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CREST R&D GRANT APPLICATION FORM REV3.0 Reference No: CREST RESEARCH APPLICATION FORM One (1) hardcopy and softcopy (email : [email protected]) of this form must be submitted to the Collaborative Research in Engineering, Science & Technology (CREST) Center, Research & Development Division, Block C, Ground Floor, SAINS@USM, No. 10 Persiaran Bukit Jambul, 11900 Bayan Lepas, Penang, Malaysia. (http://www.mycrest.com.my) [Incomplete Applications will not be reviewed] DETAILS OF RESEARCHER Name of Project Leader: Dr. Fakhrul Zaman Rokhani Position: Senior Lecturer Office Telephone No: +603-8946-6434 / +6019-775-7007 E-mail Address: [email protected] NAME OF ORGANISATION Universiti Putra Malaysia LOCATION OF RESEARCH : Faculty of Engineering, University Putra Malaysia, 43400 UPM Serdang Selangor, Malaysia CREST R&D GRANT APPLICATION FORM REV3.0 COMPANY INFORMATION Company Name: Silterra Malaysia Sdn. Bhd. Address: Lot 8, Phase II Kulim Hi-Tech Park 09000 Kulim Kedah Darul Aman, Malaysia Company No: 368948-D Brief description of Company: Silterra is a project of strategic national interest to promote front-end semiconductor manufacturing and a catalyst for high technology investments in Malaysia. It was founded in November 1995 as Wafer Technology Malaysia Sdn Bhd and was renamed as Silterra Malaysia Sdn Bhd in December 1999. Since its inception, Silterra has served many top-tier global fabless design and product companies covering the consumer electronics, communications & computing, and mobile device market segments. Silterra provides complete design solutions for customers to create leading-edge products, optimized for its highyielding manufacturing processes, through strategic partnerships with industry-leading Intellectual Property (IP) design library providers, Design Services and Electronic Design Automation (EDA) suppliers. Silterra also offers comprehensive in-house Failure Analysis (FA) services to high-tech companies and universities, performing detailed construction and failure analysis of nano-scale structures. Silterra offers CMOS design and a broad range of fabrication processes for Integrated Chips (IC) in Advanced Logic, Mixed Signal & Radio Frequency and High Voltage applications. Company’s role in the project: 1. To provide technical support in terms of the design of standard cells including layout design, impact of variation investigation, circuit simulation, characterization and testchip design. 2. To provide manufacturing support in terms of Multi Project Wafer (MPW). Note: (1) If more than one company is involved, please provide information about the primary company and include information on the other companies in attachments. (2) Please attach a support letter signed by Company’s top management. CREST R&D GRANT APPLICATION FORM REV3.0 ACADEMIA INFORMATION University Name: Universiti Putra Malaysia Address: Faculty of Engineering, University Putra Malaysia, 43400 UPM Serdang Selangor, Malaysia Brief description of University: UPM, a leading research university in Malaysia is located in Serdang, next to Malaysia’s administrative capital city; Putrajaya. As a world renowned centre of learning and research, UPM has attracted students and staff from all around the world making it a well-respected global entity. UPM is recognised by the independent government assessments as one of Malaysia's leading research Universities. Founded in 1931 as the School of Agriculture, the University today combines impressive modern facilities and a dynamic approach to teaching and research with its proud heritage of quality services and achievements. VISION: To become a university of international repute. MISSION: To make meaningful contributions towards wealth creation, nation building and universal human advancement through the exploration and dissemination of knowledge. Historically, UPM and Silterra has been working closely in the design of standard cell library on Silterra 130nm process where UPM focus was on validating various design metrics of the standard cell library. University’s role in the project: 1. To architect the standard cell library with energy-efficient optimization, to design circuits and layout of the cells, to compile the standard cells into library, to design test chips and conduct investigation on the impact of process variation to the standard cell library performance. 2. To ensure the project runs per schedule and each milestone is delivered. Note: (1) If more than one university is involved, please provide information about the primary university and include information on the other universities in attachments. (2) Please attach a support letter signed by University’s head of department / dean. CREST R&D GRANT APPLICATION FORM REV3.0 PROPOSED RESEARCH TEAM MEMBERS: Name Organisation Position Highest Academic Qualification/ Designation Email 1 Dr. Roslina Mohd Sidek Universiti Putra Malaysia Associate Professor PhD roslina@e ng.upm.ed u.my 2 Dr. Shaiful Jahari Hashim Universiti Putra Malaysia Senior Lecturer PhD shaiful@e ng.upm.ed u.my 3 Dr. Noor Ain Kamsani Universiti Putra Malaysia Senior Lecturer PhD nkamsani @eng.up m.edu.my 4 Mr. Park Sang Hyun Silterra Member of Technical Staff Degree sanghyun _park@silt erra.com 5 Mr. Chan Chee Kean Silterra Senior Engineer 2 Master cheekean _chan@sil terra.com 7 Mrs. Nur Liyana Binti Jasni Silterra Engineer Degree nur_liyana 1@silterra .com 4 Dr. Subhash Rustagi Silterra Deputy Director PhD subhash_r ustagi@sil terra.com Signature CREST R&D GRANT APPLICATION FORM REV3.0 A A(i) RESEARCH INFORMATION TITLE OF PROPOSED RESEARCH : Standard Cell Library Design and Validation Under Variability Influence for Energy Efficient System-onChip Application A(ii) Research Area (Please tick ( √ ): Industrial