Download ZXMC10A816N8 Product Summary Features

ZXMC10A816N8
100V COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
Product Summary
Device
V(BR)DSS
Q1
100V
Q2
-100V
Features
RDS(ON) (Ω)max
ID (A)max
TA = +25°C

100V Complementary in SOIC package

Low On-Resistance
0.230 @ VGS= 10V
2.1
0.300 @ VGS= 4.5V
1.9


Fast Switching Speed
Low Voltage (VGS = 4.5V) gate drive
0.235 @ VGS= -10V
-2.2

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
0.320 @ VGS= -4.5V
-1.9

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability
Description
Mechanical Data
This new generation complementary dual MOSFET features low on-

resistance achievable with low gate drive.

DC Motor Control

Backlighting
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Applications

Case: SO-8

Moisture Sensitivity: Level 1 per J-STD-020

Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208 e3

Weight: 0.074 grams (approximate)
D1
SO-8
S1
D1
G1
D1
S2
D2
G2
D2
G2
G1
S2
S1
Q1 N-Channel
Q2 P-Channel
Equivalent Circuit
Top
view
Top View
Top View
D2
Ordering Information (Note 4)
Notes:
Product
Reel size (inches)
Tape width (mm)
Quantity per reel
ZXMC10A816N8
13
12
2,500
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
Top View
8
5
ZXMC
Logo
10A816
Part no.
YY WW
Xth week: 01 ~ 53
Year: “11” = 2011
1
4
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Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
N-channel
Q1
P-channel
Q2
Unit
Drain-Source Voltage
VDSS
100
-100
V
Gate-Source Voltage
VGS
20
20
V
ID
2.1
1.7
1.7
2.0
2.3
-2.2
-1.8
-1.7
-2.0
-2.4
A
IDM
9.4
-10.5
A
IS
3.0
-3.1
A
ISM
9.4
-10.5
A
IAS
1.2
Parameter
(b)(d)
Continuous Drain Current @ VGS= 10V; TA= +25°C
(b)(d)
@ VGS= 10V; TA= +70°C
(a)(d)
@ VGS= 10V; TA= +25°C
(a)(e)
@ VGS= 10V; TA= +25°C
(f)(d)
@ VGS= 10V; TL= +25°C
Pulsed Drain Current @ VGS = 10V; TA = +25°C
(c)(d)
Continuous Source Current (Body Diode) at TA = +25°C
Pulsed Source Current (Body Diode) at TA = +25°C
(b)(d)
(c)(d)
Avalanche Current (g) L = 0.1 mH
Power Dissipation at TA = +25°C
Linear Derating Factor
(a)(d)
Power Dissipation at TA = +25°C
Linear Derating Factor
(a)(e)
Power Dissipation at TA = +25°C
Linear Derating Factor
(b)(d)
Power Dissipation at TL = +25°C
Linear Derating Factor
(f)(d)
A
PD
W
mW/C
PD
1.8
14.2
W
mW/C
PD
2.1
16.7
W
mW/C
PD
Operating and Storage Temperature Range
12
1.3
10.0
2.4
18.9
2.6
20.4
W
mW/C
Tj, Tstg
-55 to +150
C
Symbol
RJA
Value
100
C/W
RJA
70
C/W
RJA
60
C/W
Thermal Characteristics
Parameter
Junction to Ambient
(a)(d)
Junction to Ambient
(a)(e)
Junction to Ambient
(b)(d)
Junction to Lead
Notes:
(f)(d)
RJL
53
Unit
49
C/W
(a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
(b) Same as note (a), except the device is measured at t  10 sec.
(c) Same as note (a), except the device is pulsed with D= 0.02 and pulse width 300µs. The pulse current is limited by the maximum junction temperature.
(d) For a dual device with one active die.
(e) For a device with two active die running at equal power.
(f) Thermal resistance from junction to solder-point (at the end of the drain lead); the device is operating in a steady-state condition.
(g) IAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
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Thermal Characteristics
10
10
RDS(ON)
-ID Drain Current (A)
ID Drain Current (A)
Limited
1
DC
1s
100m
10m
10ms
1ms
Single Pulse, T amb=25°C
0.1
Limited
1
DC
1s
100m
100ms
Note (a)(d)
RDS(ON)
1
100ms
10m
100us
10
1ms
Single Pulse, T amb=25°C
0.1
100
VDS Drain-Source Voltage (V)
10ms
Note (a)(d)
1
100us
10
100
-VDS Drain-Source Voltage (V)
N-channel Safe Operating Area
P-channel Safe Operating Area
80
60
D=0.5
40
Single Pulse
D=0.2
20
D=0.05
0
100µ
D=0.1
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Max Power Dissipation (W)
Thermal Resistance (°C/W)
2.0
100
1.5
One active die
1.0
0.5
0.0
Transient Thermal Impedance
Maximum Power (W)
Two active die
0
25
50
75
100
125
150
Temperature (°C)
Derating Curve
Single Pulse
T amb=25°C
100
10
1
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Pulse Power Dissipation
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Electrical Characteristics Q1 N-Channel (@TA = +25°C, unless otherwise specified.)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Drain-Source Breakdown Voltage
