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HIGH DENSITY DESIGN
COMPONENT SOLUTIONS
Technology Challenges
Market Drivers:
 Make it smaller
 Make it operate faster
 Make it more efficient
 Make it cheaper
Technology Challenge
Smaller Circuits Design:
1. Higher levels of circuit integration on silicon
2. Use of smaller foot print components
+ Components can be placed closer together
- Closer the components get to each other, the more
unwanted signal noise coupling occurs
SMT 0603 – 0402
 CERAMIC CHIP CAPACITORS
 CHIP RESISTORS
 FERRITE CHIP BEADS
 INDUCTORS
Technology Challenge
Faster Speed of Operation:
1. More done in shorter amount of time
MHz
1200
800
600
400
2. Higher complexity of functions & display
+ Smaller SMT Components Can Function at Higher
Speeds.
- Distances between components and traces become
significant factors in limiting performance and
creates need for control of signal integrity.
SMT 0603 – 0402
 CERAMIC CHIP CAPACITORS
 CHIP RESISTORS
 FERRITE CHIP BEADS
 INDUCTORS
Technology Challenge
Less Power Consumed:
1. More features using less power
2. Thinner barrier silicon IC chips = lower voltage
operation = less energy needed.
+ SMT Passive Components can function at lower voltage
- Lower voltage IC have reduced tolerance to spikes –
transients. Higher level of transient and noise control i
required = more passive components needed
(capacitors and TVS devices)
- Lower ESR (lower loss) components needed
CERAMIC CHIP CAPACITORS
 MLV – VARISTORS
 LOW ESR ALUMINUM & TANTALUM CAPACITORS

Technology Challenge
Reduced Cost of Products:
1. Reduce size of PCB = less cost
2. Use SMT = faster production and reduced cost to build
3. Reduce component count by component integration
4. Use smaller size components (less raw material = less $$$)
+ Many SMT Passive Components cost less than leaded
equivalents
+ Integrated (multiple element passives) reduce board
space and place costs
CERAMIC CHIP CAPACITORS & ARRAYS
 CHIP RESISTORS & ARRAYS
 FERRITE CHIP BEADS / INDUCTORS
 PASSIVE ARRAYS (IPC)

Component Solution: Component Size Reduction
NRC SERIES CHIP RESISTORS
SMT
Component
Size
0201 •
0201 •
NIN/NIS SERIES CHIP INDUCTORS
NMC SERIES
CERAMIC
CHIP
CAPACITORS
0805
0603
0402
3mm
12mm
0201
NACxx SERIES SMT ALUMINUM ELECTROLYTIC CAPACITORS
Integrated Component Solution: Resistor Arrays
High Density Design Solutions: Component Size Reduction and Integration
Get More
Components
In Less Space
2 OR 4 OR 8 ELEMENTS
CHIP RESISTORS
4 PIN
2 ELEMENTS
NRSN SERIES RESISTOR ARAYS
REPLACE WITH
10 PIN
8 ELEMENTS
Thick Film Resistor Arrays
Quad
flat pack
or PLCC package IC
High Density Design Solutions: Component Size Reduction
and
Integration
0.5mm (0.20”) ”) ~ 1.27mm (0.39”) pitch
103
103
103
103
Four ‘0603’ resistors (1.6mm X 0.6mm each)
Typically 0.2~0.5mm space between parts (3.0mm X1.6mm total)
Component size, spacing, land patterns and connection layout takes up valuable
board space! Placing four components = $$$$
Quad flat pack or PLCC package IC
NRSNA4I2
NRSNA4I4
10
3
0.5mm (0.20”) ~ 1.27mm (0.39”)
pitch
0.5mm (0.20”) pitch (Same or less pitch as
IC!)
‘0804’ resistor arrays (2.0mm X 1.0mm total) NIC P/N: NRSNA4I4
SUPERIOR
PERFORMANCE
IN HIGH SPEED
CIRCUITS!
Far less board space used and short connection layout frees up valuable board space!
Placing one component = ¼ the placement cost = $$$ saved!
Integrated Component Solution: Capacitor Arrays
High Density Design Solutions: Component Size Reduction and Integration
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Components
In Less Space
NCA SERIES
CAPACITOR ARRAY
1 PART: 4 ELEMENTS
1206 SIZE
4 ELEMENTS
CERAMIC
CAPACITORS
REPLACE WITH
Integrated Component Solution: Capacitor Arrays
High Density Design Solutions: Component Size Reduction and Integration
0603 Ceramic chip capacitor = ~$6/1000 = 0.6¢ each… 4 parts = 2.4¢ total.
Placement cost = 0.5¢ ~ 5¢ each (industry estimates)
lets say it's 2¢ per part = 8¢ for 4 parts.
Total cost of 4 ceramic chip capacitor elements = 10.4¢
Total board area = 1.6mm X 4.7mm = 7.52mm²
C1
C2
C3
C4
1.6mm
4.7mm
C1
C2
C3
C4
1.6mm
3.2mm
4 Element capacitor array = ~$40/1000 = 4.0¢ each… 1 part = 4.0¢ total.
Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 2¢ for 1 part.
Total cost of 4 ceramic chip capacitor elements = 6.0¢ (42% savings)
Total board area = 1.6mm X 3.2mm = 5.12mm² (32% smaller)
Capacitor Array Benefits = Lower total cost and less board space used!
Integrated Component Solution: Passive Component Arrays
High Density Design Solutions: Component Size Reduction and Integration
Get More
Components
In Less Space
SUPERIOR
PERFORMANCE
IN HIGH SPEED
CIRCUITS!
NPA SERIES
PASSIVE ARRAY
1 PART: 8 ELEMENTS
1608 SIZE
8 ELEMENTS
4 CAPACITORS
4 RESISTORS
REPLACE WITH
Integrated Component Solution: Passive Component Arrays
High Density Design Solutions: Component Size Reduction and Integration
NPA SERIES - Four element R•C network array in EIA 1608 size package
Capacitance values from 10 ~ 180pF
Resistive element values from 10 ohm ~ 1K-ohm.
R
R
C
C
R
C
R
C
R
C
1608 size :
0.16” long X 0.08” wide
4.0mm long X 2.1mm wide