Cluster √ Semiconductor Solar Optoelectronics Industrial Electronics Others A(iii) Duration of this research (Maximum 36 months): Duration: ___36 months________ CREST R&D GRANT APPLICATION FORM REV3.0 B Executive Summary of Research Proposal (maximum 300 words) (Please include the background of research, literature reviews, objectives, research methodology and expected outcomes from the research project) The major challenge in designing next-generation System-on-Chip (SoC) has been shifted from absolute timing to meeting timing without blowing out the power budget. Energy-efficiency has become the key differentiator in many products especially in mobile devices. Efforts in designing energy-efficient SoC for green computing have spurred at various design level to ensure the final chip is not a “dark silicon” design. The fundamental element of the SoC’s digital block is the standard cells, generally occupying a large segment of any SoC designs. Standard cell-based or Application Specific IC (ASIC) design are widely adopted in designing multi-million transistors chip due to the fast turn-around time and highly scalable with design complexity. Worldwide market for ASIC design was reported around US$37B in 2010 and projected for a 12% annual growth up to 2016. To date, no comprehensive optimization effort on such standard cell design for energy-efficient application is reported. In this project, energy efficient CMOS standard cell library based on Silterra 90nm process will be designed. Cross-layer optimization at the architecture, circuit, layout and process level is proposed to mitigate both dynamic and static power. Special cells to support low power methodologies will be designed, circuits and layout will be fine-tuned on the new Silterra 90nm low power process. Multiple test-chips will be designed making use of the developed standard cell to validate the pre-silicon characterized data and the developed library is industry-usage ready. To address test-chip resource issue in validating pre-silicon characterized data, novel circuit architectures will be designed. The impact of sub-100nm process variation on the standard cell library will be investigated at the simulation and process level and new variation model will be developed. It is expected that a silicon validated, energy-efficient standard cell library compatible with commercial tool will be developed and the impact of process variation on standard cells performance are comprehend. The developed library is expected to boost the competency of local design houses and put Malaysia in the global SoC market map. CREST R&D GRANT APPLICATION FORM REV3.0 C DETAILED PROPOSAL OF RESEARCH PROJECT: (a) Research background including Problem statement and research methodology. Energy-efficiency metric has become the key differentiator in many System-on-Chip (SoC) products especially in mobile computing devices and servers. With the green computing and integration of more chips, the chip design paradigm has shifted from absolute timing optimization to meeting timing without blowing out the power budget. This new design optimization is utmost important to ensure that the chip can run at the targeted operating frequency with acceptable power density. High chip’s power density leads to frequent battery charging for mobile devices and cooling and reliability issues for all types of devices. Recently, there has been an alarming report on “dark silicon” phenomena in which the percentage of a chip that can be actively powered on within a chip's power budget is dropping exponentially [1]. This reality will force designers to ensure that, at any point in time, large fractions of their chips are effectively dark or dim – either idle or significantly underclocked which does not embrace the best out of Moore’s law scaling. SoC is the core of most embedded computing and electronic equipment, eg: smartphone, tablet, media players, computer, aerospace, medical electronics and etc. Current global SoC market value is at USD85.9B and is expected to grow to USD212 bilion in 2016, commanding more than 85% control of global IC market [2]. The fundamental element of the SoC’s digital block is the standard cells, generally occupying a large segment (in the order of 70-80%) of any SoC designs. Thus, optimizing the standard cell libraries to achieve very low power libraries will give significant impact to the final energy efficiency of any SoC design. The standard cells are typically provided in the form of a library having many choices for cell types, cell sizes, delays, power and drive-strengths. The library is formatted to be compatible with available Electronic Design Automation (EDA) tools from well established EDA vendors such as Mentor Graphics, Synopsys and Cadence among others. Worldwide market for standard cell-based design or Application Specific IC (ASIC) design was reported around US$37B in 2010 and projected for a 12% annual growth up to 2016. From the business perspective, high growth of ASIC market is largely contributed by the well structured standard cell library networks initiative - Open Innovation Platform pioneered by TSMC [3]. Through this open platform, over more than 40 standard cell suppliers based on TSMC Process Design Kit (PDK) provide the opportunity for TSMC’s customers to choose the best cost-effective design solution for their product. From the technical standpoint, standard cell-based design are widely adopted in designing multi-million transistors SoC due to the fast turn-around time, highly scalable with increase design complexity and usually guaranteed first time successful silicon implementation. With advanced technologies, the process characteristics become more remarkably complex and process variations comes into play, thus to ensure manufacturability, designers