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Stato del progetto RICH di
LHCb
CSN1
Assisi, 22 settembre 2004
M.Sannino
CSN1 Assisi 22/09/2004
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Rivelatori RICH di LHCb
Identificazione delle particelle su intervallo 1 – 100 GeV/c
mediante 2 rivelatori RICH
RICH1:
riprogettazione
completa come da nuovo TDR
LHcb light
EDR presentato il 31/8 u.s.
RICH2:
SOVRASTRUTTURA
Essenzialmente come da TDR
originario dei Rich
INSTALLAZIONE DEI
FOTORIVELATORI
modificata
M.Sannino
Causata da :
richieste per miglioramento
livello trigger L1
(  B  d = 0.15 Tm
nella regione di “tracking”)
Riduzione materiale nella
accettanza dello Spettrometro
Sovrastruttura costruita
Finestre di ingresso e uscita
installate
Photon Funnel installati
Specchi in Vetro (Pyrex /
Simax) in corso di
fabbricazione
Beam Pipe installata
CSN1 Assisi 22/09/2004
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LHCb RICH system in cavern
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CSN1 Assisi 22/09/2004
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Impegni italiani nei RICH
Genova : Rich2
 alloggiamento fotorivelatori
(inclusa trasmissione segnali a L0 e raffreddamento
design e componenti in parte utilizzati anche per Rich1)
 ECS Alte Tensioni
Milano:

Rich1

Aerogel e relativi telai per l’installazione

Rich2

schermo magnetico
consegna al CERN ottobre 2004

ottica (test, allineamento)

schede distribuzione alta e bassa tensione
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CSN1 Assisi 22/09/2004
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Overview of RICH1 – Changes since
RICH TDR
1. Addition of Plane Mirrors to allow HPDs to be located
where iron shields can be used
2. Vertical optical layout to allow shields to act as pole
pieces
for Level-1 trigger field
3. Reduction of material in LHCb acceptance
Beryllium spherical mirrors
Mirror supports outside acceptance
Eliminate entrance window by sealing to VELO tank
TDR: 14% X0
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 Now: 7.3% X0
CSN1 Assisi 22/09/2004
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RICH1 Mechanical Design - Overview
Magnetic shields
(each ~8 tonnes of “Armco”
iron)
7x14 HPD arrays
Beryllium
spherical mirrors
Quartz windows
Exit window
seals to
beampipe
Seal directly to the
VELO exit window
Glass secondary plane mirrors (outside the acceptance)
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CSN1 Assisi 22/09/2004
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Rich1 Magnetic shield performance
The addition of iron blocks
close to the magnet allows
field to be channelled to the
upstream wall of the shield
where it increases the field
required by the trigger
target
Max Field at HPD Plane
25G
Integral Field to 250cm 150kGcm
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CSN1 Assisi 22/09/2004
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Rich1 Beryllium Mirrors –Design and FEA
The mirrors and a support
structure on one edge can
be cut from a single
piece of beryllium.
Support
A full-sized mirror segment has now been ordered from Kompozit (Russia).
The use of beryllium mirrors (along with the beam-pipe) has safety implications
for LHCb which are regulated by CERN safety instruction IS No. 25
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CSN1 Assisi 22/09/2004
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Rich1 Plane Glass Mirrors 370mm x 387mm
The 16 plane glass mirrors use
the same technology as
RICH2 plane mirrors
.
Plane mirrors
Outside tracker
acceptance
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CSN1 Assisi 22/09/2004
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Rich1 HPD assembly
Common design with RICH2
HPD + Mumetal + ZIF connector
RICH2 assembly
accommodated in
RICH1
shield box
Cooling: C6F12 system
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CSN1 Assisi 22/09/2004
1.5kW per box !!
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Rich1 Aerogel
In October 2003 aerogel samples were
exposed in a 10Gev/C  beam and the
Cherenkov rings measured using 3HPDs.
The results shown here are for a tile
with:Thickness
= 4.4cm
Refractive Index = 1.0280
Clarity(C) = 0.0052 m4/c
A
= 86%
Weight = 60.6g
Measurement of ring segments on the
3 HPDs shows that ~13 photoelectrons per ring would be detected
(at 100% acceptance). This is better
performance than assumed in the TDR.
