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CERN TS-DEM Development of Electronic Modules Group Erik van der Bij CERN Erik van der Bij CERN TS -DEM CERN Agenda Services and organisation of TS-DEM • Organisation of files in EDMS (AB/PO) • Reliability engineering Erik van der Bij CERN TS -DEM CERN MANDATE Turn schematics into boards (standard + special) • PCB design • Manufacture of special circuits and PCBs • Assembly Erik van der Bij CERN TS -DEM Examples of ‘standard’ work TS-DEM Request Circuit or module Planning Office technological and commercial choices invoicing DEM-BE Design Office DEM-BE Subcontracting ordering, collecting components, tracking Industry DEM-BE Circuit Manufacturing Assembly Workshop DEM-PMT DEM-WS BE – Design office CERN Betty Magnin • Layout of PCB, flexible circuit, hybrid or fine-pitch detectors • Design of associated small mechanics (front-panels, crates) • Creation of schematic and padstack symbols – Cadence and PCAD/Altium libraries • Storage of manufacturing files – PCB production, assembly, bill of material all in EDMS (EDA-xxxxx) • Organisation of production and assembly Easy way to save time! – prototype quantities: in-house or local industry – larger quantities: European industry • Component purchasing service (new!) • Technical advice on manufacturing Erik van der Bij CERN TS -DEM Example of mechanics PMT – Fabrication CERN Rui de Oliveira • Special circuits – flex-rigid boards – multi-layer boards with integrated metal or pyrolytic carbon – high-definition circuits (traces and isolation 5 to 10 μm) • Thick-film hybrids – seriegraphy of conducting paste on ceramic substrates (aluminium, aluminium nitride, berillyumoxide) • Chemical treatment – thin metal sheets (copper, inox, nickel, aluminium, titanium) • Standard printed circuit boards (halogen free!) – single side to multi-layer boards (upto 14 layers, class 6) – flexible circuits (kapton) • Technical advice on material selection and processes Erik van der Bij CERN TS -DEM Transfer Image CERN Percage Erik van der Bij CERN TS -DEM Electrical test CERN Erik van der Bij CERN TS -DEM CERN WS – Assembly workshop Betty Magnin • Mounting of components – through-hole – BGA downto 0.8 mm pitch – resistors and capacitors downto 0201 size • • • • • • Replacing of components, including BGA Production of cables (coax, flatcables, twisted pair) Wiring of crates 30-minute express service for small interventions Cleaning of boards Technical advice – component selection and manufacturing Erik van der Bij CERN TS -DEM CERN Condensation oven Erik van der Bij CERN TS -DEM CERN Cleaning of circuits After cleaning Before cleaning Erik van der Bij CERN TS -DEM CERN Turn-around time Prototype electronics production multi-layer PCB, standard priority Layout PCB fabrication Queue Layout (and queue) 2-3 weeks 1-2 weeks 4 weeks 3 weeks Assembly Margin 2 weeks 1 week • This time can be reduced if necessary! • PCB fabrication can handle 2 urgencies per week – e.g. double sided PCB in 1 day, single sided 0.5 day • Replacement of component: 30 minute service Erik van der Bij CERN TS -DEM CERN PCB Delivery times Urgent [days] Type Single sided Double sided with metallised vias 1 4 and 6 layer with metallised vias > 8 layers with metallised vias 3 or 6 3 or 6 Standard [days] 1 5 10 15 • Fast track PCB layout (since July 2007): • Small jobs (estimated ≤ 2 days) will be started immediately or on next day Erik van der Bij CERN TS -DEM CERN Example: Urgent full project for PH • • • • Layout and PCBs needed ASAP Received request 7 March 2007 Same day layout finished! 