are restricted with large number of design rules [4]. This indicate increasing challenges in the layout design employing the non-standard cell based design flow (i.e. analog design flow) for designing large blocks. This can be seen as there is a clear trend of implementing analog blocks based on digital standard-cells, like the all-digital phase locked loop (ADPLL) and all-digital analog-to-digital converter (ADC) [5], [6]. Energy-efficient standard cell library is a library of cells that consumes less energy and power compared to the cells in the general standard cell library. Previous works in energy efficient standard cell library can be categorized into 2 groups which are dynamic power and leakage power optimization. Under the dynamic power optimization, approaches include track size optimization [7], cell drive strength optimization [8-10], transistor beta ratio sizing [11, 12], selection of cells to be included in the library [10, 13], low-power library flip-flop registers [10, 14], low operating voltage standard cell design at sub-threshold voltage [15] and novel logic circuits [16]. Hybrid techniques to mitigate dynamic power in standard cell include the optimization of cell drive strength and transistor sizing [8-9], optimization at the circuit level, macro-block and layout level [14] and optimization of cell drive strength, transistor sizing and low-power flip-flop [10]. Techniques in mitigating leakage power include novel circuit structure [17] and multi-threshold voltage transistors application [18]. To the best of our knowledge, there is no work on exploring cross-layer optimization between library architecture, circuit and layout optimization for a particular low power process to achieve energy-efficient standard cell library, which is the focus of this project. Today's sophisticated standard cell libraries require simulation models that match the actual silicon performance to avoid exposing ASIC customers to costly design iterations. For any library based approach, the complete electrical characterization model of logic gates is required before applying them in the IC design flow. Such characterization model shall be accurately performing under different design parameters, i.e. signal input slopes, CREST R&D GRANT APPLICATION FORM REV3.0 output capacitive loads and design corners (temperature, power supply and process parameters variation). In most cases, post-silicon library validation will be conducted on the standard cell library to assess the correlation between the timing, power consumption and noise characterization model with the data from silicon and to check the quality of the library working with EDA tool. Two approaches have been proposed in the literature to conduct the library qualification. To assess the quality of the standard cell library working with EDA tool, test chip comprised of medium size to large digital blocks exercising as much library cells are designed using commercial synthesis and place-and-route tools. Quality of results (QOR) of the designs is analyzed to understand the performance of the library at work with the commercial tool. Second approach is to design the Test Element Group (TEG) chip, which is a special purpose fabricated chip used to assess the correlation between library models and the silicon data in terms of the cell function, timing, power and noise characterization. These works can be categorized into two groups, one focusing on combinational logics [18-23] while the other focused on sequential cells including latch and flip-flop [24-27]. Issues in designing the TEG chip includes the constraint resources in terms of input and output pins, single point as opposed of library cell tables validation, pins validation for multi-input cells, parametric variations and the presence of soft defect [28]. In this project, both approaches to assess the the correlation between timing and power consumption of characterized model with the silicon data and the quality of the library working with EDA tool will be conducted. In particular, new circuit structures for TEG circuits will be designed to address design issues of resource constraints and validation pins for multi-input cells. Process variability also has become increasingly problematic in device scaling. It causes circuit layout or electrical parameters to vary from the designed values, and hence can lead to catastrophic or parametric yield losses. The device process variability can be categorised into global and local variations. In global variation, the physical parameter variations induced by manufacturing processes (i.e. inaccuracy of process parameters and non-uniformity of the fabrication equipment) such as the oxide layer thickness, gate length and doping concentration change gradually across the chip/wafer. Local variation, which is associated with the fluctuations of physical or electrical parameters of transistors within a die, arises due to the physics of manufacturing process. It can further be divided into systematic and random variations. Systematic variation is the component of the physically varying parameters that follow a well understood behaviour and can be predicted or modelled up-front. Examples of systematic variations are the optical proximity effect [29], layout mediated strain [30] and the well proximity effect [31]. Random variations or also known as the intrinsic parameter fluctuations (IPF), arises from the discreteness of charge and the granularity of matter. IPF can be further categorized into random discrete dopant (RDD), line edge roughness (LER) and oxide thickness variation (OTV) [32-34]. They have become prominent in extremely scaled devices as the physical device dimensions approach the atomic scale affecting design, yield and pose difficulties in circuit simulation