Download ISL9R30120G2 30 A, 1200 V STEALTH™ Diode ISL9R30120G2 — STEALTH™ Diode

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Transcript
ISL9R30120G2
30 A, 1200 V STEALTH™ Diode
Features
Description
• Stealth Recovery trr = 269 ns (@ IF = 30 A)
The ISL9R30120G2 is a STEALTH™ diode optimized for
low loss performance in high frequency hard switched
applications. The STEALTH™ family exhibits low reverse
recovery current (IRR) and exceptionally soft recovery under
typical operating conditions. This device is intended for use
as a free wheeling or boost diode in power supplies and
other power switching applications. The low IRR and short ta
phase reduce loss in switching transistors. The soft
recovery minimizes ringing, expanding the range of
conditions under which the diode may be operated without
the use of additional snubber circuitry. Consider using the
STEALTH™ diode with an SMPS IGBT to provide the most
efficient and highest power density design at lower cost.
• Max Forward Voltage, VF = 3.3 V (@ TC = 25°C)
• 1200 V Reverse Voltage and High Reliability
• Avalanche Energy Rated
• RoHS Compliant
Applications
• Switch Mode Power Supplies
• Hard Switched PFC Boost Diode
• UPS Free Wheeling Diode
• Motor Drive FWD
• SMPS FWD
• Snubber Diode
Package
Symbol
JEDEC STYLE 2 LEAD TO-247
ANODE
CATHODE
K
CATHODE
(BOTTOM SIDE
METAL)
A
Device Maximum Ratings TC = 25°C unless otherwise noted
Symbol
VRRM
VRWM
VR
Parameter
Rating
1200
Repetitive Peak Reverse Voltage
Unit
V
Working Peak Reverse Voltage
1200
V
DC Blocking Voltage
1200
V
A
IF(AV)
Average Rectified Forward Current (TC = 80oC)
30
IFRM
Repetitive Peak Surge Current (20 kHz Square Wave)
70
A
IFSM
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60 Hz)
325
A
Power Dissipation
166
W
Avalanche Energy (1 A, 40 mH)
20
mJ
-55 to 175
°C
300
260
°C
°C
PD
EAVL
TJ, TSTG
TL
TPKG
Operating and Storage Temperature Range
Maximum Temperature for Soldering
Leads at 0.063 in (1.6 mm) from Case for 10 s
Package Body for 10s, See Application Note AN-7528
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2002 Fairchild Semiconductor
Corporation ISL9R30120G2 Rev. C2
1
www.fairchildsemi.com
ISL9R30120G2 — STEALTH™ Diode
February 2014
Part Number
ISL9R30120G2
Top Mark
R30120G2
Packing Method
Tube
Package
TO-247
Tape Width
N/A
Quantity
30
Electrical Characteristics TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Off State Characteristics
IR
Instantaneous Reverse Current
VR = 1200 V
TC = 25°C
-
-
100
µA
TC = 125°C
-
-
1.0
mA
On State Characteristics
VF
Instantaneous Forward Voltage
IF = 30 A
TC = 25°C
-
2.8
3.3
V
TC = 125°C
-
2.6
3.1
V
-
115
-
pF
Dynamic Characteristics
CJ
Junction Capacitance
VR = 10 V, IF = 0 A
Switching Characteristics
trr
Reverse Recovery Time
trr
Reverse Recovery Time
Irr
Reverse Recovery Current
Qrr
Reverse Recovered Charge
trr
Reverse Recovery Time
S
Softness Factor (tb/ta)
Irr
Reverse Recovery Current
Qrr
Reverse Recovered Charge
trr
Reverse Recovery Time
S
Softness Factor (tb/ta)
Irr
Reverse Recovery Current
Qrr
Reverse Recovered Charge
dIM/dt
IF = 1 A, dI/dt = 100 A/µs, VR = 15 V
-
45
56
ns
IF = 30 A, dI/dt = 100 A/µs, VR = 15 V
IF = 30 A,
