Download CIN::APSE (EU) - Cinch Connectors

CIN :: APSE
CIN::APSE
®
Contact Configurations
It takes more than an ordinary connector to support advanced performance interconnect applications. It takes
CIN::APSE, a proven solderless Z-axis connector technology that offers exceptional mechanical and electrical
performance at signals well above 30 GHz.
In addition to standard configurations, CIN::APSE can be custom configured to meet
your exact footprint and mated heights.
RoHS Compliant.
• Quick-turn machined prototypes
• Heights ranging from .020" - 1.5" (0.5 - 38 mm)
• Multiple insulator materials
• Custom compression system design
CIN::APSE is a unique, Z-Axis compression interconnect which provides superior
mechanical and electrical performance. The contact construction consists of randomly
wound gold plated molybdenum wire, formed into a cylindrical shape (Figure 1).
Standard contact diameters are 0.020" (0.50 mm) and 0.040" (1.00 mm).
The basic CIN::APSE contact configuration consists of a contact installed into a
customised plastic insulator with the patented Cinch hourglass hole design (Figure 2).
Once in place, the contact extends on both sides of the insulator.
Custom made to your specifications, CIN::APSE utilises a multi-point contact that can
handle signals well above 30 GHz, while offering a superior combination of small size,
low inductance and exceptional resistance to shock, vibration and thermal cycling.
CIN::APSE can be used in almost any application where you need to connect two
parallel surfaces.
Figure 1.
CIN::APSE is a easily installed in two basic steps, without soldering. First, using
alignment features, the CIN::APSE interconnect is positioned between two components
with matching connection footprints. Next, the two components are compressed and
fastened together (Figure 3).
Low Compression Force, Low Contact Resistance
The CIN::APSE contact offers one of the best force / deflection ratios in the industry.
An average compression force of only 2.5 ounces (71 N) will yield a typical contact
resistance of less than 20 mΩ. This means high I / O count applications can achieve
excellent electrical performance with only minimal Z-Axis compression force (Figure 4).
Your Need
CIN::APSE Solution
Solderless
CIN::APSE provides the advantages of a solderless connection
Easy repairs and upgrades in plant or in the field
No risk of damaging expensive boards or components
Allows for large mismatches in CTE between substrates
Signal Speed
and Integrity
CIN::APSE can easily handle signal speeds over 20+ GHz
Low inductance of <0.5 nH
Low crosstalk and EMI
Low signal loss
Low circuit resistance of 15 - 20 mΩ
High Density
High I/O
Low Profile
Light Weight
Low Mass
CIN::APSE is the leader in high I / O and miniaturization
I/O counts in production exceeding 5,000
Standard pitch as small as 1 mm
Mated height as low as .020" (0.5 mm) or up to 1.5" (38 mm)
Contacts are 75% - 85% air when fully compressed
Reliability
7 to 11 points of contact per contact
Mechanical wiping action
Extremely stable over time and temperature
High contact normal force
Extreme
Environments
Temperature range -200º C to 200º C
Low mass contact withstands extreme shock and vibration
Figure 2.
Figure 3.
Figure 4.
2. Plunger - Contact
CIN::APSE® Applications
Digital devices - 20+ GHz Signal Speeds
Chip - PCB (LGA)
PCB - PCB (Interposers)
Flex Circuit - PCB / Flex Circuit (Interposers)
LCD - PCB / Flex Circuit (Interconnect)
‘D’ Connectors - CIN::APSE (Solutions)
• Hermetic sealing
• IP rated
• EMI Shielding
Quick, Solderless Installation
1. Contact only
Versatile Configurations
If you have an interconnect challenge, and need to overcome the restrictions of ordinary connector devices, CIN::APSE
can provide the versatile and reliable interconnect solution you need.
