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DT1140-04LP ADVANCE INFORMATIO 4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY Features Mechanical Data Clamping Voltage:9V at 10A 100ns TLP; 9V at 6A 8μs/20μs IEC 61000-4-2 (ESD): Air – +20/-18kV, Contact – +20/-16kV IEC 61000-4-5 (Lightning): ±6A (8/20µs) 4 Channels of ESD protection Moisture Sensitivity: Level 1 per J-STD-020 Low Channel Input Capacitance of 0.5pF Typical TLP Dynamic Resistance: 0.25Ω Terminals: NiPdAu over Copper leadframe (Lead Free Plating) Solderable per MIL-STD-202, Method 208 e4 Typically Used for High Speed Ports such as USB 2.0, DVI, Weight: 0.038 grams (approximate) Case: U-DFN2510-10 Case Material: Molded Plastic, “Green” Molding Compound UL Flammability Classification Rating 94V-0 HDMI, Ethernet Port, IEEE,MDDI,PCI Express ,SATA/ eSATA Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Pin # 1, 2, 4, 5 6, 7, 9, 10 3, 8 10 Description I/O No Connection Vss 9 8 7 6 Pin 1 1 2 3 4 Pin 2 Pin 5 Pin 4 5 3,8 Pin Description (Top View) Device Schematic Ordering Information (Note 4) Product DT1140-04LP-7 Notes: Compliance Standard Marking BC2 Reel Size (inches) 7 Tape Width (mm) 8 Quantity per Reel 3,000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information BC2 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: A = 2013) M = Month (ex: 9 = September) TF2 YM BC2 Date Code Key Year Code Month Code 2013 A Jan 1 2014 B Feb 2 Mar 3 2015 C Apr 4 May 5 2016 D Jun 6 Jul 7 2017 E Aug 8 Sep 9 2018 F Oct O www.BDTIC.com/DIODES DT1140-04LP Document number: DS36293 Rev. 2 - 2 1 of 5 www.diodes.com Nov N Dec D September 2013 © Diodes Incorporated DT1140-04LP Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit IPP 6 A I/O to VSS, 8/20µs Peak Pulse Power, per IEC 61000-4-5 PPP 60 W I/O to VSS, 8/20µs Operating Voltage (DC) VDC 6 V I/O to VSS VESD_Contact +20/-16 kV I/O to VSS VESD_Air +20/-18 kV I/O to VSS Operating Temperature TOP -55 to +85 ºC — Storage Temperature TSTG -55 to +150 °C — Peak Pulse Current, per IEC 61000-4-5 ADVANCE INFORMATIO ESD Protection – Contact Discharge, per IEC 61000-4-2 ESD Protection – Air Discharge, per IEC 61000-4-2 Conditions Thermal Characteristics Characteristic Symbol Value Unit PD 350 mW RJA 360 °C/W Power Dissipation Typical(Note 5) Thermal Resistance, Junction to Ambient Typical(Note 5) Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Reverse Working Voltage Reverse Current (Note 6) Reverse Breakdown Voltage Forward Clamping Voltage Holding Voltage Reverse Clamping Voltage (Note 7) Reverse Clamping Voltage (Note 7) Trigger Voltage ESD Clamping Voltage Dynamic Reverse Resistance Dynamic Forward Resistance Channel Input Capacitance Notes: Symbol VRWM IR VBR VF VH VC VC VTRIG VESD RDIF-R RDIF-F CI/O Min — — 6 -1.0 5.5 — — — — — — — Typ — — — -0.85 — 6.4 9 — 9 0.25 0.25 0.5 Max 5.5 0.5 — — — — 10 9.5 — — — 0.65 Unit V μA V V V V V V V Ω Ω pF Test Conditions IR=1mA, , I/O to VSS VR = 5V, I/O to VSS IR = 1mA, I/O to VSS IF = -15mA, I/O to VSS — IPP = 1A, I/O to VSS, 8/20µs IPP = 6A, I/O to VSS, 8/20µs — TLP, 10A, tp = 100 ns, I/O to VSS TLP, 10A, tp = 100 ns, I/O to VSS TLP, 10A, tp = 100 ns, VSS to I/O VI/O = 2.5V, VSS = 0V, f = 1MHz 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com. 6. Short duration pulse test used to minimize self-heating effect. 