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Download Ch11The ABCs of ESD EOS and SOA
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Bridging Theory in Practice Transferring Technical Knowledge to Practical Applications The ABC’s of ESD, EOS, and SOA The ABC’s of ESD, EOS, and SOA The ABC’s of ESD, EOS, and SOA Intended Audience: • Electrical engineers with a knowledge of simple electrical circuits • An understanding of MOSFET devices Topics Covered: • What is Electrostatic Discharge (ESD) • What is Electrical Over Stress (EOS) • What is Safe Operating Area (SOA) Expected Time: • Approximately 90 minutes The ABC’s of ESD, EOS, and SOA • What is ESD – Where does ESD come from – MOSFET Gate susceptibility – Test Standards – Component level vs. module level tests • What is EOS • What is SOA Electrostatic Discharge (ESD) • We are all familiar with a common form of electrostatic discharge (ESD): Shaggy Carpet • ESD is the sudden transfer of electrostatic charge between objects at different electrostatic potentials Where Does ESD Come From • Triboelectric Charging – Mechanical Contact and Separation – “Walking on carpet” Direct Charging – Mobile Charge Transfer – “Plugging in a cable” (e.g. USB to PC) Ionic Charging – Not properly balanced Air Ionizer can charge an object (instead of intended operation to neutralize/balance charge) –Charged object comes into contact with a grounded object (such as machine pick-up probe or grounded human operator) –This is example of charged device model (CDM) event—more to come!!! Where Does ESD Come From? • Which levels can occur? – Below 3-4kV you see, hear or feel nothing! – Just above 4kV, air-gap-sparks can occur – 1mm == 1kV (5mm spark ~ 5kV) Why does a 2kV protected device survive the real world? – You are charged relatively to earth, not to “pin7” – You do not have 4kV between your thumb and your index finger • Influence of Air Humidity – Higher relative air humidity does cause a “moisture” film on surfaces – Charge is more distributed, lower voltages thus occur – But dry air does not have a higher inherent “resistance” ESD Voltage (kV) Where Does ESD Come From? office room (winter) without air humidity regulation 16 15 14 13 12 11 10 9 8 synthetic 7 6 5 4 wool 3 2 anti-static 1 5 10 20 15% 30 40 35% 50 60 70 80 90 100 % Relative Air Humidity MOSFET Gate Susceptibility Source Often, the source is grounded Gate Drain Insulating SiO2 Gate SiO2 n n p-type Charge Is Applied to the MOSFET Gate Source Gate But, the Drain charge is stuck on gate due to insulating SiO2 SiO2 Cgs n n p-type A Quick Review of Voltage and Capacitance Voltage • Think of voltage as an amount of possible electrical work • A high voltage means additional electrical work is possible • If the voltage is improperly directed or used, unintended (and potentially harmful) work will be performed +12V Ground Battery A Quick Review of Voltage and Capacitance • Variables and Constants: C Capacitance Q Charge V Voltage 0ox Permittivity of Silicon Dioxide A Area of Capacitor Plates d Distance Between Conductors • Two Basic Equations: C Q V C 0 ox A d • Rearranging yields: Q Q V C 0ox A d Qd 0ox A Quick Review Summary: Qd V 0ox A 0ox • is a constant for a given material (SiO2) • As the charge (Q) on the capacitor increases the voltage across the capacitor increases…. Gate Charge Induces a Gate Voltage Source VGATE SiO2 n Gate QGATE d 0ox A Drain VGATE 100V POP n p-type Induced Gate Voltage Creates a Hole in the SiO2 Source Gate Drain SiO2 n n Allowable E-field within SiO2 exceeded p-type Induced Gate Voltage Creates a Hole in the SiO2 Source Gate Gate-Source Short MOSFET cannot turn on Drain SiO2 n n p-type Gate susceptibility summary: Qd V 0ox A • As the charge (Q) on the capacitor increases the voltage across the capacitor increases…. • If the transistor decreases in size the thickness of the SiO2 gate (d) decreases but, the area (A) of the gate decreases faster • For the same amount of charge, the voltage across the capacitor is higher for a smaller transistor • More advanced technologies may require additional ESD