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Contact: John G Peck Ltd. - jgpl.com CUSTOM MODULES (Commercial / Moisture Resistant / Hermetic) Capabilities: Customers looking for application specific custom power modules benefit from Powerex’s years of experience in chip manufacturing and design / engineering. Powerex custom power modules employ performance proven features. Soldered-down and wire bonding fabrication and compression bonded encapsulation (CBE) of SCR / Diode elements offer increased switching speeds, lower losses, more efficient cooling and higher power handling capabilities. Reliability / Qualification Testing: Reliability and qualification testing can be performed in accordance to military specifications, including Group A, B and C and specific customer requirements. Features: Different Circuit Configurations (i.e. Common Emitter, Chopper) Different Termination Styles (i.e. Thicker Bus Bars, D-sub Connectors, Press On Pins, etc.) Extended Temperature Range, -55°C to 200°C Hermetic Modules High Voltage Isolation Integrated Heatsinks – Both Air and Liquid Cooled by Eliminating the Baseplate Larger Free-wheel Diodes Low Module Weight Moisture Resistance Over-current Shutdown Package Height, Width and Length Temperature and Current Sense • • Substrates: Alumina Aluminum Nitride BeO IMS • • • • • • • • Die Technology: Diode FR Diode GTO HVIGBT IGBT • • • • • • Packages: Custom Development for Both Plastic and Hermetic Packages Picture Frame Standard IGBT Cases • • • • • •MOSFET •SCR • SiC Diode • SiC MOSFET • • • For more information: VOLTAGE: 30V TO 15,000V CURRENT: 50A TO 1600A visit: http://www.pwrx.com/summary/custom-power-modules.aspx email: [email protected] phone: 724-925-7272, Option 3 (Applications Engineering Assistance) DC-DC Converters Gate Drivers & IPM Interface Custom Modules IGBT Assemblies Assemblies Fast Recovery Diode Modules Thyristor & Diode Modules Discrete Rectifiers Discrete Thyristors DIPIPM IPMs MOSFET Modules Hybrid & SiC Modules IGBTs