Innovative Compression-Mount Technology
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1. Contact only
2. Plunger - Contact
3. Plunger - Contact - Plunger
4. Contact - Spacer - Contact
3. Plunger - Contact - Plunger
4. Contact - Spacer - Contact
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CIN :: APSE
F E AT U R E D D E V E L O P M E N T S
0.8 mm CIN::APSE
360º CIN::APSE Termination
®
®
Solutions for Small Pitch Applications
The proven performance of CIN::APSE technology in a reduced size ideal for high density applications that require
pitches down to 0.8 mm.
Extremely high density interconnects are needed for many components and applications.
The unique method of connector construction enables the designer to
vary the angle of termination to aid routing direction of flexible circuits and
PCBs within the system.
90º CIN::APSE
• Fibre optic transceivers
• Medical electronics
• Sensors
• High density modules
®
The advantage of the low profile that CIN::APSE technology provides the ability to rack
daughter boards closer together within a system design.
Solutions for Low Voltage Drop Applications
The introduction of the Ø0.8 mm contact provides a lower line resistance whilst
remaining on the standard 1.0 mm CIN::APSE pitch.
CIN::APSE technology provides the ability to reduce interconnection voltage drops
within a power sensitive system.
Detail of
CIN::APSE Contact
• Electronic control units
• Remote power sources
• Weight and Size reduction of power supplies
CIN::APSE flexible termination method allows the compression technology to be incorporated within a traditional
connector frame to provide a high performing Surface Mount solution.
• High reliability
• High density
• Low mating force
• Low resistance & inductance
• Solderless
• Custom configured to meet your interface pitch requirements
• Quick turn around machined prototypes
Reduced Size
CIN::APSE Contact
on 0.8 mm pitch
• Single or multiple row configuration
• Dual sided PCB interconnection
• High density
• Low profile saving space
• Compression technology
• Allows for tolerance and CTE mismatch
Dual Technology
Key CIN::APSE Features for Applications
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CIN::APSE technology provides a method of termination from
0 and 360 degrees to solve the most complex of routing in ECU designs.
Cinch contact technology withstands extreme shock & vibration, and is extremely stable over time and temperature to
provide a viable alternative to the press fit connector technology for demanding environments.
Standard Size
CIN::APSE Contact
on 1.0 mm pitch
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CIN :: APSE
Military & Aerospace
Radar & Surveillance
Transport
CIN::APSE provides the ability to create innovative connector solutions to meet a new generation
of interconnect challenges.
CIN::APSE multipoint compression contact technology provides ideal connector solutions for
Advanced Transmitter and Receiver modules on air, land and sea radar platforms. Systems
include CEMS / AESA, UAV and light-weight, compact digital surveillance systems.
CIN::APSE provides the unique ability to make custom interconnector solutions available for electronic displays and
sensors where crucial reliability is required within demanding environments.
CIN::APSE advanced interconnect solutions include high performance Gyroscopes for in-flight control
and stabilisation systems. This combined with the next generation of CPU packages connected through
CIN::APSE LGA’s and CIN::APSE Interposers in Digital Instrumentation & Avionics systems.
CIN::APSE direct connections provide a novel yet reliable method of signal routing for Commercial in-flight
entertainment visual display units, Guidance, Tracking & Seeker radars and Counter measure
protection systems.
Computer
CIN::APSE LGA is the connector of choice for the most demanding CPU / MCM and ASIC-to-board applications in leading:
Satellite & Space
Telecommunications
CIN::APSE LGAs are lightweight, high contact density and have excellent electrical & mechanical signal properties
providing exceptional performance for Multipurpose Geostationary Communication Platforms.
CIN::APSE PCB Interposers enable simple routing options for complex multilayer PCB and flex circuits within
confined spaces within electronic control units.
Advanced telecommunications for next generation mobile networks and internet access
through the use of CIN::APSE reliability and high speed component technology.
• High-end servers
• Routers
• High speed switches
• Main frames
CIN::APSE multi-configuration custom connectors provides a new dimension for planet and deep space
exploration together with the addition of environmental seals for hostile planet environments.
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