Download EMIF07-LCD03F3

EMIF07-LCD03F3
7-line IPAD™, EMI filter and ESD protection
Features
■
High attenuation in the mobile frequency range
(typically better than -40 dB from 900 MHz to
2 GHz)
■
Very low clamping voltage
■
Low line capacitance (30 pF max) suitable for
high-speed interfaces
■
Maximum rise and fall time: 6 ns (10% - 90%)
■
Compliant with high speed data rate
Description
■
Lead-free Flip-Chip package in 400 µm pitch
■
Very thin package: 0.6 mm thickness
The EMIF07-LCD03F3 is a 7-line highly
integrated L/C filter designed to suppress
EMI/RFI noise in all systems subjected to
electromagnetic interference.
Benefits
■
High efficiency in EMI filtering
■
High bandwidth: typically 200 MHz at -3 dB
■
80% space saving versus discrete solution
(BOM reduction)
■
High reliability offered by monolithic integration
■
High reduction of parasitic elements through
integration and wafer level packaging
Flip Chip
(18 bumps)
The EMIF07-LCD03F3 Flip-Chip packaging
means the package size is equal to the die size.
This LC filter includes ESD protection circuitry,
which prevents damage to the protected device
when subjected to ESD surges up ±15 kV.
Figure 1.
Pin layout (bump side)
Figure 2.
Device configuration
Complies with the following standards
■
IEC 61000-4-2 level 4 on inputs and outputs:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Displays and cameras where EMI filtering in ESD
sensitive equipment is required:
■
Mobile phones and PDAs
■
Personal and home entertainment (portable
Audio, DVD players, LCD TVs)
■
Portable navigation devices
■
Digital still cameras
■
Portable gaming systems
TM: IPAD is a trademark of STMicroelectronics.
December 2008
Rev 1
1/7
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www.bdtic.com/ST
7
Characteristics
1
EMIF07-LCD03F3
Characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter and test conditions
Value
Unit
Vpp
Input and output pins:
ESD discharge IEC 610000-4-2, air discharge
ESD discharge IEC 610000-4-2, contact discharge
±15
±15
kV
Maximum junction temperature
125
°C
Tj
Top
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to 150
°C
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
Parameters
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
RI/O
Series resistance between input and output
Cline
Line capacitance
Symbol
Figure 3.
0
Test conditions
Min
VBR
IR = 1 mA
IRM
VRM = 3 V per line
RI/O
Tolerance ± 20%
Cline
Vline = 0 V, VOSC = 30 mV, F =1 MHz
Typ
Max
14
Attenuation versus frequency (all
GND bumps connected)
S21 (dB)
100
Figure 4.
0
-5
V
125
200
nA
150
Ω
30
pF
Analog cross talk versus frequency
(all GND bumps connected)
XTalk (dB)
-10
-10
-20
-15
-20
-30
-25
-40
-30
-50
-35
-60
-40
-70
-45
-50
-80
F (Hz)
-55
-60
100k
1M
I1- O1
I3- O3
I5- O5
I7 - O7
10M
-90
100M
I2-O2
I4-O4
I6 - O6
1G
Unit
-100
F (Hz)
-110
100k
1M
10M
I1- O2
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100M
I1- O7
1G
EMIF07-LCD03F3
Characteristics
Figure 5.
ESD response under IEC61000-4-2
conditions, VPP = +15 kV air
discharge
Figure 6.
Figure 7.
Line capacitance versus applied voltage
ESD response under IEC61000-4-2
conditions, VPP = -15 kV air
discharge
Cline (pF)
30.00
F=1 MHz
VOSC = 30 mVRMS
TJ = 25° C
25.00
20.00
15.00
10.00
5.00
Vline (V)
0.00
0
Figure 8.
1
Typical rise and fall time: input
voltage
2
3
Figure 9.
4
5
Typical rise and fall time: output
voltage
INPUT VOLTAGE
X: 10 ns/DIV
Y: 1 V/DIV
trise 10% -90% = 3.34 ns
tfall 90%-10% = 3.65 ns
OUTPUT VOLTAGE
X: 10ns/DIV
Y: 1V/DIV
trise 10% -90% = 3.45 ns
tfall 90%-10% = 4.09 ns
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Ordering information scheme
2
EMIF07-LCD03F3
Ordering information scheme
Figure 10. Ordering information scheme
EMIF
yy
-
xxx zz
F3
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
3 = Lead-free, pitch = 400 µm, bump = 255 µm
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Package dimensions
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EMIF07-LCD03F3
Ordering information
Figure 12. Footprint
Figure 13. Marking
Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location
1.75 ± 0.1
Ø 1.5 ± 0.1
4 ± 0.1
3.5 ± 0.1
1.71
xxz
yww
ST E
4 ± 0.1
User direction of unreeling
All dimensions in mm
Note:
2.08
xxz
yww
ST E
xxz
yww
ST E
8 ± 0.3
0.69 ± 0.05
More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: “EMI filters: Recommendations and measurements”
4
Ordering information
Table 3.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF07-LCD03F3
HW
Flip Chip
4 mg
5000
Tape and reel 7”
5/7
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Revision history
5
EMIF07-LCD03F3
Revision history
Table 4.
Document revision history
Date
Revision
05-Dec-08
1
Changes
Initial release.
6/7
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EMIF07-LCD03F3
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