Download Device Interface Board for Wireless LAN Testing

Device Interface
Board for Wireless
LAN Testing
Faculty Advisor
Dr. Weber
Team
May 06-15
Team Members
Matthew Dahms – EE
Justine Skibbe – EE
Joseph Chongo – EE
Client
ECpE Department
April 26, 2006
Presentation Outline

Project Overview







Project Activities


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
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Previous Accomplishments
Technology Considerations
Present Accomplishments
Planned Activities
Resources & Schedule



Introduction
Problem Statement
Operating Environment
Intended Users & Uses
Assumptions and Limitations
End-Product Description
Estimated Resources
Schedules
Closure Materials




Additional Work
Lessons Learned
Risk & Management
Closing Summary
Figure 1: Teradyne Lab Entrance
Definitions





ASK modulation – Amplitude shift keying. In this modulation
scheme the amplitude is varied to indicate logic 0’s and 1’s
DUT – Device under test (positive edge D flip-flop)
ESD – Electrostatic discharge
FPGA – Field programmable gate array. Used to test the DUT
after receiving signals from the Teradyne tester
Header – Preamble bits sent prior to the sending of information
in a data packet
voltage
1
0
1
0
D3 D2
D1 D0
time
Header
Data Packet
Figure 2: Data Packet and Header
Definitions (cont.)





NRZ – Non-return to zero. Using NRZ, a logic 1 bit is sent as a high
value and a logic 0 bit is sent as a low value.
PLL – Phase-locked loop
RZ – Return to zero. This is the opposite of NRZ data. The signal state
is determined by the voltage during the first half of each data binary
digit. The signal returns to a resting state (called zero) during the second
half of each bit.
S/R Network – Send/Receive network. A combination of transmitters and
receivers.
Teradyne Integra J750 – Tester donated to Iowa State University by
Teradyne. It is used in the testing of printed circuit boards and integrated
circuits.
Project Overview
Acknowledgement
Dr. Weber
 Nathaniel Gibbs
 Jason Boyd
 Rob Stolpman

Project Overview

Problem Statement
 In
Fall 2004, ISU’s ECE Department introduced
a senior design project with the goal of
developing a wireless interface capable of
receiving test signals and transmitting results
to the department’s Teradyne Integra J750
tester.
 For this project, the goal is to modify the
current setup so that the wireless interface
shall be capable of recovering a clock signal
transmitted by the Teradyne system.
Figure 3: Teradyne Integra J750
Project Overview

Operating Environment
 Operates
in a controlled laboratory where the
temperature range is 27°C to 33°C
 Should be protected from ESD
Project Overview

Intended Users




The user has knowledge in electrical and/or computer
engineering.
The user has previous experience testing circuits with the
Teradyne J750.
The user is familiar with Verilog programming language.
Intended Uses


Functional test of a digital device via wireless interface
(Future) Wireless chipset test
Project Overview

Assumptions

A sufficient clock-training signal can be sent by the Teradyne
J750 over the S/R network to initialize the clock recovering
circuitry.
 The clock recovering circuit will be able to interact with the
existing FPGA.
 The current wireless communication network can transmit up to
five feet. This assumption is based on the May05 team’s
documentation.
 The phase difference between the system clock of the
Teradyne J750 and the recovered clock at the wireless
interface will not be greater than the overall system clock
frequency.
Project Overview

Limitations





The Teradyne J750 is sensitive to temperature fluctuations
and must operate within the calibrated temperature range.
To avoid the loss of data, the maximum rate at which user
can send data is at 115.2 Kbps.
The existing transmitter and receiver communicate at 916.5
MHz. Therefore, nearby wireless signals at similar
frequencies may disrupt the setup.
The communication link shall be limited to one frequency.
Limited to using only one FPGA. Using two FPGA’s, it
would be possible to encode/decode the clock and test data
into a single data stream.
Figure 4:
Temperature
Requirements
Project Overview

End-Product and Other Deliverables
 Wireless
interface with clock recovering circuit
 Demonstration of wireless test
 Update the manual for wireless test operation
Figure 5: Cover page of wireless manual
Project Activities
Project Activities – Previous

