BDTIC.com/RFMD
Rev A14 DS070226
RF3394
Application Schematic
VCC
10 nF
22 pF
47 nH
12
11
10
1
9
2
8
RBIAS
22 pF
RF IN
RF OUT
22 pF
3
7
4
5
6
Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
P1
P1-1
P1-3
1
VCC
2
GND
3
NC
VCC
P1-1
CON3
12
J1
RF IN
50 Ω μstrip
C1
100 pF
11
10
1
9
2
8
3
7
4
5
R1
22 Ω
C3
100 pF
L1
100 nH
C2
100 pF
C4
1 μF
50 Ω μstrip
J2
RF OUT
6
NOTE:
Evaluation board optimized for frequencies above 300 MHz and below 2.5 GHz.
For operation below 300 MHz the value of inductor L1 and capcitors C1 and C2
should be increased.
Rev A14 DS070226
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF3394
Evaluation Board Layout
Board Size 1.195" x 1.000"
Board Thickness 0.033”, Board Material FR-4
Note: A small amount of ground inductance is required to achieve datasheet performance. The necessary inductance may be
generated by ensuring that no ground vias are placed directly below the footprint of the part.
Overlay of Suggested Micro-X and 3mmx3mm Layouts Showing Compatibility
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Rev A14 DS070226
RF3394
Output P1dB versus Frequency Across Temperature
(ICC=65mA)
Gain versus Frequency Across Temperature
(ICC = 65 mA)
20.0
-40°C
20.0
-40°C
25°C
19.0
25°C
85°C
85°C
18.0
Output Power (dBm)
Gain (dB)
18.0
16.0
14.0
17.0
16.0
15.0
14.0
12.0
13.0
10.0
12.0
0.0
1000.0
2000.0
3000.0
4000.0
5000.0
6000.0
0.0
500.0
Frequency (MHz)
1500.0
2000.0
2500.0
3000.0
4000.0
Noise Figure versus Frequency Across Temperature
(ICC = 65 mA)
6.0
-40°C
-40°C
34.0
25°C
5.5
25°C
85°C
85°C
5.0
Noise Figure (dB)
32.0
30.0
OIP3 (dBm)
3500.0
Frequency (MHz)
Output IP3 versus Frequency Across Temperature
(ICC=65mA)
36.0
1000.0
28.0
26.0
4.5
4.0
3.5
24.0
3.0
22.0
2.5
20.0
2.0
0.0
500.0
1000.0
1500.0
2000.0
2500.0
3000.0
3500.0
0.0
4000.0
500.0
Frequency (MHz)
1500.0
2000.0
2500.0
3000.0
Frequency (dB)
Input VSWR versus Frequency Across Temperature
Output VSWR versus Frequency Across Temperature
(ICC = 65 mA)
2.8
1000.0
(ICC = 65 mA)
1.9
-40°C
2.6
1.8
25°C
2.4
1.7
2.2
1.6
2.0
1.5
VSWR
VSWR
85°C
1.8
1.4
1.6
1.3
1.4
1.2
1.2
1.1
1.0
1.0
-40°C
25°C
85°C
0.0
1000.0
2000.0
3000.0
4000.0
Frequency (MHz)
Rev A14 DS070226
5000.0
6000.0
0.0
1000.0
2000.0
3000.0
4000.0
5000.0
6000.0
Frequency (MHz)
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF3394
Reverse Isolation versus Frequency Across
Temperature (ICC = 65 mA)
23.0
Current versus Voltage
(At evaluation board connector, R BIAS = 22Ω)
90.0
80.0
22.0
60.0
ICC (mA)
Reverse Isolation (dB)
70.0
21.0
20.0
50.0
40.0
19.0
30.0
-40°C
-40°C
18.0
20.0
25°C
+25°C
+85°C
85°C
10.0
17.0
0.0
1000.0
2000.0
3000.0
4000.0
5000.0
4.5
6000.0
5.0
5.5
Frequency (MHz)
6.0
6.5
V CC (V)
Power Dissipated versus Voltage at Pin 8
Current versus Voltage
(At Pin 8 of the RF3394)
(TAMBIENT = +85°C)
0.40
80.0
0.35
70.0
0.30
Power Dissipated (W)
ICC (mA)
60.0
50.0
40.0
0.25
0.20
0.15
30.0
0.10
-40°C
+25°C
20.0
0.05
+85°C
10.0
0.00
4.0
4.1
4.2
4.3
4.4
4.5
4.6
VPIN (V)
4.00
4.10
4.20
4.30
4.40
4.50
4.60
VPIN (V)
Junction Temperature versus Power Dissipated
(TAMBIENT = +85°C)
165.00
Junction Temperature ( oC)
160.00
155.00
150.00
145.00
140.00
135.00
130.00
125.00
0.22
0.24
0.26
0.28
0.30
0.32
0.34
Power Dissipated (Watts)
8 of 12
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
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Rev A14 DS070226
RF3394
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3μinch
to 8μinch Gold over 180μinch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Mask Pattern
A = 0.59 x 0.32 (mm) Typ.