and verification for future technology nodes. Variability in standard cells comes from the process and operating condition variations. Standard cell libraries for integrated circuits are specified to meet operating standards across a range of defined variations [35]. Related study on standard cell library variability include defining metrics for comparing variability among standard cells [36], characterization methodology including statistical techniques and new circuits design to quantify variability in combinational and sequential cells [35, 37-39] and design technique to increase the cell’s tolerant to variability [40]. In this research, we will investigate the impact of process variation on the performance of the standard cell library through both simulation and process-level approach and new variation model for standard cell performance on Silterra 90nm low power process will be developed. The aim of this research is to develop silicon validated, energy-efficient standard cell library which is highly compatible with commercial synthesis, place and route tool. In particular, new cross-layer optimization from the architecture, circuit, layout and process level will be explored to mitigate both dynamic and static power. Special cells to support low power methodologies will be designed, circuits and layout will be fine-tuned on the new Silterra 90nm low power process. In order to assess the correlation between pre-silicon characterized data with the silicon data, TEG circuits based test-chips will be designed. Specifically, new circuit architectures for TEG circuits will be designed to address design issues of resource constraints and pins validation for multi-input cells. Medium to large size digital blocks will be designed using commercial synthesis and place and route tool to qualify that the developed standard cell library is industry-usage ready. Investigation on the impact of Silterra 90nm process variation to the standard cell library will be conducted at the simulation level and process-level. At process-level, variation will be deliberately introduce during fabrication and it is expected new variation model illustrating the impact to standard cell performance will be developed. It is expected that the developed standard cell library can boost up the competency of local design houses through the offering of high-quality library at high-end process and put Malaysia in the global SoC market map. CREST R&D GRANT APPLICATION FORM REV3.0 References 1. Esmaeilzadeh, H. ; Blem, E. ; St. Amant, R. ; Sankaralingam, K. ; Burger, D., “Dark Silicon and The End of Multicore Scaling, IEEE Micro Vol. 32, Issue 3, pp. 122-134, 2012. 2. Global Mixed Signal System-on-Chip (MxSoC) Market by Intellectual Property (IP), Design Architecture, Fabrication Technology, Processor Type, Technology Nodes & Applications 2011 – 2016, Link: http://www.marketsandmarkets.com/Market-Reports/system-on-chip-market-444.html Last accessed: March 1, 2013. 3. Open Innovation Platform, Link: http://www.tsmc.com/english/dedicatedFoundry/services/oip.htm, Last accessed: March 8, 2013. 4. Tsuchiya, A., “LSI Design Flow Development for Advanced Technology,” FUJITSU Sci. Tech. Journal, Vol. 49, No. 1, pp. 110–116, 2013. 5. Wang, P.-Y., Zhan, J.-H. C., Chang, H.-H., Chang, H.-M. S., “A Digital Intensive Fractional-N PLL and AllDigital Self-Calibration Schemes, IEEE Journal of Solid-State Circuits, Vol. 44, No. 8, pp. 2182-2192. 2009. 6. Watanabe, T., Terasawa, T., “An All-Digital ADC/TDC for Sensor Interface with TAD Architecture in 0.18-μm Digital CMOS,” 16th IEEE International Conference on Electronics, Circuits, and Systems, 2009 (ICECS 2009), pp. 219-222, 2009. 7. ARM, Standard Cell Library http://www.arm.com/products/physical-ip/logic-ip/standard-cell-libraries.php Last accessed: 25 February 2013. 8. Afonso, R., Rahman, M. A., Tennakoon, H., Sechen, C. M., “Power efficient standard cell library design,” 2009 IEEE Dallas Circuits and Systems Workshop,(DCAS), pp. 1-4, 2009. 9. Rahman, M. A., Afonso, R., Tennakoon, H., Sechen, C. M., “Design automation tools and libraries for low power digital design” 2010 IEEE Dallas Circuits and Systems Workshop (DCAS), pp. 1-4, 2010. 10. Alvandpour, A. Svensson, Ch., “Improving Cell Libraries for Low Power Design”, Proc. PATMOS’96, pp. 317-325, 1996. 11. Kung, David S., Puri, Ruchir, “Optimal P/N width ratio selection for standard cell libraries” Digest of Technical Papers of IEEE/ACM International Conference on Computer-Aided Design, pp. 178-184, 1999. 12. Fisher, C., Blankenship, R., Jensen, J., Rossman, T., Svilich, K., “Optimization of standard cell libraries for low power, high speed, or minimal area designs,” Proceedings of the IEEE Custom Integrated Circuits Conference, 1996, pp.493-496, 1996. 13. Minh Duc, N. Sakurai, T., “Compact yet high-performance (CyHP) library for short time-to-market with new technologies,”. Proceedings of the Asia and South Pacific Design Automation Conference, 2000 (ASP-DAC 2000), pp. 475-480, 2000. 14. Dragone, N., Guardiani, C., Zafalon, R., Meier, P., “An Innovative Methodology for the Design Automation of Low Power Libraries,” Proc. Int. Workshop Power and Timing Models, Optimization and Simulation (PATMOS), 1998. 15. Amarchinta, S., Kanitkar, H., Kudithipudi, D., “Robust and high performance subthreshold standard cell design,” 52nd IEEE International Midwest Symposium on Circuits and Systems, 2009 (MWSCAS '09), pp.1183-1186, 2009. 16. Lotze, N., Manoli, Y., “A 62 mV 0.13um CMOS Standard-Cell-Based Design Technique Using SchmittTrigger Logic,” IEEE Journal of Solid-State Circuits, Vol. 47 , Issue. 1, pp.47-60, 2012. 17. Lakshmikanthan, P., Sahni, K., Nuñez, A., “Design of Ultra-Low Power Combinational Standard Library Cells Using A Novel Leakage Reduction Methodology,” 2006 IEEE International SOC Conference, pp.93-94, 2006. 