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Download 4-Channel, 1 MSPS, 12-Bit ADC with Sequencer in 16-Lead TSSOP AD7924-KGD
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Known Good Die 4-Channel, 1 MSPS, 12-Bit ADC with Sequencer in 16-Lead TSSOP AD7924-KGD FEATURES FUNCTIONAL BLOCK DIAGRAM AV DD REFIN VIN0 T/H I/P MUX VIN2 VIN3 SCLK DOUT SEQUENCER The conversion process and data acquisition are controlled using CS and the serial clock signal, allowing the device to easily interface with microprocessors or DSPs. The input signal is sampled on the falling edge of CS and conversion is initiated at this point. There are no pipeline delays associated with the part. The AD7924-KGD uses advanced design techniques to achieve very low power dissipation at maximum throughput rates. At maximum throughput rates, the AD7924-KGD consumes 2 mA maximum with 3 V supplies; with 5 V supplies, the current consumption is 2.7 mA maximum. Through the configuration of the control register, the analog input range for the part can be selected as 0 V to REFIN or 0 V to 2 × REFIN, with either straight binary or twos complement output coding. The AD7924-KGD features four single-ended analog inputs with a channel sequencer to allow a preprogrammed selection of channels to be converted sequentially. The conversion time for the AD7924-KGD is determined by the SCLK frequency, which is also used as the master clock to control the conversion. CONTROL LOGIC DIN CS AD7924-KGD VDRIVE AGND GENERAL DESCRIPTION The AD7924-KGD is a 12-bit, high speed, low power, 4-channel successive approximation ADCs. The parts operate from a single 2.7 V to 5.25 V power supply and feature throughput rates up to 1 MSPS. The part contains a low noise, wide bandwidth track-andhold amplifier that can handle input frequencies in excess of 8 MHz. 12-BIT SUCCESSIVE APPROXIMATION ADC VIN1 10106-001 Fast throughput rate: 1 MSPS Specified for AVDD of 2.7 V to 5.25 V Low power 6 mW maximum at 1 MSPS with 3 V supplies 13.5 mW maximum at 1 MSPS with 5 V supplies 4 single-ended inputs with sequencer Wide input bandwidth: 70 dB SNR at 50 kHz input frequency Flexible power/serial clock speed management No pipeline delays High speed serial interface: SPI/QSPI™/MICROWIRE™/DSP compatible Shutdown mode: 0.5 μA maximum 16-lead TSSOP package Qualified for automotive applications Known good die (KGD): these die are fully guaranteed to data sheet specifications. Figure 1. PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. High Throughput with Low Power Consumption. The AD7924-KGD offers throughput rates up to 1 MSPS. At the maximum throughput rate with 3 V supplies, the AD7924-KGD dissipates only 6 mW of power maximum. Four Single-Ended Inputs with Channel Sequencer. A consecutive sequence of channels can be selected, through which the ADC will cycle and convert on. Single-Supply Operation with VDRIVE Function. The AD7924-KGD operates from a single 2.7 V to 5.25 V supply. The VDRIVE function allows the serial interface to connect directly to 3 V or 5 V processor systems, independent of VDD. Flexible Power/Serial Clock Speed Management. The conversion rate is determined by the serial clock, allowing the conversion time to be reduced by increasing the serial clock speed. The part also features two shutdown modes to maximize power efficiency at lower throughput rates. Current consumption is 0.5 μA maximum when in full shutdown. No Pipeline Delay. The part features a standard successive approximation ADC with accurate control of the sampling instant via the CS input and once-off conversion control. Additional application and technical information can be found in the AD7924 data sheet. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. www.BDTIC.com/ADI/ One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved. AD7924-KGD Known Good Die TABLE OF CONTENTS Features .............................................................................................. 1 Absolute Maximum Ratings ............................................................6 General Description ......................................................................... 1 ESD Caution...................................................................................6 Functional Block Diagram .............................................................. 1 Pad Configuration and Function Descriptions .............................7 Product Highlights ........................................................................... 1 Outline Dimensions ..........................................................................8 Revision History ............................................................................... 2 Die Specifications and Assembly Recommendations ..............8 Specifications..................................................................................... 3 Ordering Guide .............................................................................8 Timing Specifications .................................................................. 5 REVISION HISTORY 10/11—Revision 0: Initial Version www.BDTIC.com/ADI/ Rev. 0 | Page 2 of 8 Known Good Die AD7924-KGD SPECIFICATIONS AVDD = VDRIVE = 2.7 V to 5.25 V, REFIN = 2.5 V, fSCLK = 20 MHz, TA = TMIN to TMAX, unless otherwise noted. Temperature range is −40°C to +85°C. Table 1. Parameter DYNAMIC PERFORMANCE Signal-to-(Noise + Distortion), SINAD Signal-to-Noise Ratio, SNR Total Harmonic Distortion, THD Min Positive Gain Error Positive Gain Error Match Zero Code Error Zero Code Error Match Negative Gain Error Negative Gain Error Match ANALOG INPUT Input Voltage Range DC Leakage Current Input Capacitance REFERENCE INPUT REFIN Input Voltage DC Leakage Current REFIN Input Impedance LOGIC INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IIN Input Capacitance, CIN1 Max Unit −77 −73 −78 dB dB dB dB dB dB 70 69 70 Peak Harmonic or Spurious Noise, SFDR Intermodulation Distortion, IMD Second-Order Terms Third-Order Terms Aperture Delay Aperture Jitter Channel-to-Channel Isolation Full Power Bandwidth DC ACCURACY Resolution Integral Nonlinearity, INL Differential Nonlinearity, DNL 0 V to REFIN Input Range Offset Error Offset Error Match Gain Error Gain Error Match 0 V to 2 × REFIN Input Range Typ −90 −90 10 50 −85 8.2 1.6 dB dB ns ps dB MHz MHz 12 ±1 −0.9/+1.5 Bits LSB LSB ±8 ±0.5 ±1.5 ±0.5 LSB LSB LSB LSB Test Conditions/Comments fIN = 50 kHz sine wave, fSCLK = 20 MHz @5V @ 3 V, typically 69.5 dB @ 5 V, typically −84 dB @ 3 V, typically −77 dB @ 5 V, typically −86 dB fa = 40.1 kHz, fb = 41.5 kHz fIN = 400 kHz @ 3 dB @ 0.1 dB Guaranteed no missed codes to 12 bits Straight binary output coding Typically ±0.5 LSB −REFIN to +REFIN biased about REFIN with twos complement output coding 0 0 ±1.5 ±0.5 ±8 ±0.5 ±1 ±0.5 LSB LSB LSB LSB LSB LSB REFIN 2 × REFIN ±1 V V μA pF RANGE bit set to 1 RANGE bit set to 0, AVDD/VDRIVE = 4.75 V to 5.25 