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Transcript
Contact: John G Peck Ltd. - jgpl.com
CUSTOM MODULES (Commercial / Moisture Resistant / Hermetic)
Capabilities:
Customers looking for application specific custom power modules benefit from Powerex’s
years of experience in chip manufacturing and design / engineering. Powerex custom power
modules employ performance proven features. Soldered-down and wire bonding fabrication and
compression bonded encapsulation (CBE) of SCR / Diode elements offer increased switching
speeds, lower losses, more efficient cooling and higher power handling capabilities.
Reliability / Qualification Testing:
Reliability and qualification testing can be performed in accordance to military specifications,
including Group A, B and C and specific customer requirements.
Features:
Different Circuit Configurations
(i.e. Common Emitter, Chopper)
Different Termination Styles
(i.e. Thicker Bus Bars, D-sub
Connectors, Press On Pins, etc.)
Extended Temperature Range,
-55°C to 200°C
Hermetic Modules
High Voltage Isolation
Integrated Heatsinks – Both Air
and Liquid Cooled by Eliminating
the Baseplate
Larger Free-wheel Diodes
Low Module Weight
Moisture Resistance
Over-current Shutdown
Package Height, Width and Length
Temperature and Current Sense
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Substrates:
Alumina
Aluminum Nitride
BeO
IMS
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Die Technology:
Diode
FR Diode
GTO
HVIGBT
IGBT
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Packages:
Custom Development for Both
Plastic and Hermetic Packages
Picture Frame
Standard IGBT Cases
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•MOSFET
•SCR
• SiC Diode
• SiC MOSFET
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For more information:
VOLTAGE: 30V TO 15,000V
CURRENT: 50A TO 1600A
visit: http://www.pwrx.com/summary/custom-power-modules.aspx
email: [email protected]
phone: 724-925-7272, Option 3 (Applications Engineering Assistance)
DC-DC
Converters
Gate Drivers
& IPM
Interface
Custom
Modules
IGBT
Assemblies
Assemblies
Fast Recovery
Diode Modules
Thyristor &
Diode
Modules
Discrete
Rectifiers
Discrete
Thyristors
DIPIPM
IPMs
MOSFET
Modules
Hybrid
& SiC
Modules
IGBTs