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FEE Electronics progress •Mezzanine manufacture progress •FEE64 testing and VHDL progress 4th December 2009 Mezzanine manufacture Progress • • • • • PCB manufacturer delayed through the processing due to technically challenging design. Shipped 20 to assembler ( Patronics Ltd ). 15 assembled boards delivered to DL 2/12/09. 5 assembled boards failed final quality control at Patronics. Pads had lifted after re-work. After visual inspection at DL. – – – – • • 4th December 2009 10 OK for use. 1 broken track and lifted resistor 1 solder whisker between resistors ( can repair ) 3 solder on ASIC pads Assembled to copper block and found a component fouled. Mechanical workshops removing 0.2mm copper to solve the problem. Creating 5 kits with mezzanine card, mounting pins and copper block with heat conducting foam pad in place for despatch to RAL. FEE64 testing and VHDL progress • • MIDAS control and acquisition system is under development as the VHDL evolves. Spectra taken from all four Mux readout ADCs with reference and input ground. FWHM of 3 channels. 4th December 2009 Clock distribution • No further work has taken place. • Pcb layout to proceed after VHDL for acquisition complete. • Designed for manufacture locally. Master SYNC to clock box FEE64 (sync master) FEE64 Clock box FEE64 FEE64 200Mhz clock and SYNC distribution 4th December 2009