dIF/dt = 200 A/µs,
VR = 780 V, TC = 25°C
-
80
100
ns
-
269
-
ns
-
7.5
-
A
-
930
-
nC
IF = 30 A,
dIF/dt = 200 A/µs,
VR = 780 V,
TC = 125°C
-
529
-
ns
-
6.2
-
-
-
11
-
A
-
3.0
-
µC
IF = 30 A,
dIF/dt = 1000 A/µs,
VR = 780 V,
TC = 125°C
-
260
-
ns
-
4.8
-
-
-
30
-
A
Maximum di/dt during tb
-
3.4
-
µC
-
520
-
A/µs
Thermal Characteristics
RθJC
Thermal Resistance Junction to Case
TO-247
-
-
0.75
°C/W
RθJA
Thermal Resistance Junction to Ambient TO-247
-
-
30
°C/W
©2002 Fairchild Semiconductor Corporation
ISL9R30120G2 Rev. C2
2
www.fairchildsemi.com
ISL9R30120G2 — STEALTH™ Diode
Package Marking and Ordering Information
60
1000
150oC
150oC
40
IR, REVERSE CURRENT (µA)
IF, FORWARD CURRENT (A)
50
125oC
30
100oC
20
25oC
10
0
0.5
1
1.5
2
2.5
3
3.5
125oC
100
100oC
10
75oC
1
25oC
0.1
0.01
0.2
4
0.3
0.4
VF , FORWARD VOLTAGE (V)
Figure 1. Forward Current vs Forward Voltage
750
750
VR = 780V, TC = 125oC
0.7
0.8
0.9
1.0
1.1
1.2
VR = 780V, TC = 125oC
625
tb at dIF/dt = 200A/µs, 500A/µs, 800A/µs
t, RECOVERY TIMES (ns)
t, RECOVERY TIMES (ns)
0.6
Figure 2. Reverse Current vs Reverse Voltage
625
500
375
250
125
0
10
20
30
40
50
tb at IF = 60A, 30A, 15A
500
375
250
125
ta at dIF/dt = 200A/µs, 500A/µs, 800A/µs
ta at IF = 60A, 30A, 15A
0
200
0
60
IF , FORWARD CURRENT (A)
40
40
IRR , MAX REVERSE RECOVERY CURRENT (A)
dIF/dt = 800A/µs
dIF/dt = 500A/µs
20
dIF/dt = 200A/µs
10
0
0
10
20
30
40
50
60
IF , FORWARD CURRENT (A)
800
1000
1200
VR = 780V, TC = 125oC
35
30
25
IF = 60A
20
IF = 30A
15
10
200
IF = 15A
400
600
800
1000
1200
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 5. Maximum Reverse Recovery Current vs
Forward Current
©2002 Fairchild Semiconductor Corporation
ISL9R30120G2 Rev. C2
600
Figure 4. ta and tb Curves vs dIF /dt
VR = 780V, TC = 125oC
30
400
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 3. ta and tb Curves vs Forward Current
IRR, MAX REVERSE RECOVERY CURRENT (A)
0.5
VR , REVERSE VOLTAGE (KV)
Figure 6. Maximum Reverse Recovery Current vs
dIF /dt
3
www.fairchildsemi.com
ISL9R30120G2 — STEALTH™ Diode
Typical Performance Curves
QRR, REVERSE RECOVERED CHARGE (µC)
VR = 780V, TC = 125oC
8
IF = 60A
7
6
IF = 30A
5
IF = 15A
4
3
200
400
600
800
1000
VR = 780V, TC = 125oC
5.6
4.5
4.0
IF = 30A
3.5
3.0
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
IRM(REC) , MAX REVERSE RECOVERY CURRENT (A)
CJ , JUNCTION CAPACITANCE (pF)
f = 1MHZ
1200
1000
800
600
400
200
0.1
1
10
600
800
1000
1200
Figure 8. Reverse Recovery Charge vs dIF/dt
1400
0
0.03
400
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 7. Reverse Recovery Softness Factor vs
dIF /dt
1600
IF = 15A
2.5
2.0
200
1200
IF = 60A
5.0
100
-14
400
IF = 30A, VR = 780V, dIF /dt = 500A/µs
IRM(REC)
-16
350
-18
300
-20
250
t, RECOVERY TIMES (ns)
S, REVERSE RECOVERY SOFTNESS FACTOR
6.0
9
tRR
-22
25
VR , REVERSE VOLTAGE (V)
50
75
100
125
200
150
TC, CASE TEMPERATURE (oC)
Figure 9. Junction Capacitance vs Reverse Voltage
Figure 10. Maximum Reverse Recovery Current
and trr vs Case Temperature
Average Forward Current, IF(AV) [A]
80
60
40
20
0
25
50
75
100
125
150
o
Case temperature, TC [ C]
175
Figure 11. DC Current Derating Curve
©2002 Fairchild Semiconductor Corporation
ISL9R30120G2 Rev. C2