precautions Induced Voltage for 3m and 1.2m CMOS Processes • 3m Process (Minimum Size Transistor) – – – – tox L W Q = 400 Å = 4x10-8 m = 3m 1.16 x1011C 4.0 x108 m V 1.5kV 12 6 6 = 3m 3.9 8.85 x10 F / m 3.0 x10 m 3.0 x10 m = 1.16x10-11 C • 1.2m Process (Minimum Size Transistor) – – – – tox L W Q = 200 Å = 2x10-8 m 1.16 x1011C 2.0 x108 m = 1.2m V 4.7kV 12 6 6 3.9 8.85 x10 F / m 1.2x10 m 1.2x10 m = 1.2m = 1.16x10-11 C Note: 0OX (3.9)(8.85x10-12 F/m) ESD Standards & Test: Overview • ESD Standards & Tests should simulate “real world” events as realistic as possible • There is no “single/one size fits all” ESD Test available Different handling/mounting conditions have resulted in different ESD tests – e.g. car-manufacturers follow different ESD standards than componentsuppliers: both are talking about ESD but not about the same applied ESDstandards Be careful to know complete standard definition – “ESD 2kV”, “2kV HBM”,… does not mean much: The Standard is missing e.g JEDEC22-A114; MIL-STD-883, Method 3015.7, ……(more complete) ESD Standards & Tests: Overview • A “Standard” consists of … – … a used MODEL (HBM, MM, …) – … VALUES for the elements used in the model (R=1500 Ohm, C=100pF) – … plus TEST PROCEDURE: how to apply the standard (e.g. 3 pulses) Standard = Model + Values + Procedure Therefore Standards can differ in each subset, in the – MODEL – VALUES – TEST PROCEDURE “HBM 2kV” is not specific – “2kV JEDEC22-A114” is better defined ESD Models: Human Body Model R • Human Body Model (HBM) consists of a Capacitor and a series Resistor • Values are defined in the specific standard – Commonly used: C =100pf, R=1500 Ohm (JEDEC, Mil, etc.) • Test Procedure is defined in the specific standard – Commonly used: 1 to 3 pulses, both polarities, 3 devices/voltage level Commonly used for component tests C Model HBM Standards (R=1500 Ohm, C=100 pF) • JEDEC JESD 22-A114 [2] • Military Standard Mil.883 3015.7 [3] • ANSI/ESD STM5.1 [4] • IEC 61340-3-1 “Human ESD Model” (R=2000 Ohm, C=150 pF – 330 pF) • ISO/TR 10605 [5] “Human Body Representative” (R=330 Ohm, C=150 pF) • IEC 61000-4-2 [6] ESD Models: Human Body Model Waveform 1kV • HBM Jedec22-A1114 Waveform: – 10ns rise time typically (short) • 2-10ns are allowed – Peak current: • Rule of Thumb: – 1kV = 2/3 Ampere Vesd Ipeak 1500 [ W] VESD (V) 1000 Ipeak - Ipeak+10% (A) 0.67 – 0.74 ESD Models: Machine Model • Machine Model (MM) consists of a Capacitor and no series Resistor • Values are defined in the specific standard C – Commonly used: C =200pF, • Test Procedure is defined in the specific standard Model – Commonly used: 1 to 3 pulses, both polarities, 3 devices/level Some definitions use MM “standard” with a 25 Ohm series resistor, which at least doubles the achievable ESD Level! MM Standards (C=200 pf) • JEDEC JESD 22-A115 [11] • ANSI/ESD STM5.2 “Philips Standard” (C=200 pF, R=10-25 Ohm, L=0.75-2.5µH) • Standard?? ESD Models: Machine Model • MM stress is similar to HBM – Oscillations due to setup parasitics • MM and HBM failure modes are similar Source: T. Brodbeck; Models.pdf • Less reproducible than HBM VESD (kV) 0.1 0.2 Ipeak - Ipeak+30% (A) 1.5 - 2.0 2.8 - 3.8 Charged Device Model Test • Models an ESD event which occurs when a device acquires electrostatic charge and then touches a grounded object Device Device placed discharges in dead-bug through ground probe position Dielectric Field Plate High Voltage Source CDM Waveform: Highly dependent on die size and package capacitance 500V with 4pF verification module tr<400psec / Ip1~4.5A / Ip2<0.5Ip1 / Ip3<0.25Ip1 Source: AEC-Q100-011B AEC-Q100 • Automotive Electronic Council (AEC) Stress Test Qualification “100”: AEC Q100 – xxx AEC is not a single standard but a collection of requirements for automotive suppliers AEC Q100 validated suppliers have to fulfill the ESD regarding qualification described in it – AEC Q100-002: HBM (JEDEC) 2000V OR AEC Q100-003: MM (JEDEC) 200V AND – AEC Q100-011: CDM (JEDEC) Corner Pins 750V / Non-corner pins 500V Component vs. Module level tests • ESD (pulses) testing originates from a subset of the wide field of EMC (Electromagnetic Compatibility, EMI … Immunity) • Due to the importance in the Semiconductor Industry, ESD testing has evolved into its own field of specialization The ESD/EMC world in general can be divided into two mainfields: (Powered) Systems (Unpowered) Components ESD Standards & Tests: System vs. Component Goal: UNDISTURBED functionality during and after ESD stress under powered / functional conditions Goal: UNDESTROYED components after ESD stress: All specification-parameters should stay within its limits ESD is a part of EMC qualification Different “behavior criteria” in response to ESD on system level exists (class A to D) ESD is a part of product qualification “Pass”/”fail” criteria Just dedicated pin combinations feasible I/O vs. GND All pin combinations can occur and are tested The reference/enemy is always earth potential Relative measure of robustness of end product during operation Relative measure of robustness during handling/manufacturing ESD Test methods (Models) System vs. Component Module/System Level Human Body Model (HBM) 150pF / 330 W EN 61000-4-2 (so called “GUN Test”) Human Body Model (HBM) 150pF / 2000 W ISO 10605 Human Body Model (HBM) 330pF / 2000 W ISO 10605 Component Level Human Body Model (HBM) 100pF / 1500 W JEDEC-Norm JESD22-A114-B (MIL-STD883D, method 3015) Machine Model (MM) 200pF / 0 W JEDEC-Norm JESD22-A115-A (correlates to HBM) Charged Device Model (CDM) Package pF / 0 W JEDEC-Norm JESD22-C101-A ESD Models: Human Body Model Component Test • A “Pin-to-Pin” ESD Tester (like HBM, MM Testers) consists of the HV source and the model with its values, connected to two “Terminals” R HV Terminal A C Terminal B • The Terminals are not changed for polarity reversal … The capacitance is charged one time positively and one time negatively Tester-Ground along with parasitics stay constant ESD Models: Human Body Model Component Test • 2 different Pin-Combination-Types are tested – Supply-Pin-Tests • All Pins (individually one at a time) at Terminal A vs. Supply-X at Terminal B • Repeat for Supply-Y, Supply-Z, etc. at Terminal B – Non-Supply-Pin-Test • “All Non-Supplies (individually one at a time) at Terminal A vs. all other non-supplies together at Terminal B” • Repeat for each non-supply at Terminal A • 1 positive and 1 negative pulse for each pin-combination • Step-Stress, 500V, 1kV, 2kV and 4kV should be used; different levels and steps can be defined – A new set of 3 devices per level is used ESD Product Qualification Test @ IFX according to JEDEC EIA/JESD 22-A114-B [2] described in IFX Procedure [1] ESD Supply-Pin Test: HBM ESD Each pin vs. Supply-1 (GND) • ESD Test P1.1 – All pins vs. Supply 1 (in this case GND) – In this case: • 10 different combinations • 1+ and 1- pulse for each combination • 20 pulses for each voltage step ESD Supply-Pin Test: HBM ESD Each pin vs. Supply-2 (VBB) • ESD Test P1.2 – All pins vs. Supply 2 (in this case VBB) – Then subsequently All pins vs. Supply 3 (Vdd) – In this case: • 11 different combinations • 1+ and 1- pulse for each combination • 22 pulses for each voltage step ESD Non-Supply-Pin Test: HBM ESD Each nonsupply vs all other non-supply • ESD Test P2 – Each non-supply vs. All other non-supply – One non-supply at a time on Terminal A – All other non-supplies at Terminal B – In this case: • 8 different combinations • 1+ and 1- pulse for each combination • 16 pulses for each voltage step ESD Standards & Test: System-Level Test • Direct Discharge: Test points of normal accessibility. – The Reference-’”Pin” at System-Level test is “Earth” and not a part of the DUT • Indirect Discharge into couple plate: Test for radiated disturbance immunity HBM: System Level Tests applied to components?? • Some Customers ask for systemlevel test at component level – Component is not powered – Only pins which are accessible to the outside world are tested – Reference pin(s) are the component ground pin(s) – Pass/Fail according to Component test-program – ESD current is 5x higher at a dedicated voltage level compared to component ESD tests 7.5A ESD @ 2kV Red: IEC (“GUN”) Blue: JEDEC “HBM” 