Survey
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
RELIABILITY TEST REPORT TC7SH04FU CMOS Digital Integrated Circuit (Package:TOSHIBA SSOP5-P-0.65A (USV)) August ,2008 Discrete Semiconductor Quality & Reliability Engineering Department Semiconductor Company Toshiba Corporation Rev. 001 - 001 1.Reliability test condition 1.1 Thermal tests Test items Referred standard (JEITA) Heat resistance (Reflow) EIAJ ED-4701 Heat resistance (Flow) EIAJ ED-4701 Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s Peak : 260 deg.C Immersion time : 10 s Heat resistance (Iron) EIAJ ED-4701 Temperature of the iron tip : 350 deg.C Time : 3 s Temperature cycling EIAJ ED-4701 - 65 deg.C(30 min) to 150 deg.C(30 min) Test conditions Note. 4 times Once Once 100 cycles 1.2 Mechanical tests Test items Referred standard (JEITA) Vibration EIAJ ED-4701 100 to 2000 to 100 Hz , 200 m/s2 4 min each in 3 directions Shock EIAJ ED-4701 15000 m/s2 , 0.5 ms 3 times each in 4 directions Solderability EIAJ ED-4701 Solder bath : Sn-Ag-Cu Solder bath : Sn-Pb - - Test conditions 245 deg.C , 5 s ,once (using Flux) 230 deg.C , 5 s ,once (using Flux) - Note. 95% or more - 1.3 Life tests Test items Referred standard (JEITA) Steady state operation EIAJ ED-4701 Ta = 125 deg.C, VCC = 5.5V 1000 h High temp. storage EIAJ ED-4701 Ta = 150 deg.C 1000 h High temp. high humidity storage EIAJ ED-4701 Ta = 85 deg.C, RH = 85% 1000 h High temp. high humidity bias EIAJ ED-4701 Ta = 85 deg.C, RH = 85%, VCC = 5.5V 1000 h - - Test conditions - Test times - 1.4 Other Test items Pressure cooker test Referred standard (JEITA) EIAJ ED-4701 Test conditions Ta = 121 deg.C(203kPa)(Unsaturated) Test times 96h The reliability tests above are conducted by the following product families: design/ process family, and package family. For the Temperature cycling test, the High temperature high humidity storage test, the High temperature high humidity bias test, and the Pressure cooker test, humidity and heat stress are applied as pretreatment. In addition, the mounting conditions and the remarks on mounting are specified individually. Thus, please refer to the mounting condition materials and make sure. TC7SH04FU Rev. 001 - 001 2.Test results 2.1 Thermal tests 2.2 Mechanical tests Sample size Failure Heat resistance (Reflow) 32 0/32 Heat resistance (Flow) 32 Heat resistance (Iron) Temperature cycling Test items Sample size Failure Vibration 11 0/11 0/32 Shock 11 0/11 32 0/32 Solderability 11 0/11 50 0/50 - - - Test items 2.3 Life tests Test items Sample size Steady state operation 30 High temp. storage 30 High temp. high humidity storage 30 High temp. high humidity bias 30 - - Failure 168h 500h 1000h - 0/30 0/30 0/30 - 168h 500h 1000h - 0/30 0/30 0/30 - 168h 500h 1000h - 0/30 0/30 0/30 - 168h 500h 1000h - 0/30 0/30 0/30 - - - - - - - - - 2.4 Other Test item Sample size Pressure cooker test 20 Failure 24h 48h 96h 0/20 0/20 0/20 TC7SH04FU Rev. 001 - 001 Estimated Failure Rate Type of product Estimated failure rate 20 Fit or less TC7SH04FU Above estimated value is determined with the standard operation under the general environment:* *The general environment here means the conditions of no application of surge and so on. Ta ≦ 40 degree C and Discrete Semiconductor Quality & Reliability Engineering Department Semiconductor Company Toshiba Corporation Rev. 001 - 001 Electrostatic Discharge Test 1.Type of product TC7SH04FU 2.Test condition Condition A C=200pF, R=0, application times:1(Reference Test) [ Referred standard: JEITA EIAJ ED-4701 ] Condition B C=100pF, R=1.5kohm, application times:3 [ Referred standard: JEITA EIAJ ED-4701 ] 3.Test result Condition A Sample Quantity +/-200V 10 pcs 0 / 10 Sample Quantity +/-2000V 10 pcs 0 / 10 Condition B Discrete Semiconductor Quality & Reliability Engineering Department Semiconductor Company Toshiba Corporation Rev. 001 - 001