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CSN1 Assisi 22/09/2004
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Rich1 Aerogel
APACHE
Aerogel Photographic Analysis by CHerenkov Effect
or how to measure n homogeneity inside a tile
The sample is exposed to a 500 MeV electron beam at the
BTF in Frascati. The Cherenkov photons are collected on a photographic film.
The film is then developed and scanned for the analysis, which consists in retracking
the hits from the film to the beam axis via the mirror.
For each run, the peak value of the Cherenkov angle distribution is plotted.
The vessel
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Result for the measured tile:
within specs
σn = 1.14 mrad ( spec. < 1.17 mrad)
CSN1 Assisi 22/09/2004
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Rich1 Aerogel
 Preseries production :
6 liters in 3 tiles 20x20x5 cm3
delivered end June ’04
refractive index: 1.0305, 1.0309,
1.0316,
clarity
: 0.0054, 0.0056,
0.0062 m
 Final contract in preparation (2 preserie tiles
can be regarded as final )
 20 l should be produced by end 2004beginning 2005
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CSN1 Assisi 22/09/2004
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Rich2 Status
Superstructure
Almost completely assembled
•Entrance Window installed
•Exit Window installed
•Side walls and top covers installed
•Photon Funnels installed
•Spherical Mirrors Plates installed
•Beam Pipe just installed last week
•Quartz Windows installed
Still to be done
•A complete gas leak test is going to be performed
•After that the magnetic shielding will be installed followed by the
• optical setup
•In the period mid-December mid-March 2005 all the mirrors
• (spherical and flat) will be installed
•Rich2 foreseen to be ready for transport to the pit on 20/04/2005
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CSN1 Assisi 22/09/2004
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Rich2 Mounted Superstructure with Windows, Side Walls and Photon Funnels
Photon Funnel
Entrance Window
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CSN1 Assisi 22/09/2004
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Rich2 Status - Mirrors
Mirrors in Simax Glass manufactured by the Compass - Czech Firm
Spherical Mirrors:
array of hexagonal mirrors
dcirc = 510 mm
subs. thick’ss = 6 mm
R0 = 8600 mm 0.5%
Flat Mirrors:
array of flat mirrors (R=~50 m)
rectangular in shape
dcirc = 559 mm
At present
•~ 45 good hexagonal mirrors available now: complete!
3.8
Do [mm]
3.3
2.8
2.3
1.8
1.3
Quality check for spherical mirrors produced
D0 = diam. of smallest circle containing 95%of reflected light
required D0  2.0 mm
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CSN1 Assisi 22/09/2004
0.8
8500
8550
8600
8650
8700
Radius of curvature [mm]
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Rich2 Status
Photodetectors Housing
•
•
•
•
•
Photodetectors housing completely redesigned since Jan. 2004 due to
much larger heat dissipation requirements than initially foreseen :
each HPD plane 2kW instead than ~200 W foreseen in the EDR due to
much larger dissipation both of pixel chip (~1.8 W/chip) and associated
L0 electronics.
To ease cooling electronics PCB’s (L0, HV, LV) are arranged on the
same plane differently from the old design, while the general frame
design is retained with proper modifications in order to accommodate
the electronic boards.
In new design Cu cooling plates with active C6F12 system in order to
cool L0 electronics.
Precision positioning of HPD’s and cooling of pixel chips implemented by
means of special mounting cup (spacer) together with cold fingers
conducting heat to cooled frames where cooling plates are installed.