1.3A 1ns 10ns Pulse Charge Comparison Discharge generated Pulses (RC) Ri [Ohm] C [pF ] Ipeak [A] Charge Charge relatively to HBM, JESD22114 Standard/Pulse Vma x [V] Duratio n (1090%) Component "HBM" JESD 22-114 8000 150ns 1 1500 100 5.3 800nC 1 System "GUN" IEC 61000-42 8000 120ns 10 330 150 33 1.2µC 1.5 System/Vehic le ISO/TR 10605 inside 8000 1µs 3 2000 330 30 2.64µC 3.3 System/Vehic le ISO/TR 10605 outside 8000 360ns 3 2000 150 30 1.2µC 1.5 - 10 20mC 25x10^3 Application # of Pulses Voltage generated Pulses Vehicle Vehicle Vehicle Vehicle ISO 7637: 1 ISO 7637: 2 ISO 7637: 3a ISO 7637: 3b -100 100 150 150 2ms 5000 10 50µs 5000 10 - 10 0.5nC 6.25x10^4 100ns 1h (3.6x10^6) 50 - 3 300nC 0.375 100ns 1h (3.6x10^6) • HBM 50 - 8kV 2is normalized to “1” 200nC 0.25 HBM ESD Gate Shorted to Source Very small damage area due to low energy of ESD pulses, normally cannot be seen with “naked eye” HBM ESD Gate Shorted to Source This device had a G-S short and you can see the burn mark is right at the boundary region of gate poly and source metal which is common since this is the area of highest E field strength Gate contact metal Gate Polysilicon Source contact metal Can ESD Sensitive Devices in an Automobile Be Protected? • Electrostatic discharge sensitive components can be protected in an automobile • Installation of spark gap topologies • Establishing a predictable charge well topology such as capacitors Decrease ESD Sensitivity with a Predictable Charge Well Topology • Recall our earlier equation: Qd V 0ox A • Place a capacitor across the device/pin to be protected • The additional external capacitor sheds the electrostatic discharge energy, reducing the voltage at the pins of the semiconductor device Decrease ESD Sensitivity with a Predictable Charge Well Topology IC ESD generator Protected Pin Cprotection ESD current/charge For most robust design, the voltage at this point should be lowered to be less than internal ESD structure breakdown voltage so all current/energy is shed thru external capacitor. Please note that there is no resistor between C_prot and IC so high current/energy can flow into IC if internal ESD structure breaks down and begins to conduct current Decrease ESD Sensitivity with a Predictable Charge Well Topology • System level/gun tests ESD voltages may need to be 15,000V (direct contact) – Gun tests uses 330pf for source capacitor • For automotive technologies having ESD structures with 4045V breakdown is common C_prot = (C_gun / Vbr_ESD) * V_gun = (330pF / 45V) * 15kV = 110nF Typical internal IC ESD Protection Circuits Ground Referenced Protection VSupply Referenced Protection External Pin Protected Circuit VSupply External Pin Protected Circuit IC IC ESD Summary • Electrostatic discharge occurs when excessive static charge on an object builds up to a very high voltage (thousands of volts) and causes device damage during contact and subsequent discharge (current flow) with another object • MOS devices with insulating SiO2 gates are especially susceptible to ESD damage • Different test standards have evolved for component level and system level tests and confusion can result if these standards are not understood and clarified in reports and communication • The very fast (HBM=nsecs / CDM=psecs) ESD pulses have low energy and result in VERY small physical damage signatures The ABC’s of ESD, EOS, and SOA • What is ESD – Where does ESD come from – MOSFET Gate susceptibility – Test Standards – Component level vs. module level tests • What is EOS • What is SOA What is Electrical Over Stress (EOS)? • Electrical Over Stress is exactly what it says…. A device is electrically stressed over it’s specified limits in terms of voltage, current, and/or power/energy • Unlike ESD events, EOS is the result of "long" duration stress events (millisecond duration or longer) – Excessive energy from turning off inductive loads – Load Dump – Extended operation at junction temperatures > 150degC – Repetitive excessive thermal cycling – Excessive/extended EMC exposure, etc. • EOS often results in large scorch marks, discoloration of metal, melted