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HIGH DENSITY DESIGN COMPONENT SOLUTIONS Technology Challenges Market Drivers: Make it smaller Make it operate faster Make it more efficient Make it cheaper Technology Challenge Smaller Circuits Design: 1. Higher levels of circuit integration on silicon 2. Use of smaller foot print components + Components can be placed closer together - Closer the components get to each other, the more unwanted signal noise coupling occurs SMT 0603 – 0402 CERAMIC CHIP CAPACITORS CHIP RESISTORS FERRITE CHIP BEADS INDUCTORS Technology Challenge Faster Speed of Operation: 1. More done in shorter amount of time MHz 1200 800 600 400 2. Higher complexity of functions & display + Smaller SMT Components Can Function at Higher Speeds. - Distances between components and traces become significant factors in limiting performance and creates need for control of signal integrity. SMT 0603 – 0402 CERAMIC CHIP CAPACITORS CHIP RESISTORS FERRITE CHIP BEADS INDUCTORS Technology Challenge Less Power Consumed: 1. More features using less power 2. Thinner barrier silicon IC chips = lower voltage operation = less energy needed. + SMT Passive Components can function at lower voltage - Lower voltage IC have reduced tolerance to spikes – transients. Higher level of transient and noise control i required = more passive components needed (capacitors and TVS devices) - Lower ESR (lower loss) components needed CERAMIC CHIP CAPACITORS MLV – VARISTORS LOW ESR ALUMINUM & TANTALUM CAPACITORS Technology Challenge Reduced Cost of Products: 1. Reduce size of PCB = less cost 2. Use SMT = faster production and reduced cost to build 3. Reduce component count by component integration 4. Use smaller size components (less raw material = less $$$) + Many SMT Passive Components cost less than leaded equivalents + Integrated (multiple element passives) reduce board space and place costs CERAMIC CHIP CAPACITORS & ARRAYS CHIP RESISTORS & ARRAYS FERRITE CHIP BEADS / INDUCTORS PASSIVE ARRAYS (IPC) Component Solution: Component Size Reduction NRC SERIES CHIP RESISTORS SMT Component Size 0201 • 0201 • NIN/NIS SERIES CHIP INDUCTORS NMC SERIES CERAMIC CHIP CAPACITORS 0805 0603 0402 3mm 12mm 0201 NACxx SERIES SMT ALUMINUM ELECTROLYTIC CAPACITORS Integrated Component Solution: Resistor Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space 2 OR 4 OR 8 ELEMENTS CHIP RESISTORS 4 PIN 2 ELEMENTS NRSN SERIES RESISTOR ARAYS REPLACE WITH 10 PIN 8 ELEMENTS Thick Film Resistor Arrays Quad flat pack or PLCC package IC High Density Design Solutions: Component Size Reduction and Integration 0.5mm (0.20”) ”) ~ 1.27mm (0.39”) pitch 103 103 103 103 Four ‘0603’ resistors (1.6mm X 0.6mm each) Typically 0.2~0.5mm space between parts (3.0mm X1.6mm total) Component size, spacing, land patterns and connection layout takes up valuable board space! Placing four components = $$$$ Quad flat pack or PLCC package IC NRSNA4I2 NRSNA4I4 10 3 0.5mm (0.20”) ~ 1.27mm (0.39”) pitch 0.5mm (0.20”) pitch (Same or less pitch as IC!) ‘0804’ resistor arrays (2.0mm X 1.0mm total) NIC P/N: NRSNA4I4 SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS! Far less board space used and short connection layout frees up valuable board space! Placing one component = ¼ the placement cost = $$$ saved! Integrated Component Solution: Capacitor Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space NCA SERIES CAPACITOR ARRAY 1 PART: 4 ELEMENTS 1206 SIZE 4 ELEMENTS CERAMIC CAPACITORS REPLACE WITH Integrated Component Solution: Capacitor Arrays High Density Design Solutions: Component Size Reduction and Integration 0603 Ceramic chip capacitor = ~$6/1000 = 0.6¢ each… 4 parts = 2.4¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 8¢ for 4 parts. Total cost of 4 ceramic chip capacitor elements = 10.4¢ Total board area = 1.6mm X 4.7mm = 7.52mm² C1 C2 C3 C4 1.6mm 4.7mm C1 C2 C3 C4 1.6mm 3.2mm 4 Element capacitor array = ~$40/1000 = 4.0¢ each… 1 part = 4.0¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 2¢ for 1 part. Total cost of 4 ceramic chip capacitor elements = 6.0¢ (42% savings) Total board area = 1.6mm X 3.2mm = 5.12mm² (32% smaller) Capacitor Array Benefits = Lower total cost and less board space used! Integrated Component Solution: Passive Component Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS! NPA SERIES PASSIVE ARRAY 1 PART: 8 ELEMENTS 1608 SIZE 8 ELEMENTS 4 CAPACITORS 4 RESISTORS REPLACE WITH Integrated Component Solution: Passive Component Arrays High Density Design Solutions: Component Size Reduction and Integration NPA SERIES - Four element R•C network array in EIA 1608 size package Capacitance values from 10 ~ 180pF Resistive element values from 10 ohm ~ 1K-ohm. R R C C R C R C R C 1608 size : 0.16” long X 0.08” wide 4.0mm long X 2.1mm wide