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EMIF07-LCD03F3 7-line IPAD™, EMI filter and ESD protection Features ■ High attenuation in the mobile frequency range (typically better than -40 dB from 900 MHz to 2 GHz) ■ Very low clamping voltage ■ Low line capacitance (30 pF max) suitable for high-speed interfaces ■ Maximum rise and fall time: 6 ns (10% - 90%) ■ Compliant with high speed data rate Description ■ Lead-free Flip-Chip package in 400 µm pitch ■ Very thin package: 0.6 mm thickness The EMIF07-LCD03F3 is a 7-line highly integrated L/C filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. Benefits ■ High efficiency in EMI filtering ■ High bandwidth: typically 200 MHz at -3 dB ■ 80% space saving versus discrete solution (BOM reduction) ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Flip Chip (18 bumps) The EMIF07-LCD03F3 Flip-Chip packaging means the package size is equal to the die size. This LC filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up ±15 kV. Figure 1. Pin layout (bump side) Figure 2. Device configuration Complies with the following standards ■ IEC 61000-4-2 level 4 on inputs and outputs: – 15 kV (air discharge) – 8 kV (contact discharge) Applications Displays and cameras where EMI filtering in ESD sensitive equipment is required: ■ Mobile phones and PDAs ■ Personal and home entertainment (portable Audio, DVD players, LCD TVs) ■ Portable navigation devices ■ Digital still cameras ■ Portable gaming systems TM: IPAD is a trademark of STMicroelectronics. December 2008 Rev 1 1/7 www.st.com www.bdtic.com/ST 7 Characteristics 1 EMIF07-LCD03F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter and test conditions Value Unit Vpp Input and output pins: ESD discharge IEC 610000-4-2, air discharge ESD discharge IEC 610000-4-2, contact discharge ±15 ±15 kV Maximum junction temperature 125 °C Tj Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to 150 °C Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameters VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage RI/O Series resistance between input and output Cline Line capacitance Symbol Figure 3. 0 Test conditions Min VBR IR = 1 mA IRM VRM = 3 V per line RI/O Tolerance ± 20% Cline Vline = 0 V, VOSC = 30 mV, F =1 MHz Typ Max 14 Attenuation versus frequency (all GND bumps connected) S21 (dB) 100 Figure 4. 0 -5 V 125 200 nA 150 Ω 30 pF Analog cross talk versus frequency (all GND bumps connected) XTalk (dB) -10 -10 -20 -15 -20 -30 -25 -40 -30 -50 -35 -60 -40 -70 -45 -50 -80 F (Hz) -55 -60 100k 1M I1- O1 I3- O3 I5- O5 I7 - O7 10M -90 100M I2-O2 I4-O4 I6 - O6 1G Unit -100 F (Hz) -110 100k 1M 10M I1- O2 2/7 www.bdtic.com/ST 100M I1- O7 1G EMIF07-LCD03F3 Characteristics Figure 5. ESD response under IEC61000-4-2 conditions, VPP = +15 kV air discharge Figure 6. Figure 7. Line capacitance versus applied voltage ESD response under IEC61000-4-2 conditions, VPP = -15 kV air discharge Cline (pF) 30.00 F=1 MHz VOSC = 30 mVRMS TJ = 25° C 25.00 20.00 15.00 10.00 5.00 Vline (V) 0.00 0 Figure 8. 1 Typical rise and fall time: input voltage 2 3 Figure 9. 4 5 Typical rise and fall time: output voltage INPUT VOLTAGE X: 10 ns/DIV Y: 1 V/DIV trise 10% -90% = 3.34 ns tfall 90%-10% = 3.65 ns OUTPUT VOLTAGE X: 10ns/DIV Y: 1V/DIV trise 10% -90% = 3.45 ns tfall 90%-10% = 4.09 ns 3/7 www.bdtic.com/ST Ordering information scheme 2 EMIF07-LCD03F3 Ordering information scheme Figure 10. Ordering information scheme EMIF yy - xxx zz F3 EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip 3 = Lead-free, pitch = 400 µm, bump = 255 µm 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Package dimensions 4/7 www.bdtic.com/ST EMIF07-LCD03F3 Ordering information Figure 12. Footprint Figure 13. Marking Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 3.5 ± 0.1 1.71 xxz yww ST E 4 ± 0.1 User direction of unreeling All dimensions in mm Note: 2.08 xxz yww ST E xxz yww ST E 8 ± 0.3 0.69 ± 0.05 More information is available in the application notes: AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and recommendation for use” AN1751: “EMI filters: Recommendations and measurements” 4 Ordering information Table 3. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF07-LCD03F3 HW Flip Chip 4 mg 5000 Tape and reel 7” 5/7 www.bdtic.com/ST Revision history 5 EMIF07-LCD03F3 Revision history Table 4. Document revision history Date Revision 05-Dec-08 1 Changes Initial release. 6/7 www.bdtic.com/ST EMIF07-LCD03F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 www.bdtic.com/ST