HPD signal pinout inserted into a ZIF connector mounted on a special
PCB (translator) in turn connected to L0 electronics by means of a
couple of Flexible (Kapton) Printed Circuits. Proper termination
resistors are implemented on the translator PCB
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CSN1 Assisi 22/09/2004
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New HPD Columns Layout
GENERAL ARRANGEMENT
Prototype HV Board
Cooling Plates
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CSN1 Assisi 22/09/2004
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New HPD Column Layout
COLUMN FRAME PROTOTYPE WITH ELECTRONIC BOARDS
• MANUFACTURING
ONGOING, DELIVERY
EXPECTED BY MID
SEPTEMBER
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CSN1 Assisi 22/09/2004
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New HPD Column Layout
COOLING PLATE PROTOTYPE
•3 COOLING PLATES FORESEEN FOR THE TEST BEAM
COMPLETELY ASSEMBLED (THANKS TO E. ALBRECHT) AND
AVAILABLE AT CERN
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CSN1 Assisi 22/09/2004
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New HPD Column Layout
Translator Module and Spacer
The Spacer is a new component needed for the
HPD alignment with the higher heat dissipation
(Spacer)
The Translator Module is the complex of a PCB together with
flexible links, accomplishing the task of connecting the HPD to
the L0 Board still allowing for mechanical freedom
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CSN1 Assisi 22/09/2004
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Rich Photodetectors
bird’s eye view on some recent HPD performance measurements (1)
40 MHz prototypes
QE curves
Quantum Efficiency curves
30.00
25.00
QE [%]
20.00
HPD 3_7
HPD 2_2
HPD 2_10
Typ. specs
HPD 2_1
Min. specs
15.00
10.00
5.00
0.00
200
300
400
500
600
700
800
900
Wavelength [nm]
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CSN1 Assisi 22/09/2004
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Rich Photodetectors
bird’s eye view on some recent HPD performance measurements (2)
 Efficiency Measurements
 Timing scans (e.g. timewalk effects for different strobes (25/50 ns)
 Comparisons between detection efficiencies 25 and 50 ns strobes
 Detection efficiencies for different cathode HV’s
 Reflection Measurements
 light reflection in quartz window
 light reflection on internal HPD structure
(silicon, electrodes,etc.)
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CSN1 Assisi 22/09/2004
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Rich 2004 test beam
•
•
Rich prototype foreseen to be tested on the beam in 2 periods (1st week
October – 2nd week November). The 1st period will be a setup period
Special test vessel will accommodate 3 HPD columns which will be an
exact prototype of the definitive installation, including the cooling
system, in order to perform a complete working test of the HPD system
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CSN1 Assisi 22/09/2004
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Rich Photodetectors
HPD pre-series news and availabilities for 2004 test beam
• Latest update from DEP as of 31st August 2004:
 “The situation with respect to the production of the pre-series will
expectedly be as follows:
 * We do have one completed HPD, potted in the LHCb construction, but
still with the "old" Quartz input window ("old” way of marking) and old
wiring. The completed HPD still has to be tested.
 * We will start with the processing of the second HPD (using anode 4.1)
by 1st September.
 * The next 5 starts (using anodes 2.6, 2.7, 3.1, 3.2 and 4.2) are
foreseen for the weeks 38, 39 and 40 (13 September till 1 October). Next
week we cannot make any further starts because of the lack of Quartz
windows.
 * Remaining starts related to the availability of anodes: depends on
approval of remaining 3 anodes […]. With the approved anodes the
remaining starts will be made in the first week of October.”
In conclusion HPD availabilities should be:
2 HPD’s for October test beam week
10 HPD’s for November test beam week
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CSN1 Assisi 22/09/2004
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Spare Slides
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CSN1 Assisi 22/09/2004
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Rich2 Schedule
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Rich1 Schedule
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Rich2 Superstructure with Exit Window Mounted
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CSN1 Assisi 22/09/2004
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Cooling Plates
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CSN1 Assisi 22/09/2004
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TEST BEAM HARDWARE PRODUCTION: HPD SPACER
• 20 ITEMS MANUFACTURED, DELIVERED AND
ACCEPTED
• PARTS ARE AVAILABLE AT INFN-GE
• COOLING FINGER DETAILS ARE UNDER
MANUFACTURING AND WILL BE AVAILABLE BY
THE END OF THIS WEEK
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CSN1 Assisi 22/09/2004
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Translator Module Prototype
Translator
and
Flexible Links
Flexible Links
Translator and Flexible Links
Test Set-up
Hirose Connector
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ZIF HPD Connector
CSN1 Assisi 22/09/2004
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Translator Module - PCB Layout
PCB dim.
81.5 x 55 x 1.6 mm3
Total thickness
14.4 mm (ZIF conn. incl.)
Central hole for HPD
cooling by means of a
cold finger
•On one side of the PCB a modified 321 pin Socket 7 ZIF Connector is mounted
where pins of the HPD ceramic PGA are inserted.
