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Common source inductance introduced self-turn-on in MOSFET turn-off transient Wen Zhang, Zheyu Zhang, Fred Wang, Daniel Costinett, Leon Tolbert, Benjamin Blalock The University of Tennessee, Knoxville INTRODUCTION • Fast switching semiconductor presents unwanted oscillation during switching transient. • While many unwanted oscillations have been reported in literature, an abnormal continuous ringing is observed when testing a Si CoolMOS (IXKR47N60C5) in double pulse test. • Increasing ringing magnitude in drain-source voltage and huge spikes in gate-source voltage are the key features. • In the worst case, the ringing is not damped and keeps going until power supply is killed. In other words, the control of the switch is lost. • Adverse effect of common source inductance in fast switching is revealed and it is recommended to minimize it in circuit and package design. Fig. 1. Experimental waveforms showing continuous oscillation during turn-off transient: 200 V dc bus voltage, 30 A load current and 4.7 Ω gate resistance. MODELING AND ANALYSIS Experimental High 𝑑𝑣/𝑑𝑡 makes 𝐶𝑜𝑠𝑠 take over all the load current and MOSFET channel is turned off Simulation Model Oscillation in power loop applies a voltage bias to gate loop through common source inductance Gate source capacitance is charged beyond 𝑉𝑡ℎ and the MOSFET channel is turned on again in turn-off transient CONCLUSION • Fast switching worsens the power loop and gate loop parasitics interaction and creates switching failure. • Traditional TO-247 package with 3 nH common source inductance can render fast switching impossible. • Circuit and package designers are advised to minimize common source inductance as much as possible and use Kelvin source connection whenever possible.