18. Lu, L.-Y., Chen, K.-Y, Wu, T.-Y, “High Performance and Low Leakage Design Using Cell Replacement and Hybrid Vt Standard Cell Libraries,” Proceedings of the International Multiconference of Engineers and Computer Scientists 2008, Vol. 1, 2008. 19. Agatstein, W., McFaul, K., Themins, P., “Validating an ASIC standard cell library,” Proceedings., Third Annual IEEE ASIC Seminar and Exhibit, pp. 12/6.1-12/6.5, 1990. 20. Badam, U., “Development of a 5V digital cell library for use with the Peregrine semiconductor silicon-onsapphire (SOS) process,” MSc. Thesis, Oklahoma State University, 2007. 21. Jain, V., “Design of 5V digital standard cells and I/O libraries for military standard temperatures,” MSc. Thesis, Oklahoma State University, 2008. 22. Lin, R.-B., Chou, I. S.-H., Tsai, C.-M., “Benchmark circuits improve the quality of a standard cell library,” Proceedings of the Asia and South Pacific Design Automation Conference (ASP-DAC'99), pp. 173-176, 1999. 23. Singh, A., Panwar, N., “On Silicon Timing Validation of Digital Logic Gates,” 25th International Conference on Microelectronics, pp.424-427, 2006. 24. Nedovic, N., Walker, W. W., Oklobdzija, V. G., “A Test Circuit for Measurement of Clocked Storage Element Characteristics,” IEEE Journal of Solid-State Circuits, Vol. 39, Issue 8, pp. 1294-1304, 2004. CREST R&D GRANT APPLICATION FORM REV3.0 25. Ribas, R. P., Reis, A. I., Ivanov, A., “Performance and functional test of flip-flops using ring oscillator structure,” 2011 IEEE 6th International Design and Test Workshop (IDT), pp. 42-47, 2011. 26. Ribas, R. P., Reis, A. I., Ivanov, A., “Ring oscillators for functional and delay test of latches and flip-flops,” Proceedings of the 24th Symposium on Integrated Circuits and Systems Design, pp. 67-72, 2011. 27. Ribas, R. P., Sun, Y., Reis, A. I., Ivanov, A., “Self-checking test circuits for latches and flip-flops,” 2011 IEEE 17th International On-Line Testing Symposium (IOLTS), pp.210-213, 2011. 28. Aitken, R. C., “The challenges of correlating silicon and models in high variability CMOS processes,” Proceedings of the 2009 International Symposium on Physical Design (ISPD’09), pp. 181-182, 2009. 29. J. N. Randall and A. Tritchkov, “Optically induced mask critical dimension error magnification in 248 nm lithography,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 16, No. 6, pp. 3606–3611, Nov 1998. 30. E. Morifuji, H. Aikawa, H. Yoshimura, A. Sakata, M. Ohta, M. Iwai, and F. Matsuoka, “Layout dependence modeling for 45-nm CMOS with stress- enhanced technique,” IEEE Transactions on Electron Devices, Vol. 56, No. 9, pp. 1991–1998, Sept. 2009. 31. T. Kanamoto, Y. Ogasahara, K. Natsume, K. Yamaguchi, H. Amishiro, T. Watanabe, and M. Hashimoto, “Impact of well edge proximity effect on timing,” 37th European Solid State Device Research Conference, 2007, pp. 115–118, 2007. 32. K. J. Kuhn, “Reducing variation in advanced logic technologies: Approaches to process and design for manufacturability of nanoscale CMOS,” IEDM Tech. Dig. Papers, 2007, pp. 471–474, 2007. 33. C.-C. Liu, P. F. Nealey, Y.-H. Ting, and A. E. Wendt, “Pattern transfer using poly(styrene-block-methyl methacrylate) copolymer films and reactive ion etching,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 25, No. 6, pp. 1963–1968, Nov. 2007. 34. K. Bernstein, D. J. Frank, A. E. Gattiker, W. Haensch, B. L. Ji, S. R. Nassif, E. J. Nowak, D. J. Pearson, and N. J. Rohrer, “High-performance cmos variability in the 65-nm regime and beyond,” IBM Journal of Research and Development, Vol. 50, No. 4.5, pp. 433–449, July 2006. 35. Aitken, R. C., “Defect or Variation? Characterizing Standard Cell Behavior at 90nm and below,” 8th International Symposium on Quality Electronic Design, 2007 (ISQED '07), pp.693-698, 2007. 36. Aitken, R. C., “DFM metrics for standard cells,” 7th International Symposium on Quality Electronic Design, 2006 (ISQED '06), pp. 496, 2006. 37. Neuberger, G., Kastensmidt, F. L., Reis, R. A., Wirth, G. I., Brederlow, R., Pacha, C., “Statistical analysis of systematic and random variability of flip-flop race immunity in 130nm and 90nm CMOS technologies,” IFIP International Conference on Very Large Scale Integration, 2007 (VLSI - SoC 2007), pp. 78-83, 2007. 38. Das, B. P., Amrutur, B. S., Jamadagni, H. S., Arvind, N. V., Visvanathan, Vish, “Within-Die Gate Delay Variability Measurement Using Reconfigurable Ring Oscillator,” IEEE Transactions on Semiconductor Manufacturing, Vol. 22, Issue. 2, pp. 256-267, 2009. 39. Bingert, R., Aurand, A., Marin, J.-C., Balossier, E., Devoivre, T., Trouiller, Y., Vautrin, F., Verghese, N., Rouse, R., Cote, M., Hurat, P., “Implementation of Silicon-Validated Variability Analysis and Optimization for Standard Cell Libraries,” Proc. of SPIE, Vol. 6925, pp. 69250M-1-69250M-12, 2008. 40. Hilder, J. A., Walker, J. A., Tyrrell, A. M., “Optimising variability tolerant standard cell libraries,” IEEE Congress on Evolutionary Computation, 2009 (CEC '09), pp. 2273-2280, 2009. (b) Objective (s) of the Research This study embarks on the following objectives: 1) To design energy efficient CMOS standard cell library through cross-layer optimization between library architecture, circuit and layout and process. 