Download BAW78.../BAW79...

BAW78.../BAW79...
Silicon Switching Diodes
• Switching applications
• High breakdown voltage
• Pb-free (RoHS compliant) package 1)
• Qualified according AEC Q101
BDTIC
BAW78D
BAW79D
!
!
Type
Package
Configuration
Marking
BAW78D
BAW79D
SOT89
SOT89
single
common cathode
GD
GH
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Value
Diode reverse voltage
VR
400
Peak reverse voltage
VRM
400
Forward current
IF
1
Peak forward current
I FM
1
Peak forward current
I FM
1
Surge forward current, t = 1 µs
I FS
10
Non-repetitive peak surge forward current
I FSM
Total power dissipation
Ptot
BAW79D, TS ≤ 115°C
1
Storage temperature
T stg
1Pb-containing
A
W
1
Tj
V
-
BAW78D, TS ≤ 125°C
Junction temperature
Unit
150
°C
-65 ... 150
package may be available upon special request
1
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2007-04-20
BAW78.../BAW79...
Thermal Resistance
Parameter
Symbol
Junction - soldering point 1)
RthJS
Value
Unit
K/W
BAW78D
≤ 25
BAW79D
≤ 35
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Unit
Parameter
min.
typ. max.
DC Characteristics
400
V
Breakdown voltage
V(BR)
BDTIC
I(BR) = 100 µA
Reverse current
IR
VR = 400 V
-
-
-
-
µA
1
50
VR = 400 V, TA = 150 °C
Forward voltage
V
VF
IF = 1 A
-
-
1.6
IF = 2 A
-
-
2
CT
-
10
-
pF
trr
-
1
-
µs
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz
Reverse recovery time
IF = 200mA, IR = 200mA, measured at IR = 20mA
,
RL = 100Ω
Test circuit for reverse recovery time
D.U.T.
ΙF
Puls generator: tp = 10µs, D = 0.05,
tr = 0.6ns, Ri = 50Ω
Oscillograph
EHN00019
1For
Oscillograp: R = 50Ω, tr = 0.35ns
C ≤ 1pF
calculation of RthJA please refer to Application Note Thermal Resistance
2
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2007-04-20
BAW78.../BAW79...
Reverse current IR = ƒ (TA)
Forward current IF = ƒ (VF)
VR = 400V
TA = 25°C
ΙR
BAW 78A...D
10 5
nA
EHB00097
10 1
ΙF
max
10 4
BAW 78A...D
EHB00095
A
10 0
5
typ.
BDTIC
10 3
10 -1
5
10 2
10 -2
5
10 1
0
50
100
˚C
10 -3
150
0
1
V
TA
Peak forward current IFM = ƒ (tp)
2
VF
Forward current IF = ƒ (T S)
BAW78D
10 2
EHB00100
1200
mA
D = 0.005
0.01
0.02
0.05
0.1
0.2
A
10 1
1000
900
800
IF
Ι FM
BAW 79A...D
700
10 0
600
500
400
10 -1
300
tp
D=
T
tp
200
100
T
10-2
10-6
10-5
10-4
10-3
10-2
0
0
10-1 s 100
15
30
45
60
75
90 105 120 °C
150
TS
t
3
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2007-04-20
BAW78.../BAW79...
Forward current IF = ƒ (T S)
BAW79D
1200
mA
1000
900
IF
800
700
BDTIC
600
500
400
300
200
100
0
0
15
30
45
60
75
90 105 120 °C
150
TS
4
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2007-04-20
Package SOT89
BAW78.../BAW79...
Package Outline
4.5 ±0.1
45˚
B
1.5 ±0.1
1)
1.6 ±0.2
0.2 MAX.
2
2.75 +0.1
-0.15
10˚ MAX.
1 ±0.2
1
0.15
4 ±0.25
1 ±0.1
1)
2.5 ±0.1
0.25 ±0.05
3
1.5
0.35 ±0.1
0.45 +0.2
-0.1
3
0.15
M
B x3
0.2 B
1) Ejector pin markings possible
BDTIC
Foot Print
1.2
1.0
2.5
2.0
0.8
0.8
0.7
Marking Layout (Example)
BAW78D
Type code
Pin 1
2005, June
Date code (YM)
Manufacturer
Standard Packing
Reel ø180 mm = 1.000 Pieces/Reel
Reel ø330 mm = 4.000 Pieces/Reel
0.2
4.6
12
8
Pin 1
4.3
5
1.6
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2007-04-20
BAW78.../BAW79...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
BDTIC
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
6
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2007-04-20