V(BR)DSS
100
—
—
V
Zero Gate Voltage Drain Current
IDSS
—
—
0.5
µA
VDS = 100V, VGS = 0V
Gate-Body Leakage
IGSS
—
—
100
nA
VGS = 20V, VDS = 0V
VGS(th)
1.7
—
2.4
V
ID = 250µA, VDS = VGS
RDS(ON)
—
0.170
0.210
0.230
0.300
Ω
VGS = 10V, ID = 1.0A
VGS = 4.5V, ID = 0.5A
gfs
—
4.8
S
VDS= 15V, ID= 1.6A
Static
Gate-Source Threshold Voltage
Static Drain-Source On-State Resistance
Forward Transconductance
Dynamic Capacitance
(a) (c)
(a)
—
(c)
Ciss
—
497
—
pF
Output Capacitance
Coss
—
29
—
pF
Reverse Transfer Capacitance
Crss
—
18
—
pF
Input Capacitance
Switching
ID = 250µA, VGS = 0V
VDS = 50V, VGS = 0V
f = 1MHz
(b) (c)
Turn-On-Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Gate Charge
td(ON)
—
2.9
—
ns
tr
—
2.1
—
ns
td(OFF)
—
12.1
—
ns
tf
—
5.0
—
ns
VDD = 50V, VGS = 10V
ID = 1.0A
RG  6.0,
(c)
Total Gate Charge
Qg
—
9.2
—
nC
Gate-Source Charge
Qgs
—
1.7
—
nC
Gate-Drain Charge
Qgd
—
2.5
—
nC
VSD
—
0.85
0.95
V
trr
—
32
—
ns
Qrr
—
40
—
nC
RG
0
—
3
Ω
VDS = 50V, VGS = 10V
ID = 1.6A
Source–Drain Diode
Diode Forward Voltage
(a)
Reverse Recovery Time
(c)
Reverse Recovery Charge
(c)
IS = 1.7A, VGS = 0V
IS = 1.7A, di/dt = 100A/s
Gate Resistance
Gate Resistance
Notes:
VDS = 0V, VGS = 0V, f = 1.0MHz
(a) Measured under pulsed conditions. Pulse width  300s; duty cycle  2%.
(b) Switching characteristics are independent of operating junction temperature.
(c) For design aid only, not subject to production testing.
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Typical Characteristics Q1 N-Channel
10V
T = 25°C
10
5V
4.5V
4V
1
3.5V
0.1
VGS
3V
0.01
0.1
1
ID Drain Current (A)
ID Drain Current (A)
10
4.5V
4V
3.5V
1
3V
VGS
0.1
2.5V
0.01
10
5V
10V
T = 150°C
VDS Drain-Source Voltage (V)
0.1
1
10
VDS Drain-Source Voltage (V)
Output Characteristics
Output Characteristics
Normalised RDS(on) and VGS(th)
ID Drain Current (A)
2.2
T = 150°C
1
T = 25°C
0.1
VDS = 10V
0.01
2.0
2.5
3.0
3.5
4.0
4.5
1.8
RDS(on)
1.6
1.4
1.2
1.0
VGS(th)
0.8
VGS = VDS
ID = 250uA
0.6
0.4
-50
VGS Gate-Source Voltage (V)
Typical Transfer Characteristics
VGS = 10V
ID = 1.6A
2.0
0
50
100
150
Tj Junction Temperature (°C)
Normalised Curves v Temperature
3V
T = 25°C
VGS
3.5V
4V
1
4.5V
5V
10V
0.1
0.01
0.1
1
ID Drain Current (A)
10
On-Resistance v Drain Current
ISD Reverse Drain Current (A)
RDS(on) Drain-Source On-Resistance 
10
10
T = 150°C
1
T = 25°C
0.1
0.01
0.2
0.4
0.6
0.8
1.0
1.2
VSD Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
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Typical Characteristics Q1 N-Channel (cont.)
10
VGS = 0V
f = 1MHz
C Capacitance (pF)
600
500
CISS
400
300
COSS
200
CRSS
100
0
0.1
1
10
100
VDS - Drain - Source Voltage (V)
Capacitance v Drain-Source Voltage
VGS Gate-Source Voltage (V)
700
ID = 1.6A
8
6
4
2
VDS = 50V
0
0
2
4
6
8
10
Q - Charge (nC)
Gate-Source Voltage v Gate Charge
Test Circuits
Current
regulator
QG
12V
VG
QGS
50k
Same as
D.U.T
QGD
VDS
IG
D.U.T
ID
VGS
Charge
Basic gate charge waveform
Gate charge test circuit
VDS
90%
RD
VGS
VDS
RG
VDD
10%
VGS
td(on)
tr
t(on)
td(off)
tr
t(on)
Switching time waveforms
Switching time test circuit
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Electrical Characteristics Q2 P-Channel (@TA = +25°C, unless otherwise specified.)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Static
Drain-Source Breakdown Voltage
V(BR)DSS
-100
—
—
V
ID = -250µA, VGS = 0V
Zero Gate Voltage Drain current
IDSS
—
—
-0.5
µA
VDS = -100V, VGS = 0V
Gate-Body Leakage
IGSS
—
—
100
nA
VGS = 20V, VDS = 0V
VGS(th)
-2.0
—
-3.0
V
ID = -250µA, VDS = VGS
RDS(ON)
—
0.170
0.250
0.235
0.320
Ω
VGS = -10V, ID = -1.0A
VGS = -4.5V, ID = -0.5A
gfs
—
4.7
—
S
VDS = -15V, ID = -2.1A
Gate-Source Threshold Voltage
Static Drain-Source On-State Resistance
Forward Transconductance
Dynamic Capacitance
(a) (c)
(a)
(c)
Input Capacitance
Ciss
—
717
—
pF
Output Capacitance
Coss
—
55
—
pF
Reverse Transfer Capacitance
Crss
—
46
—
pF
Switching
VDS = -50V, VGS = 0V
f = 1MHz
(b) (c)
Turn-On-Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Gate Charge
td(ON)
—
4.3
—
ns
tr
—
5.2
—
ns
td(OFF)
—
20
—
ns
tf
—
12
—
ns
VDD = -50V, VGS = -10V
ID = -1A
RG  6.0,
(c)
Total Gate Charge
Qg
—
16.5
—
nC
Gate-Source Charge
Qgs
—
2.5
—
nC
Gate-Drain Charge
Qgd
—
5.4
—
nC
VSD
—
-0.85
-0.95
V
trr
—
43
—
ns
Qrr
—
77
—
nC
RG
0
—
100