2) To perform library qualfication through silicon validating the designed standard cell library for functionality, timing and power consumption and design compliance with the commercial EDA tool. 3) To investigate and assess the impact of nanometer process variations to the standard cell library performance. (c) Please state research methodology CREST R&D GRANT APPLICATION FORM REV3.0 The research project is divided into 4 main tasks: Task 1: Energy Efficient Standard Cell Library Design The aim of this task is to design energy efficient CMOS standard cell library through cross-layer optimization between library architecture, circuit and layout and process. Special cells to support low power methodologies will be designed, circuits and layout will be fine-tuned on the new Silterra 90nm low power (LP) process. No 1 2 3 4 5 6 7 Sub-Tasks Design Planning: The architecture of the library including special cells to support low power methodology and library parameters (cell height, cell drive strength, transistor sizing, routing tracks, operating frequency, maximum loading and others) will be defined tailoring to the Silterra 90nm LP process and energy-efficient system requirement. Circuit Synthesis: The best circuit topology option for low power will be identified. Various power optimization techniques such as circuit reordering, transistor-stacking and hybrid of these techniques will be explored through schematic design to achieve lowest power consumption for every cell. Layout Creation: Cell layouts are to be drawn based on the library parameters defined earlier in the design planning phase. Layout optimization and compaction will be applied to further reduce the power consumption. Verification: Cells will be verified to ensure meeting the designers and foundry specification - design rule check (DRC), layout-versus-schematic (LVS) and electrical-rule check (ERC). Characterization: Cells will be characterized under defined temperature, operating voltage and process variation. Abstraction Export: Cell’s information will be compiled into multiple files namely the technology library (.lib), library exchange format (.lef), frame view (.fram), layout database file (.gdsII), hardware description language (.verilog) and milkyway library format (.mw) which will provide different level of abstractions to the cell-based EDA design tools. Steps 2- 6 will be repeated for N number of cells in the library. Tool(s) N/A Mentor Graphics DAIC Mentor Graphics DAIC, NANGATE layout optimizer Mentor Graphics Calibre Cadence Encounter Library Characterizer Mentor Graphics DAIC, Synopsys Milkyway Environment N/A Task 2: Circuits and Blocks Design for Standard Cell Library Validation The aim of this task is to qualify the designed library through silicon validating the designed standard cell library for functionality, timing and power consumption and design compliance with the commercial EDA tool. No 1 2 Sub-Tasks Three (3) digital blocks of different sizes and functions will be synthesized, place and routed to exercise all designed cells in the library and ensure that the library is at the industry-usage ready quality. Designs will be designed and signed-off with the commercial tools. New test-bed platform will be designed to test this digital blocks. Six (6) chips containing special test structures will be designed making use of the designed cells to validate the library characterized value. New circuit structures will be designed to address resource issues in test-chip design. Tool(s) Synopsys Design Compiler and Synopsys IC Compiler, Synopsys PrimeTime, Mentor Graphics Caliber, FPGA platform Mentor Caliber Graphics DA-IC, Task 3: Investigation on the Impact of nanometer process variation to standard cell library performance The aim of this investigation is to comprehend the impact of nanometer process variation to standard cell library robustness and performance. The investigation will be done at the simulation-level and at the CREST R&D GRANT APPLICATION FORM REV3.0 process-level. In the process-level investigation, process variations are deliberately introduced during fabrications. Results from simulation-level and process-level will be correlated. No 1 2 Sub-Tasks Simulation-level investigation: i. Standard cell circuits will be investigated using SPICE (or equivalent) circuit simulation and a Monte Carlo technique – a series of circuit simulations will be carried out by varying certain parameters which are related to the investigated variation sources in the devices. ii. This set of simulations will give the detailed distributions of any circuit parameters of interest, with the accuracy of the distributions dependent on the number of repeat simulations of a given nominal circuit, and the size of the device ensemble. iii. The results will then be correlated with the data from process level investigation. Process-level investigation: i. The critical dimensions of specific layers such as polysilicon will be varied by introducing variations at the lithography level. ii. The transistor performance will be further varied by tweaking the process steps such as thresold implants using controlled variations. iii. The standard cells and the test circuits implemented using these cells will be characterized after fabrication to evaluate the effect on the standard cells designed and correlate the data with the simulation-level investigation. Tool(s) Mentor Graphics Spice Simulator Fabrication facilities Task 4: Test-Chip Fabrication, Testing and Measurement The aim of this task is to fabricate the test chips with and without deliberate parameter variation. Upon receiving the test-chips, the chips will be tested and measurement on the wafer-level and package-level will be conducted. No 1 2 Sub-Tasks Test-chips will be sent for fabrication at Silterra Kulim Hi-Tech Park. Upon receiving the test-chips, special test structure chips will be measured at the wafer-level targeted using Silterra testing facility. 