Download RELIABILITY TEST REPORT

RELIABILITY TEST REPORT
TC7SH04FU
CMOS Digital Integrated Circuit
(Package:TOSHIBA SSOP5-P-0.65A (USV))
August ,2008
Discrete Semiconductor Quality & Reliability
Engineering Department
Semiconductor Company
Toshiba Corporation
Rev. 001 - 001
1.Reliability test condition
1.1 Thermal tests
Test items
Referred standard
(JEITA)
Heat resistance
(Reflow)
EIAJ ED-4701
Heat resistance
(Flow)
EIAJ ED-4701
Peak : 260 deg.C(a momet)
Reflow zone : 230 deg.C 30 to 50 s
Preheat : 180 to 190 deg.C , 60 to 120 s
Peak : 260 deg.C
Immersion time : 10 s
Heat resistance
(Iron)
EIAJ ED-4701
Temperature of the iron tip : 350 deg.C
Time : 3 s
Temperature
cycling
EIAJ ED-4701
- 65 deg.C(30 min) to 150 deg.C(30 min)
Test conditions
Note.
4 times
Once
Once
100 cycles
1.2 Mechanical tests
Test items
Referred standard
(JEITA)
Vibration
EIAJ ED-4701
100 to 2000 to 100 Hz , 200 m/s2 4 min each in 3 directions
Shock
EIAJ ED-4701
15000 m/s2 , 0.5 ms 3 times each in 4 directions
Solderability
EIAJ ED-4701
Solder bath : Sn-Ag-Cu
Solder bath : Sn-Pb
-
-
Test conditions
245 deg.C , 5 s ,once (using Flux)
230 deg.C , 5 s ,once (using Flux)
-
Note.
95% or more
-
1.3 Life tests
Test items
Referred standard
(JEITA)
Steady state
operation
EIAJ ED-4701
Ta = 125 deg.C, VCC = 5.5V
1000 h
High temp.
storage
EIAJ ED-4701
Ta = 150 deg.C
1000 h
High temp. high
humidity storage
EIAJ ED-4701
Ta = 85 deg.C, RH = 85%
1000 h
High temp. high
humidity bias
EIAJ ED-4701
Ta = 85 deg.C, RH = 85%, VCC = 5.5V
1000 h
-
-
Test conditions
-
Test times
-
1.4 Other
Test items
Pressure cooker
test
Referred standard
(JEITA)
EIAJ ED-4701
Test conditions
Ta = 121 deg.C(203kPa)(Unsaturated)
Test times
96h
The reliability tests above are conducted by the following product families: design/ process family, and package family. For the Temperature cycling
test, the High temperature high humidity storage test, the High temperature high humidity bias test, and the Pressure cooker test, humidity and
heat stress are applied as pretreatment. In addition, the mounting conditions and the remarks on mounting are specified individually.
Thus, please refer to the mounting condition materials and make sure.
TC7SH04FU
Rev. 001 - 001
2.Test results
2.1 Thermal tests
2.2 Mechanical tests
Sample
size
Failure
Heat resistance
(Reflow)
32
0/32
Heat resistance
(Flow)
32
Heat resistance
(Iron)
Temperature
cycling
Test items
Sample
size
Failure
Vibration
11
0/11
0/32
Shock
11
0/11
32
0/32
Solderability
11
0/11
50
0/50
-
-
-
Test items
2.3 Life tests
Test items
Sample
size
Steady state
operation
30
High temp.
storage
30
High temp. high
humidity storage
30
High temp. high
humidity bias
30
-
-
Failure
168h
500h
1000h
-
0/30
0/30
0/30
-
168h
500h
1000h
-
0/30
0/30
0/30
-
168h
500h
1000h
-
0/30
0/30
0/30
-
168h
500h
1000h
-
0/30
0/30
0/30
-
-
-
-
-
-
-
-
-
2.4 Other
Test item
Sample
size
Pressure cooker
test
20
Failure
24h
48h
96h
0/20
0/20
0/20
TC7SH04FU
Rev. 001 - 001
Estimated Failure Rate
Type of product
Estimated failure rate
20 Fit or less
TC7SH04FU
Above estimated value is determined with the standard operation under the general
environment:*
*The general environment here means the conditions of
no application of surge and so on.
Ta ≦ 40 degree C and
Discrete Semiconductor Quality & Reliability
Engineering Department
Semiconductor Company
Toshiba Corporation
Rev. 001 - 001
Electrostatic Discharge Test
1.Type of product
TC7SH04FU
2.Test condition
Condition A
C=200pF, R=0, application times:1(Reference Test)
[ Referred standard: JEITA EIAJ ED-4701 ]
Condition B
C=100pF, R=1.5kohm, application times:3
[ Referred standard: JEITA EIAJ ED-4701 ]
3.Test result
Condition A
Sample Quantity
+/-200V
10 pcs
0 / 10
Sample Quantity
+/-2000V
10 pcs
0 / 10
Condition B
Discrete Semiconductor Quality & Reliability
Engineering Department
Semiconductor Company
Toshiba Corporation
Rev. 001 - 001