VDS = -50V, VGS = -10V
ID = -2.1A
Source–Drain Diode
Diode Forward Voltage
(a)
Reverse Recovery Time
(c)
Reverse Recovery Charge
(c)
IS = -1.7A, VGS = 0V
IS = -1.7A, di/dt = 100A/s
Gate Resistance
Gate Resistance
Notes:
VDS = 0V, VGS = 0V, f = 1.0MHz
(a) Measured under pulsed conditions. Pulse width  300s; duty cycle  2%.
(b) Switching characteristics are independent of operating junction temperature.
(c) For design aid only, not subject to production testing.
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Typical Characteristics Q2 P-Channel
10V
T = 25°C
10
5V
4.5V
4V
1
3.5V
0.1
-VGS
0.1
1
-ID Drain Current (A)
-ID Drain Current (A)
10
5V
4.5V
4V
1
3.5V
3V
0.1
-VGS
0.01
10
10V
T = 150°C
-VDS Drain-Source Voltage (V)
0.1
1
10
-VDS Drain-Source Voltage (V)
Output Characteristics
Output Characteristics
Normalised RDS(on) and VGS(th)
T = 150°C
T = 25°C
1
-VDS = 10V
3.0
3.5
4.0
4.5
5.0
-VGS Gate-Source Voltage (V)
RDS(on) Drain-Source On-Resistance 
Typical Transfer Characteristics
-VGS
3.5V
4V
4.5V
5V
1
7V
0.1
0.1
10V
1
-ID Drain Current (A)
10
On-Resistance v Drain Current
ID = - 2.1A
1.6
RDS(on)
1.4
1.2
1.0
VGS(th)
0.8
VGS = VDS
0.6
ID = -250uA
0
50
100
Tj Junction Temperature (°C)
10
1
T = 150°C
0.1
T = 25°C
0.01
1E-3
0.2
0.4
0.6
0.8
-VSD Source-Drain Voltage (V)
Document number: DS33497 Rev. 2 - 2
1.0
Source-Drain Diode Forward Voltage
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ZXMC10A816N8
150
Normalised Curves v Temperature
T = 25°C
10
VGS = -10V
1.8
-50
-ISD Reverse Drain Current (A)
-ID Drain Current (A)
2.0
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Typical Characteristics Q2 P-Channel (cont.)
C Capacitance (pF)
VGS = 0V
f = 1MHz
800
CISS
600
COSS
400
CRSS
200
0
0.1
1
10
-VDS - Drain - Source Voltage (V)
100
-VGS Gate-Source Voltage (V)
10
1000
ID = -2.1A
8
6
4
2
VDS = -50V
0
0
2
4
6
8
10
12
14
16
18
Q - Charge (nC)
Gate-Source Voltage v Gate Charge
Capacitance v Drain-Source Voltage
Test Circuits
Current
regulator
QG
12V
VG
QGS
50k
0.2␮F
Same as
D.U.T
QGD
VDS
IG
D.U.T
ID
VGS
Charge
Gate charge test circuit
Basic gate charge waveform
VDS
90%
RD
VGS
VDS
RG
VDD
10%
VGS
tr
td(off)
t(on)
tr
Pulse width ⬍ 1␮S
Duty factor 0.1%
td(on)
t(on)
Switching time waveforms
Switching time test circuit
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Package Outline Dimensions
0.254
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
h
7°~9°
45°
Detail ‘A’
A2 A A3
b
e
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0
8

All Dimensions in mm
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
C1
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
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