0.80 (mm) Typ.
1.00 (mm)
0.40 (mm) Typ.
0.70 (mm)
1.00 (mm)
Typ.
Typ.
Pin 1
3.20 (mm)
Typ.
0.65 (mm)
Typ.
A
A
A
A
A
A
2.20 (mm)
Typ.
0.95 (mm)
Typ.
0.30 (mm) Typ.
0.65 (mm) Typ.
1.30 (mm)
Typ.
2.60 (mm)
Figure 1. PCB Metal Land Pattern (Top View)
PCB Solder Mask Pattern
Rev A14 DS070226
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF3394
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
A = 0.72 x 0.45 (mm) Typ.
0.72 (mm) Typ.
1.15 (mm)
0.41 (mm) Typ.
0.75 (mm)
Typ. 1.05 (mm)
Typ.
Pin 1
3.32 (mm)
Typ. 0.65 (mm)
A
A
A
A
A
A
2.27 (mm)
Typ.
Typ.
1.01 (mm)
Typ.
0.45 (mm) Typ.
0.65 (mm) Typ.
1.30 (mm)
Typ.
2.60 (mm)
Figure 2. PCB Solder Mask (Top View)
Thermal Pad and Via Design
The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of
the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
NOTE: A small amount of ground inductance is required to achieve data sheet performance. The necessary inductance may be
generated by ensuring that no ground vias are placed directly below the footprint of the part.
10 of 12
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
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Rev A14 DS070226
RF3394
RoHS* Banned Material Content
RoHS Compliant:
Yes
Package total weight in grams (g):
0.023
Compliance Date Code:
0512
Bill of Materials Revision:
A
Pb Free Category:
B i l l o f Ma te r i a l s
e3
Pa r ts Pe r Mi l l i o n (PPM)
Pb
Cd
Hg
Cr V I
PB B
PB DE
Di e
0
0
0
0
0
0
Mo l d i ng Co mp o und
0
0
0
0
0
0
Le a d F r a me
0
0
0
0
0
0
Di e Atta ch Ep o x y
0
0
0
0
0
0
Wi r e
0
0
0
0
0
0
So l d e r Pl a ti ng
0
0
0
0
0
0
Thi s R o HS b a nne d ma te r i a l co nte nt d e cl a r a ti o n wa s p r e p a r e d so l e l y o n i nfo r ma ti o n, i ncl ud i ng a na l y ti ca l
d a ta , p r o vi d e d to R F MD b y i ts sup p l i e r s, a nd a pp l i e s to the B i l l o f Ma te r i a l s (B OM) r e vi si o n no te d
* DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the
use of certain hazardous substances in electrical and electronic equipment
Rev A14 DS070226
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF3394
12 of 12
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
www.BDTIC.com/RFMD
Rev A14 DS070226