On this side a PT1000 Temperature Sensor is mounted too
•On the other side of the PCB there are two
Hirose FH12-50S-0.5SV connectors where the flexible links are inserted
and also the terminating resistors of the lines going from L0 board to HPD
•OnM.Sannino
both sides of the PCB ceramic
capacitors for power supplies and
CSN1filtering
Assisi 22/09/2004
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references are mounted
Translator Module - Flexible links
Flexible links carry the signals between HPD and L0 board:
~ 88 mm long
2-layer configuration 1st side :Analog, Digital and Power Lines
2nd side :Grounds (A & D in corresp. to respective Lines)
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CSN1 Assisi 22/09/2004
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Each Line: 6 mil wide, ~35 mm thick, R ~ 0.2 Ohm, Z ~ 82 Ohm
Overview of RICH1 – Optical Layout
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CSN1 Assisi 22/09/2004
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Rich1 Magnetic Shield – vertical extension
Space available for HPDs
and readout electronics
Is limited
Extending vertically
by 200mm
Allows accommodation of
RICH2 HPD assembly
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CSN1 Assisi 22/09/2004
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Rich1: Material Budget
Item
% X 0 % lI
Entrance window
Aerogel
C4F10
Spherical mirror
Exit window
0.0
3.3
2.6
0.8
0.6
Total
7.3%
0.0
0.7
1.6
0.7
0.3
14% in TDR design
3.3%
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CSN1 Assisi 22/09/2004
5% in TDR design
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Rich1
•
Mirrors
Spherical mirrors
– 82 cm x 60 cm, R=240 cm: 1 per quadrant
as a final technology Beryllium has been chosen
(Carbon fiber was another possible candidate)
Be: 3 mm thick, with 0.3 mm glass coating
•
•
•
•
¼-scale prototpye satisfies optical quality
Compatible with flurocarbon gas
Higher cost than carbon fibre
Secondary plane mirrors (outside
acceptance)
–
–
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37 cm x 39 cm: 4 per quadrant
Glass: 6 mm thick
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HPD
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HPD
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CSN1 Assisi 22/09/2004
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Shielded Phosphor tube:
TRANSVERSE field 30G
• Reference B=0G
SHIELDED: Bt=30G
Maximum displacement <
350m (0.7pixels)
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CSN1 Assisi 22/09/2004
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Shielded Phosphor tube:
AXIAL field 30G
• Reference B=0G
SHIELDED: Bz=30G
0% coverage loss
Max displacement ~ 2.8mm
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CSN1 Assisi 22/09/2004
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HPD and Phosphor Tube: transverse B field
•HPD reference B=0G
HPD Bt=2.5G
*Phosphor tube
mm
Bt=2.5G
Confirm the two
devices have same
electron optics
behaviour
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mmCSN1 Assisi 22/09/2004
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HV board layout
Two different circuit configurations, namely two boards, has been built. Each board manages two HPD:
Board 2
Board 1
20KV
HV 1
HV 1
1 G HV
1 G HV
10 G HV
HV splitter and
filtering capacitances:
HV 2
1 G HV
HV 3
1 G HV
HPD
Voltage
monitoring:
Monitor 1
HV 2
1 G HV
HPD
10 G HV
Monitor 2
X2
HV 3
1 G HV
10 G HV
X2
Monitor 3
To avoid discharges from the HV, three circuit solutions have been adopted:
1. The boards and the critical components are covered by a transparent, protective material (Flexible rubber) having an
electrical strength of about 20 KV/mm;
2.
To suppress any possible effect that can arise from a non perfect adhesion of the protective material on the surface of
the PC board, apertures has been created around the critical connecting points;
3.
A 4 layer PCB has been designed that allows the track to stay buried by about 0.8 mm of fiberglass, having a strength
of about 50 KV/mm.
Here we have a laboratory prototype on a 2 layer PCB. The
protective material is completely transparent and cover the whole
board.
This is a Board 1 type. The HV resistors are not present, while the
HV filtering capacitance are mounted.
M.Sannino
In the test we have done, the HPD where simulated connected to
GND, as a very fault situation.
CSN1 Assisi 22/09/2004
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Work in Progress
Leakage current at
22 KV of the lab.
prototype in free air
in more than 8 days
(spikes are ambient
disturbances).
PROTOTYPE BOARDS
AVAILABLE
Board 1
1.
The protective material is available;
2.
The HV filtering capacitance are available;
Not yet available, but ordered from CERN and under delivering:
1.
HV dividers;
2.
HV 1 G Resistors;
3.
HV wires
Board 2
The whole HV boards setup should be ready by the end of September if the HV dividers, resistors and
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CSN1
22/09/2004
wires
will be available within, at most, the first
halfAssisi
of September.
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