4 PCBs ready on Friday 9 March, rest on Monday after • Assembled 1 PCB on Friday 9 in evening, second finished on the 12th. Erik van der Bij CERN TS -DEM CERN Example: Urgent project for AB/CO • Layout ready: three different PCBs needed ASAP • Needed really fast: – no solder maks or silkscreen finish needed • • • • Design files given Friday 30 March 7:00 PCBs ready same day at 15:00! Could have assembled connectors if needed Two weeks later tests finished, production of series requested Erik van der Bij CERN TS -DEM CERN Conclusions • DEM provides you a turn-key solution – from your schematics to assembled boards – all services close to the engineers – production in small to medium quantities – advice on manufacturing (material, components, processes) • DEM has contracts with industry – local industry for prototyping – in other CERN member states for medium scale production • The service can save you a lot of time and cost Erik van der Bij CERN TS -DEM http://cern.ch/dem CERN DEM on the web DEM on the web! Erik van der Bij CERN TS -DEM CERN PCAD to Altium • PCAD stops support after 2006 – With ELEC committee IT decided to move to Altium – Altium can read PCAD schematics and PCB layout – Altium is a bit more difficult to use (notably PCB layout) – Presentation on Tuesday 10/7 (amphi bld. 30, 8:30-12:15) – Two day courses will be given from September on – Pilot course in July Erik van der Bij CERN TS -DEM CERN Storage of design files in EDMS Files stored in EDMS since 2002 http://edms.cern.ch/nav/eda-xxxxx BE: Schematics, PCB design & production, BOM & assembly files, mechanics User: specification, images, supplier info • Handling of 'executions' since 2006 project with AB/PO Erik van der Bij CERN TS -DEM Enregistrement des cartes fabriquées par TS/DEM GEREG HCREHAR002 Selon convention signée par AB-PO et TS-DEM (Document EDMS 801714 v1) Code de fabrication TS-DEM: EDA-xxxxx-Vx-x Code d’exploitation AB-PO : HCRBSxxxxx 1 carte: HCRBSxxxxx = EDA-yyyyy-Vx-x Un dossier de fabrication unique Christophe Mugnier :Présentation du 16 Juin 2006 Dossiers de fabrication TS/DEM Christophe Mugnier :Présentation du 16 Juin 2006 Dossiers de fabrication TS/DEM - Identification d'une carte Etiquette apposée par l’assembleur sur le connecteur dans le cas d’une exécution. La sérigraphie de la face avant : Elle comporte le code EDA et la désignation de la carte. La sérigraphie du print: Elle comporte le code EDA+la version et la désignation de la carte. Dossiers de fabrication TS/DEM - Identification d'un chassis La sérigraphie de la face avant : Elle comporte le code EDA et la désignation du chassis. Etiquette apposée par l’assembleur pour spécifier la version. Dossiers de fabrication TS/DEM - Example en EDMS Example: http://edms.cern.ch/nav/eda-01586 CERN Reliability engineering In development phase: qualitative strategy – Find weak points fast - whatever it takes • Accelerated testing: quantative strategy – get idea of final reliability – concepts (without acceleration) also valid to get data for our installed base Ideas from Hobbs Engineering course "Demonstrating Reliability Requirements with Accelerated Testing" and book "Accelerated Reliability Engineering - HALT and HASS" http://hobbsengr.com, see also http://weibull.com Erik van der Bij CERN TS -DEM CERN Stress-Strength "Non-interference" Erik van der Bij CERN TS -DEM CERN Qualitative strategy Erik van der Bij CERN TS -DEM CERN Effect of qualitative testing Erik van der Bij CERN TS -DEM CERN HALT Erik van der Bij CERN TS -DEM CERN Time Unreliability Probability Unreliability PDF to CDF Time Erik van der Bij Time CERN TS -DEM CERN Weibull function handles all shapes Erik van der Bij CERN TS -DEM CERN Paperclip example Erik van der Bij CERN TS -DEM CERN Calibrated Accelerated Lifetime Test Erik van der Bij CERN TS -DEM CERN Example of Voltage CALT Erik van der Bij CERN TS -DEM CERN Example of Tcycle CALT Erik van der Bij CERN TS -DEM CERN Wiper graph Erik van der Bij CERN TS -DEM CERN A serious test flow Erik van der Bij CERN TS -DEM CERN Conclusions • Development – have fun with your cards and 'burn' a few. You learn a lot! – temperature, voltage, vibration, on/off cycles... • Know (measure) the environment of your cards – e.g. on-time, on/off cyles and temperature variations – is needed to calibrate acceleration factors • Measure precisely the on-time, on/off cycles etc of each card to know precisely when failed – allows Weibull plotting and gives invaluable reliability data Erik van der Bij CERN TS -DEM