V V μA kΩ ±1% specified performance 20 2.5 ±1 36 0.7 × VDRIVE 0.3 × VDRIVE ±1 10 V V μA pF Typically ±0.8 LSB fSAMPLE = 1 MSPS Typically 10 nA, VIN = 0 V or VDRIVE www.BDTIC.com/ADI/ Rev. 0 | Page 3 of 8 AD7924-KGD Known Good Die Parameter LOGIC OUTPUTS Output High Voltage, VOH Output Low Voltage, VOL Floating-State Leakage Current Floating-State Output Capacitance1 Output Coding Min Typ VDRIVE − 0.2 0.4 ±1 10 Straight (natural) binary Twos complement CONVERSION RATE Conversion Time Track-and-Hold Acquisition Time Throughput Rate POWER REQUIREMENTS VDD VDRIVE IDD Normal Mode (Static) Normal Mode (Operational) Auto Shutdown Mode Full Shutdown Mode Power Dissipation Normal Mode (Operational) Auto Shutdown Mode (Static) Full Shutdown Mode 1 Max 2.7 2.7 Unit Test Conditions/Comments V V μA pF ISOURCE = 200 μA, AVDD = 2.7 V to 5.25 V ISINK = 200 μA CODING bit set to 1 CODING bit set to 0 800 300 300 1 ns ns ns MSPS 5.25 5.25 V V 16 SCLK cycles with SCLK at 20 MHz Sine wave input Full-scale step input 0.5 0.5 μA mA mA μA μA μA Digital inputs = 0 V or VDRIVE AVDD = 2.7 V to 5.25 V, SCLK on or off AVDD = 4.75 V to 5.25 V, fSCLK = 20 MHz AVDD = 2.7 V to 3.6 V, fSCLK = 20 MHz fSAMPLE = 250 kSPS Static SCLK on or off (20 nA typ) 13.5 6 2.5 1.5 2.5 1.5 mW mW μW μW μW μW AVDD = 5 V, fSCLK = 20 MHz AVDD = 3 V, fSCLK = 20 MHz AVDD = 5 V AVDD = 3 V AVDD = 5 V AVDD = 3 V 600 2.7 2 960 Sample tested @ 25°C to ensure compliance. www.BDTIC.com/ADI/ Rev. 0 | Page 4 of 8 Known Good Die AD7924-KGD TIMING SPECIFICATIONS AVDD = 2.7 V to 5.25 V, VDRIVE ≤ AVDD, REFIN = 2.5 V, TA = TMIN to TMAX, unless otherwise noted. Table 2. Parameter 1 fSCLK 2 tCONVERT tQUIET AVDD = 3 V 10 20 16 × tSCLK 50 t2 t3 3 t43 t5 t6 t7 t8 4 t9 t10 t11 t12 10 35 40 0.4 × tSCLK 0.4 × tSCLK 10 15/45 10 5 20 1 Limit at TMIN, TMAX AVDD = 5 V 10 20 16 × tSCLK 50 10 30 40 0.4 × tSCLK 0.4 × tSCLK 10 15/35 10 5 20 1 Unit kHz min MHz max Description ns min Minimum quiet time required between the CS rising edge and the start of the next conversion CS to SCLK setup time Delay from CS until DOUT three-state disabled Data access time after SCLK falling edge SCLK low pulse width SCLK high pulse width SCLK to DOUT valid hold time SCLK falling edge to DOUT high impedance DIN setup time prior to SCLK falling edge DIN hold time after SCLK falling edge 16th SCLK falling edge to CS high Power-up time from full shutdown/auto shutdown modes ns min ns max ns max ns min ns min ns min ns min/ns max ns min ns min ns min μs max 1 Sample tested @ 25°C to ensure compliance. All input signals are specified with tR = tF = 5 ns (10% to 90% of AVDD) and timed from a voltage level of 1.6 V (see Figure 2). The 3 V operating range spans from 2.7 V to 3.6 V. The 5 V operating range spans from 4.75 V to 5.25 V. 2 Mark/space ratio for the SCLK input is 40/60 to 60/40. 3 Measured with the load circuit of Figure 2 and defined as the time required for the output to cross 0.4 V or 0.7 × VDRIVE. 4 t8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 2. The measured number is then extrapolated back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t8, quoted in the timing characteristics is the true bus relinquish time of the part and is independent of the bus loading. 