7. Clamping voltage value is based on an 8x20µs peak pulse current (Ipp) waveform. www.BDTIC.com/DIODES DT1140-04LP Document number: DS36293 Rev. 2 - 2 2 of 5 www.diodes.com September 2013 © Diodes Incorporated DT1140-04LP 9.5 BREAKDOWN VOLTAGE, TRIGGER VOLTAGE, HOLDING VOLTAGE (V) PEAK PUSLE DERATING IN % OF PEAK POWER OR CURRENT 75 50 25 0 0 25 50 75 100 125 150 175 TA, AMBIENT TEMPERATURE(°C) Figure 1 Pulse Derating Curve 200 9.0 VTRIG 8.5 8.0 7.5 7.0 VH 6.5 BV 6.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 TA, AMBIENT TEMPERATURE(°C) Figure 2 BV, Trigger Voltage, Holding Voltage vs. Ambient Temperature 4.0 VC , CLAMPING VOLTAGE (V) VF, FOWARD VOLTAGE (V) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 1 2 3 4 5 6 CURRENT FROM I/O TO VSS (A) Figure 3 Clamping Voltage Characteristic 0.0 1 7 10 1.0 9 0.9 8 CI/O, INPUT CAPACITANCE (pF) CLAMPING VOLTAGE, CURRENT (V, A) ADVANCE INFORMATIO 100 Voltage 7 6 5 4 3 Ampere 2 0.8 2 3 4 5 6 CURRENT FROM I/O TO VSS (A) Figure 4 Forward Voltage Characteristic 7 I/O to VSS, f = 1MHz 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1 0 -40 -30 -20 -10 0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VI/O, INPUT VOLTAGE (V) Figure 6 Input Capacitance vs. Input Voltage 10 20 30 40 50 60 70 80 TIME (µs) Figure 5 Waveform of Clamping Voltage, Current vs. Time (8/20µs, I/O to VSS) www.BDTIC.com/DIODES DT1140-04LP Document number: DS36293 Rev. 2 - 2 3 of 5 www.diodes.com September 2013 © Diodes Incorporated DT1140-04LP 10 CURRENT FROM I/O TO VSS (A) 8 7 6 5 4 3 2 1 0 0 2 4 6 8 VOLTAGE FROM I/O TO VSS (V) Figure 7 Current vs. Voltage 10 Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 3 A 1 A A e n a l P g n i t a e S 1 D b 5 7 0 . 0 R E L U-DFN2510-10 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.03 A3 0.13 b 0.15 0.25 0.20 b1 0.35 0.45 0.40 D 2.450 2.575 2.500 e 0.50 E 0.950 1.075 1.000 L 0.325 0.425 0.375 Z 0.150 All Dimensions in mm Z b e 5 2 1 . 0 R ADVANCE INFORMATIO 9 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 2 X X 1 X Dimensions Y 1 Y 3 Y 2 Y C C X X1 X2 Y Y1 Y2 Y3 Value (in mm) 0.500 0.250 0.450 2.250 0.625 0.575 0.700 1.400 www.BDTIC.com/DIODES DT1140-04LP Document number: DS36293 Rev. 2 - 2 4 of 5 www.diodes.com September 2013 © Diodes Incorporated DT1140-04LP IMPORTANT NOTICE ADVANCE INFORMATIO DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com www.BDTIC.com/DIODES DT1140-04LP Document number: DS36293 Rev. 2 - 2 5 of 5 www.diodes.com September 2013 © Diodes Incorporated