3 Digital block chips will be packaged and tested at UPM Serdang. Equipment(s) Silterra fabrication facility Oscilloscope, signal generator, probe station, parametric analyzer, LCR meter Signal generator, Logic analyzer, FPGA platform (d) Research Project Plan (Please refer CREST R&D Grant Guideline on Developing Project Plan) 1. Research project scope This project is a joint effort between Universiti Putra Malaysia and Silterra Sdn. Bhd. to develop standard cell library for the newly developed low-power process of 90nm deep-submicron Silterra CMOS technology. The scope of the research covers the investigation of design and validation techniques for energy-efficient standard cells and the assessment of the impact of nanometer process variations to the standard cell library. It includes iterative processes of design, verification, fabrication, measurement, characterization of energyefficient standard cells, and followed by library compilation and designing test-chips for the validation of the standard cells for SoC/ASIC applications that demand energy-efficient solutions. The project involves three full-time graduate researchers who will be assisted by three Silterra engineers (equivalent to one full time engineer) and co-supervised by UPM and Silterra personnels. In addition to the existing facilities available in Silterra and UPM such as the IC design tools, measurement and fabrication CREST R&D GRANT APPLICATION FORM REV3.0 facilities will be utilized and additional necessary tools/equipments need to be purchased to ensure the completion of this project. The progress of the project will be monitored according to the project plan through meetings and reports. The results of the research will include low-power combinational and sequential logic circuits, low-power IPs, physical designs and quantifying the effect of nanometer process variation on the standard cell performance. The final deliverable of this project is an energy-efficient standard cell library that can readily be used by customers. In addition, research outputs will be published in journals. 2. Flow Chart of Research Activities (Please enclose in the Appendix as appropriate) Please find in the Appendix A. 3. Gantt Chart of Research Activities including Milestones and Dates (Please enclose in the Appendix as appropriate) Please find in the Appendix B. 4. Human Resources Plan (Team composition, roles and responsibilities, hiring, etc.) Name Dr. Fakhrul Zaman Rokhani Roles Project Leader, Principal Investigator Dr. Roslina Mohd. Sidek Principal Investigator Dr. Shaiful Jahari Hashim Principal Investigator Dr. Noor Ain Kamsani Principal Investigator Park Sang-Hyun Principal Investigator Dr. Subhash Chan Chee-Kean, Nur Liyana Jasni 3 MSc. Students Advisor from industry Researcher Hiring Plan: Training Plan: Researcher Responsibilities Library design and library validation using digital block approach Circuit and Layout optimization, library validation using TEG circuits approach Design environment and design automation Process Variation Investigation (simulation-level) Process Variation Investigation (process-level) Fabrication side Cell characterization, layout optimization Standard cell library development, standard cell library validation and process variation investigation Students will be hired as researcher in the month of May-June as this period coincides with the semester ends New hire research students need to undergo basic training on design environment, design tool, Unix and scripting. In addition, research students will be exposed to advanced VLSI and mixed signal design through courses offered at UPM. Note: Silterra proposes to put equivalent of one full-time engineer by deploying 3-4 engineers partially on this project for contributing towards the designs of the cells along with UPM. In addition, Silterra will also contribute resources towards fabrication of the cells through standard Multi Project Wafer (MPW) fabrication. 5. Risk Plan Factors that may cause risk to the project, their impact and the proposed actions against them are summarized as the following: CREST R&D GRANT APPLICATION FORM REV3.0 Risk Rank 1 2 Risk Statement Unavailability or insufficiency of design tools Changes in device models due to modification in fabrication process will delay or prolong the standard cell development process Risk Impact High Medium 3 Unavailability for measurement facilities Medium 4 Incompatibility of design tools Medium 5 Inability to hire graduate researchers Low 6 The distance between Silterra and UPM may cause communication and logistic problem Low Risk Response Justify the need for additional fund from Silterra or UPM Continuous changes in fabrication process should be avoided and finalized device model should be made available prior to standard cell design activity Prepare the test-chip design to suit other measurement facilities elsewhere. External facility will incur cost. Test for tool compatibility at early project stage and prepare for tool interface development if necessary Hire students or interns currently in faculty. The availability of engineers for this project minimizes the risk in human resource. Prepare video conferencing facility (e) Expected output: 1. Number of Malaysian post graduate students to be produced (Please specify Master or / and PhD) Masters (MSc) students: 3 2. Number of potential intellectual property (patent / open source) to be filed Product 1: Silicon Validated Energy Efficient Standard Cell Library on Silterra 90nm LP process 3. Number of expected publications (refereed conference, journal) Conference 1 and Journal 1: On the cross-layer optimization of the library architecture, circuit, layout and process approach for energy-efficient standard cell library Conference 2 and Journal 2: On the new circuit architecture addressing resource constraints and pins for multi-input cells for test-chip design in validating pre-silicon characterized standard cell library data Conference 3 and Journal 3: On the impact of process variation to the standard cell library performance and new developed model. (f) Expected benefits: 1. How does this research benefits participating