4
www.fairchildsemi.com
ISL9R30120G2 — STEALTH™ Diode
Typical Performance Curves (Continued)
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
ZθJA, NORMALIZED
THERMAL IMPEDANCE
1.0
PDM
0.1
t1
SINGLE PULSE
0.01
10-5
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
10-4
10-3
10-2
10-1
t, RECTANGULAR PULSE DURATION (s)
100
101
Figure 12. Normalized Maximum Transient Thermal Impedance
Test Circuit and Waveforms
VGE AMPLITUDE AND
RG CONTROL dIF/dt
t1 AND t2 CONTROL IF
L
IF
DUT
RG
VGE
CURRENT
SENSE
trr
dt
ta
0
tb
+
-
MOSFET
t1
dIF
0.25 IRM
VDD
IRM
t2
Figure 13. trr Test Circuit
Figure 14. trr Waveforms and Definitions
I = 1A
L = 40mH
R < 0.1Ω
VDD = 50V
EAVL = 1/2LI2 [VR(AVL) /(VR(AVL) - VDD)]
Q1 = IGBT (BVCES > DUT VR(AVL))
Q1
L
CURRENT
SENSE
VAVL
R
+
VDD
IL
VDD
DUT
t0
Figure 15. Avalanche Energy Test Circuit
©2002 Fairchild Semiconductor Corporation
ISL9R30120G2 Rev. C2
IL
I V
t1
t2
t
Figure 16. Avalanche Current and Voltage
Waveforms
5
www.fairchildsemi.com
ISL9R30120G2 — STEALTH™ Diode
Typical Performance Curves (Continued)
ISL9R30120G2 — STEALTH™ Diode
Mechanical Dimensions
TO-247 2L
Figure 17. TO-247,Molded, 2LD, Jedec Option AB
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO247-002.
©2002 Fairchild Semiconductor Corporation
ISL9R30120G2 Rev. C2
6
www.fairchildsemi.com
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
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intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
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Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
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Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
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Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I66
©2002 Fairchild Semiconductor Corporation
ISL9R30120G2 Rev. C2
7
www.fairchildsemi.com
ISL9R30120G2 — STEALTH™ Diode
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
Sync-Lock™
F-PFS™
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®
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®*
®
Global Power ResourceSM
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GreenBridge™
PowerXS™
Build it Now™
TinyBoost®
Green FPS™
Programmable Active Droop™
CorePLUS™
TinyBuck®
®
Green FPS™ e-Series™
QFET
CorePOWER™
TinyCalc™
QS™
Gmax™
CROSSVOLT™
TinyLogic®
Quiet Series™
GTO™
CTL™
TINYOPTO™
RapidConfigure™
IntelliMAX™
Current Transfer Logic™
TinyPower™
ISOPLANAR™
DEUXPEED®
™
TinyPWM™
Dual Cool™
Marking Small Speakers Sound Louder
TinyWire™
Saving our world, 1mW/W/kW at a time™
EcoSPARK®
and Better™
TranSiC™
EfficentMax™
SignalWise™
MegaBuck™
TriFault Detect™
ESBC™
SmartMax™
MICROCOUPLER™
TRUECURRENT®*
SMART
START™
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®
SerDes™
Solutions for Your Success™
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MicroPak2™
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®
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®
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®
VCX™
OPTOLOGIC
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®
®
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