metallization and/or bond wires, and massive destruction of the semiconductor component What is Electrical Over Stress (EOS)? • Failures from EOS can result in the following: – Hard failure: failure is immediate and results in a complete non-operational device – Soft failure: EOS results in a marginal failure or a shift in parametric performance of the device – Latent failure: At first the EOS results in a non-catastrophic damage but after a period of time further degradation occurs resulting in a hard or soft failure EOS: Thermal Lifetime Curve Lifetime Point of accelerated device qualification 10 000 h Lifetime curve for device worst case parameters 1 000 h 100 h 270°C 10 h app. 350°C 170°C 1h Irreversible damage Overtemperature shutdown 0.1 h Ⅰ Spec valid, full lifetime, full function 150°C Ⅱ 220°C 260°C Soldering Device temperature 200°C Ⅲ 270°C Spec restricted, No spec, no permanent damage, reduced lifetime, highly reduced lifetime, limited functionality no function guaranteed 350°C Ⅳ Device destruction, irreversible damage, permanent out of control What is Electrical Over Stress (EOS)? • What indicates EOS? Degradation/recrystalisation of metal (≥400ºC) ---also repetitive fast transients<100ºC Scorched/Melted metal (≥650ºC) Melted silicon (≥1200ºC) EOS Failure Signatures---Generalities Visualization of single- and repetitive pulse events max. Chip temperature : single mode melting point in thermal hot spot repetitive mode number of cycles 1 (e.g.)102 106 This isn‘t a completely black & white effect, but there can be a significant difference in single- and repetitive pulse failure signatures EOS: Failure signature from excessive inductive turn-off energy • Example – Inductive clamp single pulse IDS(start)=10A, t=11.8 ms, T=25°C, Vbb = 12V I_ramp(10A/11.8ms) E=2.14 Joules Failure signature (10A): EOS at the „hot spot“ - No metal degradation - Scorch in DMOS field - NO bond fuse No metal degradation near bond EOS: Failure signature from repetitive thermal cycling combined with high current Severely degraded recrystalized metal Electrical Over Stress (EOS) • A common failure for electrical over stresses is MELTED METALLIZATION AND/OR BOND WIRES Gold Wire DC Ratings* Aluminum Wire DC Ratings* 350m 40A 50m 2.5A 25m 1A 50m 2A *Assumes TJ < 150C, TLeads < 85C, TWire < 220C, and Wire Length<3mm 125m 8A How to Electrically Over Stress Components • Put components in/out of sockets while power already applied (hot plug) • Applying electrical signals which exceeds a component’s ratings • Apply an input signal to a device before applying supply voltage and/or ground • Apply an input signal to a device output • Use an inexpensive power supply (supply overshoot) • Provide insufficient noise filtering on the board’s input line(s) • Use a poor ground with high resistance and inductance EOS Summary • Electrical over stress refers to a condition when a device is electrically stressed over its specified limits • EOS often catastrophically damages devices by degrading or melting of metallization and bond wires • Operation of devices within the specified Safe Operating Area will eliminate electrical over stress damage The ABC’s of ESD, EOS, and SOA • What is ESD – Where does ESD come from – MOSFET Gate susceptibility – Test Standards – Component level vs. module level tests • What is EOS • What is SOA Safe Operating Area (SOA) • The safe operating area is a set of conditions specified for a certain device • Within the safe operating area, the semiconductor component is specified to operate as expected • By definition, no electrical over stress occurs within the specified safe operating area SOA Graph for MOS Transistor • Single pulse, Tcase = 25C, Tjunction < 125C 4s 15s 50s 10A 200s 1ms 1A DC 0.1A 1V 10V 100V VDS, Drain-Source Voltage 1000V Pulse Width ID, Drain Current 100A SOA Graph for Linear Voltage Regulator • VOUT = 5V, Tjunction < 150C Soldered to board with 3cm2 copper heatsink IOUT, Output Current 150mA 100mA Ta = 25C Ta = 85C 50mA Ta = 125C 0A 10V 15V 20V VIN, Input Voltage 25V The ABC’s of ESD, EOS, and SOA Thank you! www.btipnow.com