200µA 1.6V CL 50pF 200µA IOH 10106-002 TO OUTPUT PIN IOL Figure 2. Load Circuit for Digital Output Timing Specifications www.BDTIC.com/ADI/ Rev. 0 | Page 5 of 8 AD7924-KGD Known Good Die ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 3. Parameter AVDD to AGND VDRIVE to AGND Analog Input Voltage to AGND Digital Input Voltage to AGND Digital Output Voltage to AGND REFIN to AGND Input Current to Any Pin Except Supplies1 Operating Temperature Range Storage Temperature Range Junction Temperature Lead Temperature, Soldering Vapor Phase (60 secs) Infrared (15 secs) ESD 1 Rating −0.3 V to +7 V −0.3 V to AVDD + 0.3 V −0.3 V to AVDD + 0.3 V −0.3 V to +7 V −0.3 V to AVDD + 0.3 V −0.3 V to AVDD + 0.3 V ±10 mA Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION −40°C to +85°C −65°C to +150°C 150°C 215°C 220°C 1.5 kV Transient currents of up to 100 mA do not cause SCR latch-up. www.BDTIC.com/ADI/ Rev. 0 | Page 6 of 8 Known Good Die AD7924-KGD PAD CONFIGURATION AND FUNCTION DESCRIPTIONS 23 24 1 22 21 2 3 20 4 19 5 18 6 17 16 7 9 10 11 12 13 14 15 10106-003 8 Figure 3. Pad Configuration Table 4. Pad Function Descriptions Pad No. 1 2 3 4A 4B 5 6 7A 7B 8 9 10 11 12 13 14 15 16 17 18 19A 19B 20 21 22 23 24A 24B X-Axis (μm) −580.3 −815.4 −815.4 −850.85 −850.85 −854.15 −854.4 −850.45 −850.45 −854.2 −854.2 −712.45 −458.95 −108.95 +200.85 +550.85 +916.2 +916.2 +916.2 +916.2 880.85 880.85 896.05 865.35 865.35 725.35 −191 −291 Y-Axis (μm) +965.95 +932.75 +677.6 +416 +316 +50.35 −258.7 −546 −646 −877.9 −1070.1 −1070.1 −1054.1 −1054.1 −1054.1 −1054.1 −1021.15 −671.15 −510.75 −160.75 144 244 537.15 885.8 1025.8 1025.8 +997.4 +997.4 Mnemonic SCLK DIN CS AGND AGND AVDD AVDD VREF VREF NC AGND AGND NC NC NC NC VIN3 VIN2 VIN1 VIN0 AGND AGND DOUT VDRIVE VDRIVE NC AGND AGND Pad Type Single Single Single Double Double Double Double Double Double Single Single Single Single Single Single Single Single Single Single Single Double Double Single Single Single Single Double Double Description Serial Clock Data In, Logic Input. Chip Select. Analog Ground. Analog Ground. Analog Power Supply Input. Analog Power Supply Input. Reference Input. Reference Input. No Connect. Do not connect to this pin. Analog Ground. Analog Ground. No Connect. Do not connect to this pin. No Connect. Do not connect to this pin. No Connect. Do not connect to this pin. No Connect. Do not connect to this pin. Analog Input 0. Analog Input 1. Analog Input 2. Analog Input 3. Analog Ground. Analog Ground. Data Output. Logic Power Supply Input. Logic Power Supply Input. No Connect. Do not connect to this pin. Analog Ground. Analog Ground. www.BDTIC.com/ADI/ Rev. 0 | Page 7 of 8 AD7924-KGD Known Good Die OUTLINE DIMENSIONS 0.500 2.300 23 24 1 22 21 2 3 20 4 19 2.620 5 18 6 17 16 7 8 10 11 12 13 14 15 TOP VIEW (CIRCUIT SIDE) SIDE VIEW 0.092 × 0.092 09-12-2011-A 9 Figure 4. 24-Pad Bare Die [CHIP] (C-24-1) Dimensions shown in millimeters DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Chip Size Scribe Line Width Die Size Thickness Backside Passivation Bond Pads (Minimum) Bond Pad Composition ESD Value 2180 (x) × 2450 (y) 120 (x) × 170 (y) 2300 (x) × 2620 (y) 500 Silicon Nitride 92 × 92 98.5% Al, 1% Si, 0.5% Cu 1.5 Unit μm μm μm μm Not applicable Not applicable μm % kV Table 6. Assembly Recommendations Assembly Component Die Attach Bonding Method Bonding Sequence Recommendation No special recommendations Gold ball or aluminum wedge 9 and 10 ORDERING GUIDE Model AD7924-KGD-DF Temperature Range −40°C to +85°C Package Description 24-Pad Bare Die [CHIP] ©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10106-0-10/11(0) Package Option C-24-1 www.BDTIC.com/ADI/ Rev. 0 | Page 8 of 8