Parallel-Serial Conversion


Needed to convert parallel data into serial data for
transmission over the S/R network
Chose to use a shift register
Figure 6: Shift Register attached to daughterboard
Project Activities – Previous

Transmitters and Receivers
TRM1
TRM2
RCV1
Figure 7: Tx/Rx
PCBs
RCV2
Project Activities – Previous

FPGA
 Used
to recognize header signal
 Identifies test data
 Presents test data to DUT
 Presents reply to S/R network
Figure 8: FPGA
Figure 9: Final System Setup
Project Activities – Present

Present Accomplishments
Hardware
Previous team’s project setup and tested
PLL tested
NRZ/RZ converter tested
PCB milled & soldered
Software
Prototype control software for FPGA written
IG-XL test template written
Project Activities – Definition

Definition Activities
 Initially
wanted to test wireless chipset
 May 05-29: Redefined project as “proof-ofconcept” that J750 can wirelessly test a
device
 May 06-15: Incorporate clock recovering
circuit and the DUT onto a PCB
Project Activities – Research

Research Activities
 Clock
recovery
What is it?
 How to implement it?

 Teradyne
How do IG-XL templates work?
 How to send data?

Project Activities – Approach

Approach Considered & Used
 Technology

Considerations
Clock recovery
Manchester encoding
 PLL & NRZ/RZ converter combination


Software
VHDL
 Verilog

Project Activities – Approach
Manchester Encoding
Original Signal
Value Sent
Logic 0
0 to 1 (upward transition at
bit centre)
Logic 1
1 to 0 (downward transition
at bit centre)
The waveform for a Manchester encoded bit
stream carrying the sequence of bits 110100
Figure 11: Graphical representation of Manchester encoding
Project Activities – Approach

Manchester Encoding
 Advantages
Very easy to implement
 Clock phase and frequency are both present

 Disadvantages

Too fast for current transmitters and receivers!
Project Activities – Approach

PLL & NRZ/RZ converter combination
 Advantages

Don’t have to build new transmitters and receivers
 Disadvantages
PLL Must be “trained”
 Test data must follow a training signal
 NRZ/RZ converter needed

Project Activities – Approach
Figure 10: Phase locked loop transient response a) Output of PLL when locked onto input of PLL b) PLL losing lock
when no input is present
Project Activities – Approach

Software

VHDL

Advantages



Disadvantages


Able to handle abstract levels of logic
More powerful than Verilog
This team has no experience using VHDL
Verilog

Advantages



More intuitive
Previous team’s code was based on Verilog
Disadvantages

No libraries for use in high-level constructs
Project Activities – Approach

Hardware chosen - PLL & NRZ/RZ converter
combination

Language chosen - Verilog
Project Activities – Design
Figure 12: Internal Components of a PLL
Project Activities – Design

Phase Detector
I – XOR
 *Type II – Generates lead or lag pulses
 Type

Voltage Controlled Oscillator (VCO)
 Centered
at 115.2 KHz
 Frequencies too far off of center frequency will
not lock
Project Activities – Design

NRZ/RZ Converter: Monostable
Multivibrators
 Chosen
to convert NRZ data to RZ data
 Must use an external RC combination to
specify pulse widths
Project Activities – Design
Figure 14: NRZ to RZ converter circuit with I/O waveforms
Project Activities – Design
System Block Diagram
Figure 10: Proposed final setup block diagram
Project Activities – Implementation

Implementation Activities
 Created
clock recovering circuit on
breadboard
 Created PCB layout for final end-product
 Created IG-XL test template
Completed PCB
Breadboard implementation of NRZ/RZ
converter, PLL, & DUT
Project Activities – Implementation

Problems encountered
 Pin
mapping
FPGA grounding problem
 Errors uploading program to FPGA

 Parasitics
using breadboard setup
Leads on capacitors
 Crosstalking

Project Activities – Testing

Plan of attack
 Test components individually w/ function
generator & oscilloscope
 Simulate code
 Test components individually on breadboard
w/ J750
 Test PCB components
 Test code w/ J750
 Test integrated system
Project Activities - Testing
FPGA Code
 Works well in simulation:

Able to recognize header
 Able to isolate PLL
 Able to send data to DUT
 Able to reset for additional sets of test data

In practice: Some features of Verilog cannot
be implemented by an FPGA. In addition to
this, the same register may not be used in
multiple “always” block statements.
Resources &
Schedule
Actual
Schedule
Original
Revised
Actual
Schedule (cont.)
Original
Revised
Personnel Effort (as of April 26)
Personnel Time Commitment
Personnel
Problem
Definition
Technology
Considerations
and Selection
EndProduct
Design
End-Product
Prototype
Implementation
EndProduct
Testing
End-Product
Documentation
End-Product
Demonstration
Project
Reportin
Total
Matt Dahms
9
15
33
40
16
8
7
42
170
Joe Chongo
10
26
50
85
20
0
2
26
219
Srisarath
Patneedi
8
10
42
0*
0*
0*
0*
10*
70*
Justine
Skibbe
10
11
39
47
14
5
16
28
170
Total
37
62
164
172
50
13
25
106
629
*Completed hours
** Left on Co-op
Previous Team Resources
Financial Resources (w/ labor)
Item
W/O Labor
With Labor
Parts and Materials:
a. Printing of project poster
Donated
Donated
b. Teradyne Integra J750 Test System
Donated
Donated
c. Clock Recovery Chips (2)
$3.86
$3.86
d. Dual Monostable Multivib
$0.53
$0.53
e. Supplementary (Res, Cap, etc.) (D)
$10.00
$10.00
f. Voltage Regulators (D)
$2.26
$2.26
g. ZIF w/DIP to SOIC Converter (D)
$38.60
$38.60
h. SOIC CMOS Arrays (2) (D)
$1.00
$1.00
i. SOIC Schmitt Trigger (D)
$0.37
$0.37
j. SOIC PLL (D)
$1.93
$1.93
Labor at $12.00 per hour:
a. Matthew Dahms
$2,040
b. Joseph Chongo
$2.628
c. Srisarath Patneedi
$840
d. Justine Skibbe
$2,040
Subtotal
$7,548
Total
$58.55
$7,606.55
Closure Materials
Closure Materials – Project Evaluation
Milestone
Current
Progress
(%)
Scheduled
Progress
(%)
Evaluated
Status
Evaluation
Score (%)
Weight
Total
Project Definition
100
100
Exceeded
Criteria
100
16
16
Technology Selection
& Usage
100
100
Exceeded
Criteria
100
12
12
End-Product Design
100
100
Exceeded
Criteria
100
15
15
End-Product
Implementation
75
100
Partially Met
Criteria
80
10
8
End-Product Testing
85
100
Partially Met
Criteria
80
15
12
End-Product
Documentation
(Manual)
90
100
Partially Met
Criteria
80
10
8
End-Product
Demonstration
40
100
Did Not Meet
Criteria
50
12
6
Project Reporting
(Deliverables)
100
100
Exceeded
Criteria
100
10
10
100
87
Total
Closure Materials Commercialization

Unlikely
 Low
Speed
 Immobile
 Inflexible
 Cost Inefficient
Closure Materials - Additional Work
Consider building faster TX/RX
 Consider using Manchester
encoder/decoder
 Allow for more advanced DUTs

Closure Materials - Lessons Learned
 Circuit
debugging techniques
 FPGA implementation
 Verilog
 Timing considerations
 Clock recovery
 Circuit board layout
Closure Materials - Lessons Learned

What went well?
 Teamwork
 Record
keeping
 PCB

What did not go well?
 Damaging
parts
 Inefficient trouble shooting
 FPGA implementations
Closure Materials –
Risk Management
 Risk: Losing Team Member
 Management: All
members keep detailed &
organized notes

Risk: Loss of Data
 Management: All
data will be backed up using
team gmail account

Risk: Parts Malfunction
 Management:
Meticulous care in ESD
procedures (using ESD bands)
Closing Materials

Closing Summary
– Integrate clock recovery circuitry
into current system
 Solution
 Problem
Use PLL for clock recovery
 Modify FPGA program to incorporate new
components

Questions?
Questions???
Thank You