companies? This project explores the possibility of local development of standard cell libraries. Once the development is demonstrated successfully through design and implementation of standard cells and their use in ASICs (small size with a limited purpose of demonstration), it will bring in huge benefits in terms of serving these very essential requirements at lower cost and faster turn-around time. This further opens up possibility of bringing in new design service companies. For any typical high-end process option at Silterra, it can CREST R&D GRANT APPLICATION FORM REV3.0 contribute upwards of US$50m towards its annual revenue. Another major benefit is expected in terms of faster redress of customer queries related to these libraries and opens up door for creating libraries for specific application segments such as low power or high performance as needed by the customers. 2. How does this research benefits other companies within the industry? Other than Silterra which is a silicon foundry, the ASIC design houses will also benefit, particularly the local ones as this project has potential for reducing the cost of entering the ASIC Design market at reduced cost. 3. How does this research increase competency of participating universities? The research increases the university competency in the following areas: 1. Academic Competency This project provides a platform for university lecturers and graduate researchers to engage in IC design for mass production which demands consideration beyond the classroom requirements such as to address process variation and robustness. It enhances the quality of teaching and supervision as well as the skill of postgraduates in solving real problems. 2. Research Competency The project will improve the competency in developing standard cell library that meets the industrial/commercial standard. The research outputs will be validated from simulation, to silicon implementation and up to packaging which will enhance the research output for quality publication and adding commercial value to the research product. 3. Part of Semiconductor Eco-System Becoming as part of the semiconductor eco-system, the university has the opportunity for future collaboration, consultancy and business development. 4. What are the shared benefits of this research to the participating companies and universities? Typically the Standard Cell library vendors market their designs to the companies that show a good potential for generation of large revenues through their big volume products. Through this collaboration, energyefficient 90nm standard cell library is generated for Silterra to market it to their potential customers and strengthen UPM capability to stand up as a fabless design house. These locally owned libraries can benefit ASIC research in academia by providing useful resources to innovate new products or applications in advancing humanity towards a sustainable future. D ACCESS TO EQUIPMENT AND MATERIAL (ACCESSIBILITY TO THE UNIVERSITY AND INDUSTRY) Equipment Location CREST R&D GRANT APPLICATION FORM REV3.0 E 1. Probe-station Silterra, Kulim High Tech Park 2. Semiconductor Parametric Analyzer Silterra, Kulim High Tech Park 3. High Precision LCR (inductance, Capacitance and Resistance) meters Silterra, Kulim High Tech Park 4. Pulse/Signal Generators Silterra, Kulim High Tech Park 5. Oscilloscope Silterra, Kulim High Tech Park 6. Cadence Encounter Library Characterizer Silterra, Kulim High Tech Park 7. Pattern Generator Universiti Putra Malaysia, Serdang 8. Computer Servers Universiti Putra Malaysia, Serdang 9. Mentor Graphics Analog Design Tool Universiti Putra Malaysia, Serdang 10. Milkyway library Converter Universiti Putra Malaysia, Serdang 11. FPGA platform Universiti Putra Malaysia, Serdang BUDGET R&D Application Template CREST RD Project Application Form Edited Rev. 3.0.xlsx Note: THE INDUSTRY IS ENCOURAGED TO CONTRIBUTE FOR THE RESEARCH. CONTRIBUTIONS IN THE FORM OF FINANCIAL FUNDS, EXPERTISE, EQUIPMENT, SERVICES ETC. NEED TO BE TRANSLATED IN VALUE OF FINANCIAL CONTRIBUTION Notes for H (iv) Procurement of equipment, research material, etc.: 1. Quotation for equipment and software shall be provided. CREST R&D GRANT APPLICATION FORM REV3.0 2. Equipment and software descriptions and the potential users shall be provided. 3. Please specify if the equipment is dedicated to a specific industry. F Declaration by applicant / Akuan Pemohon (Please tick ( √ )): / (Sila tanda ( √ )): I hereby declare that: √ 1. All information stated here are accurate, CREST has right to reject or to cancel the offer without prior notice if there is any inaccurate information given. 2. Application of this CREST R&D grant is also presented for the other reasearch grant/s (grant’s name and total amount) Date : 08/03/2013 Applicant’s Signature : Note: APPLICATIONS SUBMITTED WILL BE TREATED IN FULL CONFIDENCE. THE AWARD DECISION IS FINAL. CHECKLIST FOR CREST RESEARCH APPLICATION FORM 1) One (1) set of hardcopy CREST Research Application Form √ 2) One (1) set of softcopy CREST Research Application Form √ 3) Letter of Support signed by Company’s top management √ 4) Letter of Support signed by University’s head of department / dean √ √ CREST R&D GRANT APPLICATION FORM REV3.0 5) Company’s Profile 6) University’s Profile √ 7) Minimum two (2) quotations for procurement of equipment. √ 8) Minimum two (2) quotations for procurement of software. √ 9) Minimum two (2) quotations for procurement of research materials. 10) Minimum one (1) quotations for rental of equipment. 11) Minimum one (1) quotations for rental of software. 12) Minimum three (3) quotations for professional services. √ 13) Curriculum Vitae for every researchers. √ 14) Research project plan √ 15) Salary/fee rate declaration (as used in industrial contribution) √